EP2AGX45DF29C6N - Arria II GX FPGA 45K LE 780-FBGA | Intel
MPN： EP2AGX45DF29C6N ✗ 停產EP2AGX45DF29C6N 概覽
What is an FPGA? A Field Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, memory blocks, and DSP slices. FPGAs occupy a tier above CPLDs in complexity and below ASICs in non-recurring engineering cost, allowing designers to implement custom digital logic, signal processing pipelines, and high-speed serial protocols after fabrication. Arria II GX sits in Intel's mid-range FPGA family, between the lower-cost Cyclone series and the high-end Stratix series, balancing logic density, transceiver performance, and power consumption.
Key features of the EP2AGX45DF29C6N include 1,805 LABs (logic array blocks), 3,517,440 bits of embedded memory, and 42959 (presumed adaptive logic modules / DSP-related count as listed in the datasheet). The integrated transceivers support protocols such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and XAUI. The device operates from a 0.9V core supply with multiple I/O voltage standards supported.
The architecture combines an 8-input adaptive logic module (ALM) fabric with per-channel transceiver PLLs and dedicated PHY hard IP. This allows designers to amortize the silicon area of common interfaces rather than implementing them in soft logic, reducing power and improving timing closure on multi-gigabit links.
Typical applications include wireless baseband processing, broadcast video equipment, military radar, and high-speed serial protocol bridging. Designers select Arria II GX when they need proven 6.375 Gbps transceivers with mid-range logic density at lower power than Stratix IV.
When designing with this FPGA, plan power sequencing for the 0.9V core, PLL supplies, and transceiver supplies independently. The 780-FBGA package requires high-layer-count PCB stack-ups with microvia technology for breakout; signal-integrity-aware layout is essential for the transceiver channels.
This page consolidates distributor pricing, drop-in FPGA variants, and practical PCB design guidance synthesized from the Intel Arria II GX device handbook — information not aggregated on any single distributor product page.
直接替換替代品，適用於 EP2AGX45DF29C6N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX45DF29C6N （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
EP2AGX45DF29C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29C6G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29C5G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29C6N 最大額定值與電氣特性
| Device Family | Arria II GX |
| Logic Elements | 45,000 |
| Number of LABs | 1,805 |
| Embedded Memory Bits | 3,517,440 bits |
| User I/O Count | 364 |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| 封裝 | 780-FBGA (DF29), 29 mm body |
| 工作溫度 | 0C to +85C (commercial) |
| Speed Grade | C6 |
| 安裝類型 | Surface Mount (BGA) |
| RoHS 狀態 | Compliant |
| Pb-Free / Lead-Free | Yes |
EP2AGX45DF29C6N 780-fbga (df29), 29 mm body 腳位配置指南
EP2AGX45DF29C6N（780-fbga (df29), 29 mm body 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX45DF29C6N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX45DF29C6N 適用於 6 應用s: Wireless Baseband Processing, Broadcast Video Processing, High-Speed Serial Protocol Bridging, Military Radar Signal Processing, Test and Measurement Equipment, Industrial Imaging and Machine Vision.
Wireless Baseband Processing
The EP2AGX45DF29C6N's 45,000 logic elements and 6.375 Gbps transceivers make it well-suited for wireless baseband signal processing in 4G LTE small cells and WiMAX base stations. The 3,517,440 embedded memory bits accommodate cyclic-prefix buffers and FFT working memory without external SRAM access. Compared to a DSP + ASSP architecture, the Arria II GX allows algorithmic upgrades in the field — useful as LTE evolved toward LTE-Advanced. The 780-FBGA package supports the high-density board layout required for multi-antenna (MIMO) designs where four transceiver channels feed parallel processing paths.
推薦
Broadcast Video Processing
The EP2AGX45DF29C6N is widely deployed in broadcast video routers, format converters, and SDI/HDMI bridging equipment. Its 6.375 Gbps transceivers handle 3G-SDI and 6G-SDI (2160p30) data rates natively, while the 45,000 logic elements provide capacity for color-space conversion, scaling, and frame-rate adaptation. The 364 user I/Os allow connection to multiple parallel video buses plus external DDR2/DDR3 memory for frame buffers. Broadcast equipment manufacturers value the Arria II GX family because the IP cores (SDI, HDMI, DisplayPort) are mature and certified against broadcast industry standards.
推薦
High-Speed Serial Protocol Bridging
The EP2AGX45DF29C6N is an excellent fit for protocol bridging applications where multiple serial standards must be converted between. Typical deployments include PCIe Gen1/Gen2 to XAUI bridges, Serial RapidIO to Ethernet gateways, and custom backplane protocol converters. The 6.375 Gbps transceivers support all common multi-gigabit protocols, and the FPGA fabric allows custom packet processing, DMA engines, and protocol-aware logic. The 780-FBGA package keeps board area small enough for adapter card form factors while still delivering 364 user I/Os for parallel side-band interfaces.
推薦
Military Radar Signal Processing
Defense and aerospace integrators have long qualified the EP2AGX45DF29C6N for radar front-end preprocessing, beamforming, and I/Q demodulation. The device's combination of mid-range logic density, 6.375 Gbps serial links (useful for digitizer-to-processor backplanes), and 0.9V low-power operation makes it attractive for size, weight, and power-constrained (SWaP) applications. Although Intel has NRND-flagged Arria II GX, many defense programs have long lifecycles and continue to source the part through established authorized channels. The 780-FBGA package supports the ruggedized PCB stack-ups used in Mil/Aero hardware.
推薦
Test and Measurement Equipment
Test equipment manufacturers use the EP2AGX45DF29C6N as the core processing element in protocol analyzers, bit-error-rate testers (BERTs), and logic analyzers. Its 6.375 Gbps transceivers capture and analyze high-speed serial traffic in real time, while the 45,000 logic elements implement pattern generators, error injectors, and protocol decoders. The 780-FBGA package allows integration into benchtop form factors, and the C6 speed grade gives consistent timing margins across production builds. The mature Quartus II design flow (still supported for Arria II) provides reliable synthesis and timing closure.
推薦
Industrial Imaging and Machine Vision
The EP2AGX45DF29C6N enables high-speed industrial cameras, frame grabbers, and machine vision controllers. Its 6.375 Gbps transceivers interface with CoaXPress, Camera Link HS, and 10 Gigabit Ethernet vision standards, while the FPGA fabric performs image preprocessing (white balance, gamma, edge detection) before forwarding frames to a host processor. The 364 user I/Os accommodate multiple parallel image sensors plus GPIO for trigger and strobe signals. Industrial designers value the long-term availability of Arria II GX and the deterministic latency of the FPGA fabric for real-time vision pipelines.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX45DF29C6N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX45DF29C5N | EP2AGX45DF29C4N | EP2AGX45DF29C3N | EP2AGX45DF29C6G | EP2AGX45DF29C5G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (DF29, 29mm) | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same | 780-FBGA (DF29, 29mm) - same |
| Speed Grade | C6 | C5 (faster) | C4 (faster) | C3 (fastest) | C6 (same) | C5 (faster) |
| Logic Elements | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 | 45,000 |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 |
| Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Lead-Free / Green | Yes | Yes | Yes | Yes | Yes (Green suffix) | Yes (Green suffix) |
主要差異化特點
- Faster speed grade option available in identical package (對比EP2AGX45DF29C5N)
- Lead-free / Green compliant variant available (對比EP2AGX45DF29C6G)
- Same silicon, multiple speed bins allow cost/timing trade-off (對比EP2AGX45DF29C3N)
設計說明
The 780-FBGA (DF29, 29 mm body) package requires a high-layer-count PCB (typically 10+ layers) with microvia technology for breakout routing. Use a 1.0 mm or 1.27 mm pitch BGA fanout with staggered or dog-bone via patterns. Pair each transceiver channel with a continuous reference ground plane on the layer immediately beneath the BGA breakout to control impedance and suppress crosstalk between channels. Estimated: a 14-layer stack-up with 0.4 mm laser-drilled microvias is typical for 6.375 Gbps designs in this package.
The Arria II GX EP2AGX45DF29C6N requires independent power rails for VCC (0.9V core), VCC_PLL, VCCPT (programmable technology voltage), and per-bank VCCIO supplies for the I/O banks. Sequence the core voltage before the I/O voltages to avoid latch-up during power-up; many designs use a power management IC (e.g., LTC3612 or TI TPS5430 family) with PG (power-good) feedback to the FPGA's nCONFIG pin. Decoupling: place 0.1 µF X7R ceramic capacitors within 2 mm of every VCC/VCCPT/VCCIO ball, plus bulk decoupling at the voltage regulator outputs. Estimated: total core current at typical utilization is 1.5-3 A depending on clock rate and toggle activity.
The 780-FBGA package has a typical theta_JA in the range of 12-18 C/W with appropriate PCB thermal design (thermal vias under the BGA, inner copper planes). In still air, the EP2AGX45 at full transceiver utilization can dissipate 5-8 W. For forced-air or enclosed chassis designs, attach a heatsink via thermal interface material (TIM) directly to the top of the BGA package; some BGA variants expose a thermal slug for this purpose. Estimated: junction temperature rise of 7-10 C per watt of dissipation with the recommended thermal via array.
Each 6.375 Gbps transceiver channel requires AC-coupling capacitors (typically 100 nF X7R 0402) on the TX serial output lines, placed as close as practical to the FPGA ball. Match the differential trace length within 5 mils (0.127 mm) and maintain 100 ohm differential impedance over the entire channel. Keep the transceiver power supply (VCCT, VCCR) isolated from noisy digital supplies using a ferrite bead or pi-filter network. Reference the Intel Arria II GX Transceiver User Guide for the full channel budget and recommended PCB stack-up.
合規資訊
RoHS compliance per Altera/Intel product documentation. Lead-free per N/G suffix conventions. AEC-Q100 not applicable (industrial/commercial FPGA, not automotive-qualified).
