EP2SGX130GF1508C5N - 132K LE Stratix II GX FPGA | Intel
MPN: EP2SGX130GF1508C5N ✗ اختتامِ زندگیEP2SGX130GF1508C5N جائزہ
Key features include 6,627 Logic Array Blocks (LABs), 734 user I/O pins, embedded multiplier blocks and DSP blocks for high-throughput signal processing, distributed and M512/M4K/M-RAM block memory, and dedicated PLL and clock-management circuitry. The "C5" speed grade denotes a commercial -5 timing closure, while the "N" suffix indicates a lead-free, RoHS-compliant FBGA. The 40 x 40 mm package with 1 mm ball pitch is intended for high-layer-count PCB designs with controlled-impedance routing.
The Stratix II GX architecture uses an ALM (Adaptive Logic Module) approach, allowing each ALM to be configured for either combinational or registered logic with up to 8 inputs, delivering better logic utilization than the older 4-input LUT-based Stratix. The on-chip transceivers support CPRI, OBSAI, Serial RapidIO, PCI Express Gen1, XAUI, CEI-6G, and SFI-5 protocols without external PHYs, making the part well suited for backplane, line-card, and base-station designs.
Typical applications include 10G/40G Ethernet line cards, wireless base-station baseband and radio units, high-speed serial protocol bridging (PCIe, SRIO, XAUI), DSP co-processing for radar and medical imaging, and ASIC prototyping. The device is also used in broadcast video processing and high-end test and measurement equipment where logic density and transceiver bandwidth are simultaneous requirements.
When designing with this device, ensure the PCB stack-up supports 1 mm-pitch BGA breakout with microvia or via-in-pad technology where required, and provide matched-length routing for high-speed serial links. Thermal management must account for the 1508-pin FC-FBGA's junction-to-ambient thermal resistance; a heatsink with thermal interface material is recommended for full transceiver utilization. Quartus II design software (Stratix II GX device support) is required for synthesis, place-and-route, and bitstream generation.
کے لیے ڈراپ اِن متبادل EP2SGX130GF1508C5N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2SGX130GF1508C5N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, RoHS Status, Speed Grade, Family, Logic Array Blocks (LABs).
EP2SGX130GF1508C5
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2SGX130GF1508C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2SGX130GF1508C3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2S130F1508C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2S180F1508C5N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2S130F1508C4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2SGX130GF1508C5N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | Stratix II GX |
| Family | Stratix II GX |
| Logic Elements / Cells | 132540 |
| Logic Array Blocks (LABs) | 6627 |
| Total RAM Bits | 6747840 |
| Number of I/O | 734 |
| Package Type | 1508-BBGA, FCBGA |
| Package Dimensions | 40 x 40 mm, 1 mm pitch |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Internal Frequency | 717 MHz (max) |
| آپریٹنگ درجہ حرارت | 0C to +85C (commercial) |
| Speed Grade | C5 |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
| Lead Free / RoHS | Yes (lead free) |
| Logic Family | CMOS |
EP2SGX130GF1508C5N 40 x 40 mm, 1 mm pitch پن کنفیگریشن گائیڈ
EP2SGX130GF1508C5N (40 x 40 mm, 1 mm pitch پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2SGX130GF1508C5N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP2SGX130GF1508C5N کے لیے موزوں ہے 7 ایپلیکیشنs: 10G/40G Ethernet Line Cards, Wireless Base Station Baseband, High-Speed Serial Protocol Bridging, DSP Co-Processing for Radar and Imaging, Broadcast Video Processing, ASIC Prototyping, Test and Measurement Equipment.
10G/40G Ethernet Line Cards
The EP2SGX130GF1508C5N is well suited for 10G and 40G Ethernet line-card designs where the integrated multi-gigabit transceivers handle XAUI, SFI-5, and CEI-6G interfaces directly. Its 132,540 logic elements and dedicated PCS/PMA hard IP blocks eliminate the need for external PHY chips, reducing BOM cost and board area. The 717 MHz internal fabric supports packet-processing logic at line rate while 734 user I/Os connect to external TCAM, RLDRAM, and switch-fabric devices.
تجویز کردہ
Wireless Base Station Baseband
In wireless base-station baseband and radio units, the EP2SGX130GF1508C5N's CPRI and OBSAI protocol support makes it ideal for connecting remote radio heads to baseband processing. The 6,747,840 embedded RAM bits provide ample buffering for high-rate downlink streams, while the DSP blocks accelerate FFT, channel estimation, and turbo-decoding algorithms. Its 734 I/O pins support parallel interfaces to DSP co-processors, ASICs, and high-speed ADCs/DACs.
تجویز کردہ
High-Speed Serial Protocol Bridging
The EP2SGX130GF1508C5N serves as a protocol-bridging device between PCI Express Gen1, Serial RapidIO, XAUI, and custom serial interfaces using its hardened PCS/PMA channels. Engineers can implement multi-protocol fan-out, root-complex bridging, or endpoint concentrators without external PHY silicon. The 132K logic elements fit complex DMA engines, address translation tables, and protocol-state machines alongside the SERDES channels.
تجویز کردہ
DSP Co-Processing for Radar and Imaging
For radar signal processing and medical imaging systems, the EP2SGX130GF1508C5N's dedicated DSP blocks and embedded multipliers deliver hundreds of GMACs of DSP throughput. The 132K logic elements and 6.7 Mbit block memory enable pulse-compression, MTI filtering, and beamforming algorithms at real-time rates. Its 717 MHz fabric runs complex FFT and matrix-inversion kernels for SAR image formation and ultrasound beam-steering.
تجویز کردہ
Broadcast Video Processing
Broadcast video processing applications leverage the EP2SGX130GF1508C5N's 132K logic elements and high I/O count for SDI/HD-SDI/3G-SDI interface aggregation, color-space conversion, and video scaling. The on-chip RAM buffers multiple video frames at 1080p60 rates, while dedicated transceivers handle SMPTE 424M/425M coaxial interfaces. The 734 user I/Os connect to HDMI receivers, DDR2/3 memory controllers, and audio CODECs.
تجویز کردہ
ASIC Prototyping
The EP2SGX130GF1508C5N's 132K logic-element capacity and 734 I/O count accommodate full ASIC prototype validation including processor cores, memory controllers, and high-speed I/O peripherals. Multiple Stratix II GX FPGAs can be ganged on a multi-FPGAbpartitioning board using the integrated SERDES for inter-FPGA communication. Quartus II design flow supports ASIC synthesis and incremental compile for fast prototype turnaround.
تجویز کردہ
Test and Measurement Equipment
In high-end oscilloscopes, logic analyzers, and protocol analyzers, the EP2SGX130GF1508C5N's combination of high logic density and multi-gigabit transceivers enables real-time signal capture and analysis at multi-Gbps rates. The 6.7 Mbit embedded RAM stores deep acquisition buffers, while the 734 user I/Os interface to high-speed ADCs and trigger logic. Quartus II design tools support custom firmware for per-product differentiation.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2SGX130GF1508C5N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2SGX130GF1508C5 | EP2SGX130GF1508C4N | EP2SGX130GF1508C3N | EP2S130F1508C5N | EP2S180F1508C5N | EP2S130F1508C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-FBGA, 40x40 mm | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 179,400 (+35%) | 132,540 |
| Speed Grade | C5 (-5) | C5 (-5) | C4 (-4) | C3 (-3) | C5 (-5) | C5 (-5) | C4 (-4) |
| Transceivers | Yes (multi-gigabit, up to 20 channels, up to 6.375 Gbps) | Yes (same transceiver block) | Yes (same transceiver block) | Yes (same transceiver block) | No (Stratix II non-GX) | No (Stratix II non-GX) | No (Stratix II non-GX) |
| Total RAM Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 9,383,040 (+39%) | 6,747,840 |
| User I/O Count | 734 | 734 | 734 | 734 | 734 | 734 | 734 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Built-in multi-gigabit transceivers with hard PCS/PMA (بمقابلہEP2S130F1508C5N)
- Highest speed grade (-5) available for full Fmax timing closure (بمقابلہEP2SGX130GF1508C4N)
- 132K logic elements with 8-input ALM architecture (بمقابلہEP2SGX60EF1152I4N)
ڈیزائن نوٹس
The 1508-FBGA with 1.0 mm ball pitch requires a PCB stack-up with microvia or via-in-pad technology for fan-out routing on at least 8 signal layers. Use sequential lamination with high-Tg FR-4 or low-loss mid-Tg materials. Per JEDEC MS-034AAU-1 package outline, leave at least 4 mm of keep-out under the BGA thermal pad for via stitching to inner ground planes for thermal dissipation and signal return-path integrity.
Multi-gigabit transceiver channels (up to 6.375 Gbps) demand strict impedance control: 100 ohm differential for XAUI, 85 ohm differential for PCIe, and 50 ohm single-ended for clocks. Use HyperLynx or SiSoft QCD simulations with the manufacturer's IBIS-AMI models before committing to stack-up. Reference clock jitter must be below 1 ps RMS to meet SONET/SDH compliance per the Stratix II GX device handbook.
Estimated: at full transceiver utilization (20 channels at 6.375 Gbps, ~150 mW per channel) plus typical logic utilization (~10 W fabric), total power reaches approximately 13 W. With junction-to-ambient thermal resistance around 8 C/W for the 40 x 40 mm FC-FBGA in still air, attach a heatsink with thermal interface material to keep junction temperature below 85 C. Configure Stratix II GX smart-cooling temperature-grade diodes in the Quartus II PowerPlay analyzer.
Do not leave configuration pins MSEL[2:0] floating - they must be tied to VCCPGM or GND to select the correct configuration mode (AS, PS, JTAG). The CONF_DONE and nSTATUS pins must each have a 10 kohm pull-up to VCCPGM. Always re-issue a global reset after configuration reload before re-enabling transceivers to avoid spurious transmit data per the Stratix II GX configuration handbook.
تعمیل کی معلومات
Lead-free and RoHS compliant per package marking 'N' suffix. Halogen-free status not explicitly stated in the verified web data. Not AEC-Q100 qualified - this is a commercial-grade FPGA intended for industrial, telecom, and computing equipment. JEDEC MS-034AAU-1 package outline.