EP2SGX130GF1508C5N - 132K LE Stratix II GX FPGA | Intel
부품 번호: EP2SGX130GF1508C5N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4650 | $46,500.00 |
| 100 | $4380 | $438,000.00 |
| 500 | $4120 | $2,060,000.00 |
| 1,000 | $3890 | $3,890,000.00 |
EP2SGX130GF1508C5N 개요
Key features include 6,627 Logic Array Blocks (LABs), 734 user I/O pins, embedded multiplier blocks and DSP blocks for high-throughput signal processing, distributed and M512/M4K/M-RAM block memory, and dedicated PLL and clock-management circuitry. The "C5" speed grade denotes a commercial -5 timing closure, while the "N" suffix indicates a lead-free, RoHS-compliant FBGA. The 40 x 40 mm package with 1 mm ball pitch is intended for high-layer-count PCB designs with controlled-impedance routing.
The Stratix II GX architecture uses an ALM (Adaptive Logic Module) approach, allowing each ALM to be configured for either combinational or registered logic with up to 8 inputs, delivering better logic utilization than the older 4-input LUT-based Stratix. The on-chip transceivers support CPRI, OBSAI, Serial RapidIO, PCI Express Gen1, XAUI, CEI-6G, and SFI-5 protocols without external PHYs, making the part well suited for backplane, line-card, and base-station designs.
Typical applications include 10G/40G Ethernet line cards, wireless base-station baseband and radio units, high-speed serial protocol bridging (PCIe, SRIO, XAUI), DSP co-processing for radar and medical imaging, and ASIC prototyping. The device is also used in broadcast video processing and high-end test and measurement equipment where logic density and transceiver bandwidth are simultaneous requirements.
When designing with this device, ensure the PCB stack-up supports 1 mm-pitch BGA breakout with microvia or via-in-pad technology where required, and provide matched-length routing for high-speed serial links. Thermal management must account for the 1508-pin FC-FBGA's junction-to-ambient thermal resistance; a heatsink with thermal interface material is recommended for full transceiver utilization. Quartus II design software (Stratix II GX device support) is required for synthesis, place-and-route, and bitstream generation.
드롭인 대체품: EP2SGX130GF1508C5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX130GF1508C5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Speed Grade, Family, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX130GF1508C5
✅ 드롭인✓ 재고 있음
$645 / 개
데이터시트 보기 →EP2SGX130GF1508C4N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP2SGX130GF1508C3N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2S130F1508C5N
✅ 드롭인✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S180F1508C5N
✅ 드롭인✓ 재고 있음
$5050 / 개
데이터시트 보기 →EP2S130F1508C4N
✅ 드롭인✓ 재고 있음
$4435.83 / 개
데이터시트 보기 →EP2SGX130GF1508C5N 최대 정격 & 전기적 특성
| Series | Stratix II GX |
| Family | Stratix II GX |
| Logic Elements / Cells | 132540 |
| Logic Array Blocks (LABs) | 6627 |
| Total RAM Bits | 6747840 |
| Number of I/O | 734 |
| Package Type | 1508-BBGA, FCBGA |
| Package Dimensions | 40 x 40 mm, 1 mm pitch |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Internal Frequency | 717 MHz (max) |
| 동작 온도 | 0C to +85C (commercial) |
| Speed Grade | C5 |
| 실장 유형 | Surface Mount (BGA) |
| Lead Free / RoHS | Yes (lead free) |
| Logic Family | CMOS |
EP2SGX130GF1508C5N 40 x 40 mm, 1 mm pitch 핀 구성 가이드
EP2SGX130GF1508C5N(40 x 40 mm, 1 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX130GF1508C5N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX130GF1508C5N 적합 용도: 7 애플리케이션s: 10G/40G Ethernet Line Cards, Wireless Base Station Baseband, High-Speed Serial Protocol Bridging, DSP Co-Processing for Radar and Imaging, Broadcast Video Processing, ASIC Prototyping, Test and Measurement Equipment.
10G/40G Ethernet Line Cards
The EP2SGX130GF1508C5N is well suited for 10G and 40G Ethernet line-card designs where the integrated multi-gigabit transceivers handle XAUI, SFI-5, and CEI-6G interfaces directly. Its 132,540 logic elements and dedicated PCS/PMA hard IP blocks eliminate the need for external PHY chips, reducing BOM cost and board area. The 717 MHz internal fabric supports packet-processing logic at line rate while 734 user I/Os connect to external TCAM, RLDRAM, and switch-fabric devices.
추천
Wireless Base Station Baseband
In wireless base-station baseband and radio units, the EP2SGX130GF1508C5N's CPRI and OBSAI protocol support makes it ideal for connecting remote radio heads to baseband processing. The 6,747,840 embedded RAM bits provide ample buffering for high-rate downlink streams, while the DSP blocks accelerate FFT, channel estimation, and turbo-decoding algorithms. Its 734 I/O pins support parallel interfaces to DSP co-processors, ASICs, and high-speed ADCs/DACs.
추천
High-Speed Serial Protocol Bridging
The EP2SGX130GF1508C5N serves as a protocol-bridging device between PCI Express Gen1, Serial RapidIO, XAUI, and custom serial interfaces using its hardened PCS/PMA channels. Engineers can implement multi-protocol fan-out, root-complex bridging, or endpoint concentrators without external PHY silicon. The 132K logic elements fit complex DMA engines, address translation tables, and protocol-state machines alongside the SERDES channels.
추천
DSP Co-Processing for Radar and Imaging
For radar signal processing and medical imaging systems, the EP2SGX130GF1508C5N's dedicated DSP blocks and embedded multipliers deliver hundreds of GMACs of DSP throughput. The 132K logic elements and 6.7 Mbit block memory enable pulse-compression, MTI filtering, and beamforming algorithms at real-time rates. Its 717 MHz fabric runs complex FFT and matrix-inversion kernels for SAR image formation and ultrasound beam-steering.
추천
Broadcast Video Processing
Broadcast video processing applications leverage the EP2SGX130GF1508C5N's 132K logic elements and high I/O count for SDI/HD-SDI/3G-SDI interface aggregation, color-space conversion, and video scaling. The on-chip RAM buffers multiple video frames at 1080p60 rates, while dedicated transceivers handle SMPTE 424M/425M coaxial interfaces. The 734 user I/Os connect to HDMI receivers, DDR2/3 memory controllers, and audio CODECs.
추천
ASIC Prototyping
The EP2SGX130GF1508C5N's 132K logic-element capacity and 734 I/O count accommodate full ASIC prototype validation including processor cores, memory controllers, and high-speed I/O peripherals. Multiple Stratix II GX FPGAs can be ganged on a multi-FPGAbpartitioning board using the integrated SERDES for inter-FPGA communication. Quartus II design flow supports ASIC synthesis and incremental compile for fast prototype turnaround.
추천
Test and Measurement Equipment
In high-end oscilloscopes, logic analyzers, and protocol analyzers, the EP2SGX130GF1508C5N's combination of high logic density and multi-gigabit transceivers enables real-time signal capture and analysis at multi-Gbps rates. The 6.7 Mbit embedded RAM stores deep acquisition buffers, while the 734 user I/Os interface to high-speed ADCs and trigger logic. Quartus II design tools support custom firmware for per-product differentiation.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX130GF1508C5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX130GF1508C5 | EP2SGX130GF1508C4N | EP2SGX130GF1508C3N | EP2S130F1508C5N | EP2S180F1508C5N | EP2S130F1508C4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-FBGA, 40x40 mm | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same | 1508-FBGA, 40x40 mm - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 179,400 (+35%) | 132,540 |
| Speed Grade | C5 (-5) | C5 (-5) | C4 (-4) | C3 (-3) | C5 (-5) | C5 (-5) | C4 (-4) |
| Transceivers | Yes (multi-gigabit, up to 20 channels, up to 6.375 Gbps) | Yes (same transceiver block) | Yes (same transceiver block) | Yes (same transceiver block) | No (Stratix II non-GX) | No (Stratix II non-GX) | No (Stratix II non-GX) |
| Total RAM Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 9,383,040 (+39%) | 6,747,840 |
| User I/O Count | 734 | 734 | 734 | 734 | 734 | 734 | 734 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Built-in multi-gigabit transceivers with hard PCS/PMA (vs EP2S130F1508C5N)
- Highest speed grade (-5) available for full Fmax timing closure (vs EP2SGX130GF1508C4N)
- 132K logic elements with 8-input ALM architecture (vs EP2SGX60EF1152I4N)
설계 노트
The 1508-FBGA with 1.0 mm ball pitch requires a PCB stack-up with microvia or via-in-pad technology for fan-out routing on at least 8 signal layers. Use sequential lamination with high-Tg FR-4 or low-loss mid-Tg materials. Per JEDEC MS-034AAU-1 package outline, leave at least 4 mm of keep-out under the BGA thermal pad for via stitching to inner ground planes for thermal dissipation and signal return-path integrity.
Multi-gigabit transceiver channels (up to 6.375 Gbps) demand strict impedance control: 100 ohm differential for XAUI, 85 ohm differential for PCIe, and 50 ohm single-ended for clocks. Use HyperLynx or SiSoft QCD simulations with the manufacturer's IBIS-AMI models before committing to stack-up. Reference clock jitter must be below 1 ps RMS to meet SONET/SDH compliance per the Stratix II GX device handbook.
Estimated: at full transceiver utilization (20 channels at 6.375 Gbps, ~150 mW per channel) plus typical logic utilization (~10 W fabric), total power reaches approximately 13 W. With junction-to-ambient thermal resistance around 8 C/W for the 40 x 40 mm FC-FBGA in still air, attach a heatsink with thermal interface material to keep junction temperature below 85 C. Configure Stratix II GX smart-cooling temperature-grade diodes in the Quartus II PowerPlay analyzer.
Do not leave configuration pins MSEL[2:0] floating - they must be tied to VCCPGM or GND to select the correct configuration mode (AS, PS, JTAG). The CONF_DONE and nSTATUS pins must each have a 10 kohm pull-up to VCCPGM. Always re-issue a global reset after configuration reload before re-enabling transceivers to avoid spurious transmit data per the Stratix II GX configuration handbook.
규정 준수 정보
Lead-free and RoHS compliant per package marking 'N' suffix. Halogen-free status not explicitly stated in the verified web data. Not AEC-Q100 qualified - this is a commercial-grade FPGA intended for industrial, telecom, and computing equipment. JEDEC MS-034AAU-1 package outline.