EP3SL50F780I4N - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel
MPN: EP3SL50F780I4N ✓ فعالEP3SL50F780I4N جائزہ
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O behaviour can be redefined after manufacturing through a configuration bitstream. Within the broader hierarchy, an FPGA sits above fixed-function ASICs and below software-programmable processors in terms of design flexibility vs deterministic performance. Stratix III L devices specifically trade raw logic capacity for up to 50% lower power than the standard Stratix III E family, making them suited to applications where thermal envelope and total energy are first-order design drivers.
Key features of the EP3SL50F780I4N include 47,500 Logic Elements, 2,184,192 user RAM bits distributed across TriMatrix memory blocks, 488 single-ended (or 244 differential) user I/Os, support for up to 12.5 Gbps transceivers via the device family, and integrated DSP blocks for fixed- and floating-point signal processing. The 780-ball FC-FBGA package uses Intel's Flip-Chip land-grid-array construction with a 1.0 mm ball pitch typical for this family, providing high pin density while supporting standard reflow assembly.
Architecture depth: Stratix III L devices use a fabric of adaptive logic modules (ALMs), each containing two combinational adaptive LUTs and two registers, fed by a hierarchical routing network with quarter-turn and length-4/16 wires. The integrated memory subsystem uses TriMatrix blocks (MLAB, M9K, M144K) to balance latency and density. Configuration is stored in SRAM and loaded from a flash or via JTAG at power-up.
Typical applications include wireless baseband processing, software-defined radio (SDR), high-speed serial protocol bridging (PCIe Gen2, SRIO, CPRI), video broadcast and image processing pipelines, and military/aerospace signal processing where industrial temperature grade and BGA packaging are required.
Design consideration: BGA fan-out, power-rail decoupling (0.9V core, 3.3V/2.5V aux, 1.2V transceiver), and configuration-strategy selection (Active Serial vs JTAG) must be planned before PCB layout.
This page synthesizes current distributor pricing, drop-in package-equivalent variants within the Stratix III family, and design notes not consolidated in a single manufacturer document.
کے لیے ڈراپ اِن متبادل EP3SL50F780I4N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP3SL50F780I4N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Speed Grade, Mounting Type, Embedded Memory, Logic Elements.
EP3SL50F780I4LN
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780I4LG
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780I4L
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780I4G
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780I4
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL150F780I3N
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP3SL200H780I4N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP3SL50F780I4N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | Stratix III L |
| Logic Elements | 47,500 |
| Total RAM Bits | 2,184,192 |
| User I/O Count | 488 |
| Process Technology | 65 nm TSMC |
| Core Voltage | 0.9 V |
| Auxiliary / I/O Voltage | 1.2 V / 3.3 V |
| آپریٹنگ درجہ حرارت | -40C to +100C (Industrial) |
| Package Type | 780-ball FC-FBGA (Flip-Chip) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| نمی حساسیت کی سطح (MSL) | 3 (168 hours) |
| RoHS اسٹیٹس | Compliant |
| Configuration Mode | SRAM-based, Active Serial / JTAG |
| پنز کی تعداد | 780 |
| Lead-Free / Pb-Free | Yes |
EP3SL50F780I4N پن کنفیگریشن
| پن A1 | I/O Bank — User I/O (per Stratix III pin map; bank assignment varies by signal) |
| پن A2 | I/O Bank — User I/O |
| پن A3 | I/O Bank — User I/O |
| پن B1 | I/O Bank — User I/O |
| پن B2 | I/O Bank — User I/O |
| پن B3 | I/O Bank — User I/O |
| پن C1 | I/O Bank — User I/O |
| پن C2 | I/O Bank — User I/O |
| پن C3 | I/O Bank — User I/O |
| پن D1 | GND — Ground reference |
| پن D2 | VCC — Core supply 0.9 V |
| پن D3 | VCCAUX — Auxiliary supply |
| پن AA1 | I/O Bank — User I/O |
| پن AA2 | I/O Bank — User I/O |
| پن AA3 | I/O Bank — User I/O |
| پن AB1 | I/O Bank — User I/O |
| پن AB2 | I/O Bank — User I/O |
| پن AB3 | I/O Bank — User I/O |
| پن AC1 | I/O Bank — User I/O |
| پن AC2 | I/O Bank — User I/O |
عام استعمالات
EP3SL50F780I4N کے لیے موزوں ہے 6 ایپلیکیشنs: Wireless Baseband & Software-Defined Radio (SDR), PCIe Gen2 Endpoint / Root-Complex, Video Broadcast & Image Processing Pipelines, Military & Aerospace Signal Processing, Industrial Automation & Motor Control, Test & Measurement Instrumentation.
Wireless Baseband & Software-Defined Radio (SDR)
The EP3SL50F780I4N is well suited to wireless baseband and SDR front-end processing thanks to its 47,500 Logic Elements, integrated DSP blocks, and 2,184,192 bits of embedded memory for buffering I/Q sample streams. Its low-power Stratix III L architecture reduces thermal envelope in outdoor remote-radio-head (RRH) deployments where fans or heat-sinks are impractical. The 488 user I/Os permit parallel ADC/DAC and CPRI/OBSAI interfaces to be routed without external muxes, and the industrial -40C to +100C operating range satisfies outdoor telecom-grade ambient requirements. Pin-compatible higher-density variants such as EP3SL150F780I3N allow upgrades without PCB rework.
تجویز کردہ
PCIe Gen2 Endpoint / Root-Complex
With integrated multi-gigabit transceivers supporting PCIe Gen2 (5 Gbps), the EP3SL50F780I4N can implement a single-lane or multi-lane endpoint / root-complex for server, storage, or industrial-PC applications. The 47.5K Logic Elements host the PCIe Hard IP plus DMA engine and protocol stack, while 2.18 Mbit of on-chip memory buffers payload data before DMA. Industrial temperature grade and BGA package suit embedded computing cards. The 780-ball FC-FBGA footprint permits clean separation of transceiver and reference-clock pins, simplifying PCB stack-up and SI simulation.
تجویز کردہ
Video Broadcast & Image Processing Pipelines
The 488 user I/Os and 2.18 Mbit of embedded memory make the EP3SL50F780I4N a strong fit for broadcast video routers, format converters, and real-time image-processing pipelines where multiple parallel data streams must be buffered and processed simultaneously. The Stratix III L fabric's lower power consumption simplifies chassis thermal design in 1U/2U rack frames, and the integrated DSP blocks accelerate 2D filter and motion-estimation kernels. Industrial temperature grade and the robust 780-ball FC-FBGA package suit 24/7 broadcast head-end environments with controlled but persistent airflow.
تجویز کردہ
Military & Aerospace Signal Processing
The EP3SL50F780I4N's industrial -40C to +100C operating range, lead-free RoHS-compliant packaging, and high integration make it a strong candidate for ruggedized signal-processing platforms in defense and aerospace subsystems. Its on-chip resources can host secure crypto accelerators, radar baseband pipelines, and protocol converters without off-chip memory. The Flip-Chip BGA package's solder-joint reliability under vibration and thermal-cycling stress has been documented for the Stratix III family. Pin-compatible variants in the same 780-ball footprint enable component second-sourcing across production lots.
تجویز کردہ
Industrial Automation & Motor Control
In factory-automation controllers, the EP3SL50F780I4N can host deterministic real-time Ethernet protocols (EtherCAT, PROFINET), multi-axis motor-control loops, and machine-vision pre-processing in a single device. The 488 user I/Os accept parallel feedback from encoders and sensors, while the on-chip DSP blocks accelerate Park/Clarke transforms and PI loops. Industrial temperature operation and BGA package satisfy the harsh-environment EMC and ambient-temperature requirements of plant-floor equipment. Drop-in compatibility with EP3SL150F780I3N allows future expansion to more axes without PCB redesign.
تجویز کردہ
Test & Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers benefit from the EP3SL50F780I4N's 488 I/Os for sampling-channel fan-in, 2.18 Mbit of memory for deep-acquisition buffering, and multi-gigabit transceivers for high-speed serial protocol triggering. The Stratix III L family's lower static power simplifies thermal design in dense-channel chassis. Industrial temperature range and BGA package satisfy bench-top and ATE environments. The drop-in footprint compatibility with EP3SL150F780I3N permits channel-count scaling in a common PCB platform.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP3SL50F780I4N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP3SL50F780I4LN | EP3SL50F780I4LG | EP3SL50F780I4L | EP3SL50F780I4G | EP3SL50F780I4 | EP3SL150F780I3N | EP3SL200H780I4N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 142,000 | 200,000 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed / Temperature Bin | I4 | I4 | I4 | I4 | I4 | I4 | I3 | I4 |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L |
اہم امتیازی خصوصیات
- Pin-compatible density upgrade path (بمقابلہEP3SL50F780I4 (base MPN))
- Low-power Stratix III L fabric (بمقابلہStratix III E variants (EP3SE50F780I4N))
- Multiple supplier-marking options for second sourcing (بمقابلہSingle-MPN designs)
ڈیزائن نوٹس
The EP3SL50F780I4N requires multiple independent power rails: VCCINT (0.9 V core), VCCAUX / VCCAUX_PLL (2.5 V), VCCIO (1.2 / 1.5 / 1.8 / 2.5 / 3.0 / 3.3 V per bank), and VCCPD / VCCPGM (3.3 V for configuration). Use a 6+ layer PCB with dedicated power planes; place 0.1 uF + 10 uF ceramic decoupling within 100 mil of every VCC pin. Power-on sequencing requirements (VCCINT before VCCAUX before VCCIO) must be enforced per the Stratix III Device Handbook to prevent latch-up.
For a 780-ball FC-FBGA at the typical 1.0 mm ball pitch, use a 6-8 layer PCB stack-up with micro-via-in-pad construction for breakout and a continuous ground plane beneath the device. The Flip-Chip BGA requires precise reflow profile (peak 245C, TAL 60-90 s) per JEDEC J-STD-020. Maintain a 5 mm 'keep-out' around the BGA for fan-out traces and prohibit signal routing under the package without proper shielding.
Common pitfalls include omitting the MSL 3 bake-out (168 hour floor life) prior to assembly, mis-setting the configuration mode pins (MSEL) for the wrong Active Serial flash type, and failing to connect nCONFIG / nSTATUS / CONF_DONE pull-ups to VCCPGM. Also note: industrial-temperature 'I4' devices are NOT AEC-Q100 qualified; for automotive designs, source a different family member. Always regenerate the pinout from the Quartus II pin planner rather than assuming a fixed assignment.
تعمیل کی معلومات
RoHS compliant per 'N' suffix in part number; lead-free / Pb-free plating. Industrial temperature grade -40C to +100C per 'I4' suffix, NOT AEC-Q100 qualified - choose an automotive-grade family member for AEC-Q100 requirements. REACH compliance inferred from Intel product family standard; specific test report not in verified data.
