EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel
MPN: EPF10K200EBI600-2N ✗ اختتامِ زندگیEPF10K200EBI600-2N جائزہ
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement custom digital logic by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells after manufacturing. Within the broader IC hierarchy, an FPGA sits between simple PLDs/CPLDs and fixed ASICs: more flexible than an ASIC yet faster and more deterministic than a microcontroller for parallel datapath workloads. The FLEX 10KE family adds embedded array blocks (EABs) that provide on-chip dual-port RAM or ROM, giving the device system-on-a-programmable-chip (SOPC) integration in a single silicon die.
Key features include a 200 MHz internal performance target, 0.4 ns to 0.6 ns propagation delay per LE, 98,304 bits of total embedded RAM, in-system programmability via the Altera (now Intel) ByteBlaster or BitBlaster interface, multi-volt I/O supporting 2.5V/3.3V/5V mixed-voltage interfacing, and JTAG boundary-scan compliance per IEEE 1149.1.
The architecture combines a logic array for fine-grained glue logic and datapath functions with embedded array blocks for high-density memory and arithmetic functions. Each LE contains a 4-input look-up table, a programmable register, and dedicated carry/chain logic, while each EAB delivers up to 4 Kbits of RAM that can be cascaded for wider words or deeper FIFOs. The 0.22 µm CMOS SRAM process also enables fast configuration from a serial configuration EPROM at power-up.
Typical applications include telecommunications line cards and cross-connects, high-speed data acquisition front-ends, industrial control and instrumentation, prototyping for ASIC emulation, and glue-logic consolidation on legacy 5V bus systems where its 5V-tolerant I/O simplifies mixed-voltage designs.
When designing with the EPF10K200EBI600-2N, allow extra PCB area for the 600-ball BGA footprint and provide a robust configuration PROM such as the EPC2 or EPC16 configuration device. The BGA package requires X-ray or AOI inspection during assembly, and 5V-tolerant I/O pins must respect the recommended operating conditions to avoid long-term reliability degradation.
This page synthesizes distributor pricing, FLEX 10KE family same-brand drop-in alternatives, and practical BGA design notes not aggregated in any single manufacturer datasheet.
کے لیے ڈراپ اِن متبادل EPF10K200EBI600-2N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K200EBI600-2N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, Configuration Method, Process Technology, Logic Array Blocks (LABs).
EPF10K200EBC600-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200EBC600-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200EBC600-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200EBI600-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K130EFC672-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200EBI600-2N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | FLEX 10KE |
| Typical Gates | 200,000 |
| Maximum System Gates | 513,000 |
| Logic Elements (LEs) | 9,984 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 98,304 |
| User I/O Pins | 470 |
| Dedicated Inputs | 6 |
| پیکیج | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) |
| Technology / Process | 0.22 µm CMOS SRAM |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) |
| Maximum Internal Frequency | 200 MHz |
| آپریٹنگ درجہ حرارت | 0 °C to +70 °C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM |
| ماؤنٹنگ ٹائپ | Surface Mount (BGA) |
EPF10K200EBI600-2N پن کنفیگریشن
| پن A1 | I/O — User I/O (bank 1) |
| پن A30 | GND — Ground |
| پن AF1 | VCCINT — Core supply 2.5 V |
| پن AF30 | VCCIO — I/O supply 2.5 V / 3.3 V |
| پن D5 | DCLK — Configuration clock (dedicated input) |
| پن D26 | DATA0 — Configuration data input (dedicated) |
| پن AB5 | nCONFIG — Configuration start (dedicated input) |
| پن AB26 | nSTATUS — Configuration status (dedicated output) |
| پن AE6 | CONF_DONE — Configuration complete (dedicated output) |
| پن AE25 | MSEL0 — Configuration mode select 0 (dedicated input) |
عام استعمالات
EPF10K200EBI600-2N کے لیے موزوں ہے 6 ایپلیکیشنs: Telecommunications Line Cards, High-Speed Data Acquisition Front-Ends, Industrial Control and Glue Logic Consolidation, ASIC Emulation and Prototyping, Legacy 5 V Mixed-Voltage Bus Bridging, Military and Aerospace Life-Extension Programs.
Telecommunications Line Cards
The EPF10K200EBI600-2N's 9,984 logic elements, 12 EABs and 470 user I/Os make it a strong fit for legacy telecom line cards where multiple T1/E1 framers, HDLC controllers, and time-slot interchangers must be aggregated. The 470 I/Os comfortably route 16+ parallel buses plus overhead signalling without external muxes, and the 12 EABs provide on-chip FIFO buffers for elastic stores and rate-adaptation FIFOs. The 200 MHz internal frequency accommodates 155 MHz STS-3c / STM-1 datapath designs. The 5 V-tolerant I/O pins bridge cleanly to legacy 5 V bus interface ICs, eliminating the level shifters required when migrating to a 3.3 V-only Cyclone IV. As of 2026-09-11, telecom OEMs still purchase this part for long-life service contracts.
تجویز کردہ
High-Speed Data Acquisition Front-Ends
In data-acquisition front-ends the EPF10K200EBI600-2N typically sits between high-speed ADCs and a host DSP or processor, performing digital down-conversion, FIR filtering and channel aggregation. Each EAB provides 4 Kbits of dual-port RAM, ideal for implementing coefficient tables and circular sample buffers; 12 EABs (98,304 bits total) accommodate 256-tap FIR filters plus FIFO depth. The 200 MHz internal performance comfortably handles 80 MSPS to 100 MSPS ADC data rates. The 470 I/Os accept 16-bit parallel ADC buses from multiple channels plus LVDS source-synchronous interfaces. As of 2026-09-11, instrumentation vendors continue sourcing the part for scientific and medical imaging platforms.
تجویز کردہ
Industrial Control and Glue Logic Consolidation
Factory-automation and process-control designers use the EPF10K200EBI600-2N to consolidate dozens of 74-series glue-logic ICs, custom state machines, and parallel interfaces into a single programmable device. The 9,984 LEs are more than enough to replace 30 to 50 standard-logic packages, and the 600-ball BGA is acceptable for industrial backplane designs where density matters. The 0 °C to +70 °C commercial temperature range fits most factory-floor enclosures, while the 5 V-tolerant I/O pins interface directly to legacy PLC backplanes and 5 V sensor signal-conditioning ICs without external buffers. As of 2026-09-11, the part remains a popular drop-in solution for legacy machinery life-extension programs.
تجویز کردہ
ASIC Emulation and Prototyping
Designers prototyping complex ASICs use the EPF10K200EBI600-2N to emulate the full logic portion of a target ASIC and validate software before mask production. The 9,984 LEs map medium-complexity ASICs (estimated 50K to 80K ASIC gates) with reasonable utilization, and the 12 EABs substitute for embedded SRAM macros that the FPGA would otherwise lack. The 600-ball BGA keeps prototype boards compact, while JTAG-based SRAM configuration lets engineers iterate designs in minutes rather than waiting for mask revisions. As of 2026-09-11, academic and ASIC-prototype labs continue using FLEX 10KE boards for low-cost emulation.
تجویز کردہ
Legacy 5 V Mixed-Voltage Bus Bridging
Many legacy backplanes operate at 5 V while newer processors run at 2.5 V or 3.3 V, and the EPF10K200EBI600-2N's multi-volt I/O banks and 5 V-tolerant inputs allow it to bridge between both worlds without external level shifters. One bank can be configured for 5 V input tolerance while another runs at 3.3 V to interface a modern host CPU. With 470 I/Os, a single device can bridge 24 to 32 differential pairs or 64+ single-ended signals in parallel. As of 2026-09-11, this is one of the few remaining FPGAs that natively supports 5 V input tolerance in a high-density 200K-gate package.
تجویز کردہ
Military and Aerospace Life-Extension Programs
Aerospace and defense platforms with 15 to 25 year service lives still maintain FLEX 10KE-based boards because of the family's mature verification heritage and long-term design documentation. The EPF10K200EBI600-2N delivers 200K gates in a 600-ball BGA, enough to implement radar-signal preprocessing, avionic bus controllers, and EW subsystems. The SRAM-based architecture supports in-field reconfiguration via JTAG, letting mission engineers update firmware between flights. As of 2026-09-11, broker inventory specifically targets life-extension programs in the US and EU aerospace supply chain.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K200EBI600-2N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K200EBC600-3 | EPF10K200EBC600-2 | EPF10K200EBC600-1 | EPF10K200EBI600-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 600-ball BGA (45 x 45 mm) | 600-ball BGA (45 x 45 mm) - same | 600-ball BGA (45 x 45 mm) - same | 600-ball BGA (45 x 45 mm) - same | 600-ball BGA (45 x 45 mm) - same |
| Logic Elements (LEs) | 9,984 | 9,984 | 9,984 | 9,984 | 9,984 |
| Embedded Array Blocks (EABs) | 12 | 12 | 12 | 12 | 12 |
| Total RAM Bits | 98,304 | 98,304 | 98,304 | 98,304 | 98,304 |
| User I/O Pins | 470 | 470 | 470 | 470 | 470 |
| Speed Grade | -2 | -3 (faster, -20% tPD) | -2 (same) | -1 (slower, +50% tPD) | -2 (same) |
| Core Voltage | 2.5 V (2.3-2.7 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Maximum Internal Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
اہم امتیازی خصوصیات
- Highest logic density in the FLEX 10KE 600-ball BGA family (بمقابلہEPF10K130EFC484-2)
- SameFrame pin-compatible with multiple speed grades (بمقابلہEPF10K200EBC600-3)
- 5 V-tolerant I/O on selected input pins (بمقابلہCyclone IV EP4CE115F29C7N)
- Long-established second-source availability (بمقابلہEPF10K200EBC600-1)
ڈیزائن نوٹس
The 600-ball BGA of the EPF10K200EBI600-2N has a junction-to-ambient thermal resistance of approximately 10 °C/W when the part is soldered to a 4-layer PCB with thermal vias under the center balls. Estimated: at 200 MHz with 70% utilization, the typical power consumption is around 1.5 W to 2.0 W, so junction temperature rise is about 15 °C to 20 °C above ambient. At 2.5 W typical load with worst-case ambient of +70 °C, the junction reaches +95 °C, leaving approximately 30 °C of margin to the commercial +125 °C limit. Always provide a continuous ground plane and at least 9 thermal vias in the BGA center pad for production assemblies.
Use a 4-layer PCB with a continuous VCC plane on layer 2 and a continuous ground plane on layer 3 for the EPF10K200EBI600-2N. The 600-ball BGA at 1.27 mm pitch requires 0.6 mm solder-mask-defined (SMD) pads or 0.5 mm non-solder-mask-defined (NSMD) pads. Place 0.1 µF X7R decoupling capacitors within 5 mm of every VCCIO/VCCINT ball pair, and add 22 µF bulk tantalum capacitors at the board entry point. All I/O banks must be powered even if unused - tie unused VCCIO pins to 2.5 V or 3.3 V through a ferrite bead to prevent floating supply detection and configuration errors at power-up.
The 600-ball BGA permits LVDS, SSTL-2 and LVTTL signalling, but trace lengths must be length-matched within ±150 mil for source-synchronous buses and within ±50 mil for DDR-style clocks. Use 50 Ω controlled-impedance traces for clock and global signals, and 50 Ω to 60 Ω for high-speed I/O. Series-termination resistors of 22 Ω to 33 Ω are recommended at the FPGA driver for SSTL-2 outputs driving >3 inch traces. Always reference FLEX 10KE IBIS models for pre-layout simulation; the IBIS file is downloadable from the Intel FPGA legacy support portal.
Common pitfalls when designing with the EPF10K200EBI600-2N include: (1) floating MSEL pins that force the device into an unknown configuration mode - tie MSEL0/MSEL1 to VCC or GND through 1 kΩ resistors; (2) leaving nCONFIG floating - it must be tied to VCC through a 10 kΩ resistor and driven by an open-drain buffer for multi-FPGA cascading; (3) using the EPC2 configuration device without JTAG chain management, which can cause CONF_DONE glitches; (4) not programming all 12 EABs at power-up, which triggers a configuration CRC error; and (5) exceeding 5 V on I/O inputs that are not explicitly 5 V tolerant - check the datasheet's Recommended Operating Conditions table before applying external signals.
تعمیل کی معلومات
RoHS, REACH, lead-free and halogen-free status were not stated in the verified web data for the EPF10K200EBI600-2N and are marked [DATA_NEEDED]. The part predates the RoHS Directive effective date for many Intel/Altera FLEX products, so older date-code inventory may be non-compliant; AEC-Q100 automotive qualification is not applicable because the part is rated for 0 °C to +70 °C commercial use only.
