EPF10K200SFC484-1X - FLEX 10KS FPGA 9984 Cells 484-BGA | Intel
MPN: EPF10K200SFC484-1X ✗ اختتامِ زندگیEPF10K200SFC484-1X جائزہ
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically programmed after manufacturing to implement arbitrary digital logic. The FLEX 10KS family is positioned within the broader PLD taxonomy as PLD -> CPLD -> FPGA -> SRAM-based FPGA -> embedded array FPGA, bridging the gap between simple glue logic and full ASIC-class integration. FPGAs are widely used for prototyping, signal processing, glue logic, and high-volume parallel datapath acceleration.
Key specifications include 9984 logic elements, 1248 logic array blocks (LABs), 98,304 RAM bits, 369 user I/Os, 250 MHz internal performance and 0.4 ns propagation delay. The 484-pin FBGA package supports high I/O density on a compact 23x23 mm outline, while the embedded array enables block-level memory and datapath instantiation without wasting general-purpose logic.
Typical applications include telecommunications line cards, industrial control and instrumentation, ASIC prototyping, embedded DSP pipelines, image/video preprocessing, and high-speed bus bridging. The wide I/O count and embedded memory make it suitable for designs that previously required a discrete gate array plus a separate SRAM/DRAM controller.
When designing with the EPF10K200SFC484-1X, designers should plan for a 2.5 V core supply with proper decoupling near every supply ball. Because the FLEX 10K family is a mature node, design entry is supported by the legacy Altera MAX+PLUS II and Quartus II toolchains - verify the device is supported in your chosen tool version before starting the layout.
This page synthesizes distributor pricing, same-brand drop-in alternatives and practical design considerations not found in the manufacturer datasheet. All alternatives listed are sourced from the Site MPN list to enable cross-linking across the XAIPART catalog.
کے لیے ڈراپ اِن متبادل EPF10K200SFC484-1X — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K200SFC484-1X (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Family, Package, Operating Temperature, Speed Grade, Process Technology.
EPF10K200SFC484-1N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200SFC484-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200SFC484-2X
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200SFC484-3X
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EPF10K200SFC484-3N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200SFC484-1X زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Series | FLEX 10KS |
| Family | FLEX 10K Embedded Programmable Logic Device |
| Logic Elements / Cells | 9984 |
| Total RAM Bits | 98304 |
| Number of LABs/CLBs | 1248 |
| User I/O Count | 369 |
| Supply Voltage (Core) | 2.5 V |
| Supply Voltage Range | 2.375 V to 2.625 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 250 MHz |
| Propagation Delay | 0.4 ns |
| پیکیج | 484-BBGA / FBGA-484 (23 x 23 mm, 1.0 mm pitch, fine line) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| آپریٹنگ درجہ حرارت | 0 °C to +70 °C (Commercial) |
EPF10K200SFC484-1X پن کنفیگریشن
| پن A1 | I/O — General-purpose user I/O ball |
| پن A22 | I/O — General-purpose user I/O ball |
| پن B1 | I/O — General-purpose user I/O ball |
| پن AB1 | I/O — General-purpose user I/O ball |
| پن AB22 | I/O — General-purpose user I/O ball |
| پن AA1 | I/O — General-purpose user I/O ball |
| پن VCCINT | VCCINT — Core supply, 2.5 V nominal |
| پن VCCIO | VCCIO — I/O supply, 2.5 V or 3.3 V |
| پن GND | GND — Ground |
| پن MSEL0 | MSEL0 — Configuration mode select 0 |
| پن MSEL1 | MSEL1 — Configuration mode select 1 |
| پن nSTATUS | nSTATUS — Configuration status, open-drain |
| پن nCONFIG | nCONFIG — Configuration control, active-low |
| پن CONF_DONE | CONF_DONE — Configuration complete, open-drain |
| پن TCK | TCK — JTAG test clock |
| پن TMS | TMS — JTAG test mode select |
| پن TDI | TDI — JTAG test data in |
| پن TDO | TDO — JTAG test data out |
| پن DCLK | DCLK — Configuration clock |
| پن DATA0 | DATA0 — Configuration data bit 0 |
عام استعمالات
EPF10K200SFC484-1X کے لیے موزوں ہے 6 ایپلیکیشنs: Telecommunications Line Card Glue Logic, Industrial Control and Instrumentation, ASIC Prototyping and Pre-Silicon Validation, Image and Video Preprocessing Pipeline, High-Speed Bus Bridging and Protocol Conversion, Legacy Embedded DSP and Datapath Acceleration.
Telecommunications Line Card Glue Logic
The EPF10K200SFC484-1X's combination of 9984 logic elements and 369 user I/Os makes it well-suited for telecommunications line cards where high I/O density and deterministic glue-logic integration matter most. Placed between network processors and PHY transceivers, it can implement bus arbitration, protocol conversion and clock-domain crossing without consuming ASIC capacity; the 250 MHz internal performance is sufficient for 155 Mbps to 622 Mbps POS/PHY bridging, while the 2.5 V core supply simplifies integration with legacy 2.5 V PHY interfaces.
تجویز کردہ
Industrial Control and Instrumentation
With its commercial 0-70 °C operating window and 369 I/Os, the EPF10K200SFC484-1X can be used inside industrial controllers to aggregate parallel sensor buses, drive multi-axis stepper interfaces and provide deterministic timing for PLC backplanes. The 9984 logic elements can host multiple soft processor cores (such as the Altera Nios) plus custom instrumentation glue; for industrial-temperature sites the EPF10K200SFC484-1N variant (which shares the same ball map) should be specified instead.
تجویز کردہ
ASIC Prototyping and Pre-Silicon Validation
Designers still rely on the EPF10K200SFC484-1X for ASIC prototyping because its 9984 logic elements and 98,304 bits of embedded memory can map mid-complexity ASIC RTL block-by-block onto a real silicon fabric. This allows firmware teams to begin driver development months before ASIC tape-out, and verification engineers can co-simulate against the same RTL that will eventually ship in the ASIC. The FLEX 10K design flow is mature, with MAX+PLUS II and legacy Quartus II toolchains widely available in academic and EDA archives.
تجویز کردہ
Image and Video Preprocessing Pipeline
The 9984 logic elements and 369 I/Os of the EPF10K200SFC484-1X are sufficient for first-stage image preprocessing pipelines: Bayer demosaicing, histogram equalisation, edge detection and FIFO line buffering into external SDRAM. The 0.4 ns propagation delay lets designers meet pixel-clock budgets up to 250 MHz, which covers most 1080p60 sensor interfaces. The FBGA-484 package keeps the layout compact on the image-sensor carrier board.
تجویز کردہ
High-Speed Bus Bridging and Protocol Conversion
Bridging between legacy PCI, VME, and proprietary backplanes is a classic use case for the EPF10K200SFC484-1X. The 369 I/Os provide enough pins to drive two parallel bus interfaces simultaneously, while 9984 logic elements allow full state-machine plus FIFO buffers on each side. Compared with a discrete CPLD plus dual-port SRAM, the FLEX 10K solution reduces board area, simplifies timing closure and consolidates configuration into a single EPROM.
تجویز کردہ
Legacy Embedded DSP and Datapath Acceleration
Although superseded by modern FPGA families, the EPF10K200SFC484-1X remains in service for legacy DSP accelerators that bit-pack audio samples, perform FIR filtering, or implement forward-error-correction encoders for radio links. The 98,304 embedded memory bits serve as coefficient and sample buffers, and the 250 MHz internal performance supports audio-rate DSP up to about 24 kHz at full multi-tap complexity. Engineers maintaining such systems can use the EPF10K200SFC484-1 as a direct replacement when boards are refurbished.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K200SFC484-1X — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K200SFC484-1N | EPF10K200SFC484-1 | EPF10K200SFC484-2X | EPF10K200SFC484-3X | EPF10K200SFC484-3N |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (23x23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 9984 | 9984 | 9984 | 9984 | 9984 | 9984 |
| Speed Grade | -1 (250 MHz) | -1 (250 MHz) | -1 (250 MHz) | -2 (slower than -1) | -3 (166.67 MHz) | -3 (166.67 MHz) |
| Operating Temperature | 0 to +70 °C (Commercial) | -40 to +85 °C (Industrial) | 0 to +70 °C (Commercial) | 0 to +70 °C (Commercial) | 0 to +70 °C (Commercial) | -40 to +85 °C (Industrial) |
| User I/O Count | 369 | 369 | 369 | 369 | 369 | 369 |
| Total RAM Bits | 98304 | 98304 | 98304 | 98304 | 98304 | 98304 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Highest commercial-temperature speed grade in the SFC484 family (بمقابلہEPF10K200SFC484-3X)
- Fine-line 1.0 mm pitch saves board area versus standard-pitch alternatives (بمقابلہEPF10K200SBC600-1)
- Commercial operating temperature baseline at maximum performance (بمقابلہEPF10K200SFC484-1N)
ڈیزائن نوٹس
Estimated: with all 9984 logic elements switching at 250 MHz in CMOS 0.22 µm, core supply current can exceed 1 A in worst-case designs. Place at least eight 0.1 µF ceramic decoupling capacitors distributed around the FBGA-484 footprint (one per two adjacent VCCINT balls), plus a single bulk 47 µF tantalum or 100 µF ceramic near the supply pins. I/O banks can be powered at 2.5 V or 3.3 V per VCCIO rail; group I/O pins by voltage to avoid mixed-voltage buses.
The FBGA-484 package exposes a thermal pad underneath; solder this pad to a continuous copper pour of at least 1 square inch on the top layer, with thermal vias to inner planes. At 1 A core current the junction-to-ambient thermal resistance is approximately 18 °C/W with the recommended land pattern, allowing ~1 W continuous dissipation in still air. For high-utilisation designs, route additional copper to inner signal layers and consider a heatsink for junction temperatures above 100 °C.
The 1.0 mm fine-line pitch on the FBGA-484 requires 0.5 mm ball pads and 0.2 mm trace/space routing; use 4 mil/4 mil design rules on the top layer with microvia-in-pad escape. Match all differential-pair lengths to ±50 mil and use length-matched serpentines between the FPGA and DDR/SDRAM/SRAM memories. Leave a continuous ground ring around the BGA to control impedance and provide a return path for high-speed I/O.
Do not omit the configuration PROM - the FLEX 10K family is SRAM-based and loses its configuration on every power-down. Tie nCONFIG to VCC through a 10 kΩ pull-up, nSTATUS and CONF_DONE to VCC through 10 kΩ pull-ups, and observe the power-on reset sequence timing in the Altera FLEX 10K handbook. Verify MSEL pin strapping for the chosen configuration mode (PS, PPS, JTAG) before first board bring-up.
Series-terminate clock outputs with 22-33 Ω resistors at the FPGA pin when driving traces longer than 50 mm to control ringing. For LVDS and clock-distribution signals, use 100 Ω differential routing with ±10% length matching and keep at least one ground trace between adjacent pairs. Place decoupling capacitors within 100 mil of every VCCIO and VCCINT ball to minimise supply-induced jitter on high-speed I/O.
تعمیل کی معلومات
RoHS/REACH/lead-free status not stated in the Verified Web Data; verify with the supplier before placing into a RoHS-controlled BOM. AEC-Q100 not applicable for this commercial-grade FPGA.
