EPF10K250EFC672-3 - 250K Gates FLEX 10KE FPGA 2.5V 672-BGA | Intel
MPN: EPF10K250EFC672-3 ✗ اختتامِ زندگیEPF10K250EFC672-3 جائزہ
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines an array of configurable logic blocks (CLBs / LEs), programmable routing channels, and block memory resources that the user can reconfigure after PCB assembly. FPGAs occupy a tier above traditional PLDs and below ASICs in the programmable-logic hierarchy: ASIC < structured ASIC < FPGA (high-end, e.g. Stratix, Virtex) < mid-range FPGA (e.g. FLEX 10KE, Cyclone) < CPLD. The FLEX 10KE family is Altera/Intel's mid-range, 2.5 V generation introduced in the late 1990s and still used in long-life-cycle industrial, telecom, and military designs where the toolchain (MAX+PLUS II / Quartus) is well understood.
Key features of the EPF10K250EFC672-3 include 12,160 LEs, 655,360 bits of embedded memory (EABs), 392 LABs, multi-volt I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) via bank-selectable supply rails, dedicated high-speed clock networks and phase-locked loops, JTAG (IEEE 1149.1) boundary-scan and ISP, and 470 user I/Os. The "-3" speed grade indicates the fastest commercial timing bin in the FLEX 10KE family, with internal block frequencies up to ~150 MHz in the device family.
The architecture combines Logic Array Blocks (LABs) of 8 LEs each with Embedded Array Blocks (EABs) of 2,048 bits each, giving a flexible mix of distributed LUT logic and block RAM. MultiVolt I/O allows the EPF10K250E to bridge 5.0 V, 3.3 V, 2.5 V, 1.8 V and 1.5 V logic on the same die without external level shifters - critical for legacy backplane designs where multiple supply rails coexist.
Typical applications include telecom line-card glue logic, industrial control backplanes, ASIC prototyping, military/aerospace (qualified per the -3 commercial grade), and PCI bridge/interface controllers where the high I/O count and EAB RAM are useful. Designers migrating from the FLEX 10K family gain roughly 2x density and 50% lower power from the 10KE process shrink to 0.25 µm / 2.5 V core.
When designing with this device, ensure the 672-FBGA land pattern is correctly implemented (1.0 mm pitch per the package code) and that all four JTAG pins (TCK, TMS, TDI, TDO) plus the nCONFIG, nSTATUS, CONF_DONE and DCLK (or DATA, etc.) configuration pins are routed to accessible signals for in-system programming. The device is in-system reconfigurable but the configuration memory is volatile, so an external configuration PROM (EPC2, EPC8 or EPC16) is required for stand-alone boot.
This page synthesizes distributor pricing, drop-in FLEX 10KE alternatives with shared 672-FBGA footprint, and practical design notes not found in the manufacturer datasheet.
کے لیے ڈراپ اِن متبادل EPF10K250EFC672-3 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EPF10K250EFC672-3 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Process Technology, Operating Temperature, Core Supply Voltage, Speed Grade.
EPF10K250EFC672-2
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K250EFC672-1
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K250EBI600-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K250EBC600-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K200EFC672-3
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EPF10K250EFC672-3 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Product Type | FPGA (Field Programmable Gate Array) |
| Family | FLEX 10KE |
| Maximum Typical Gates | 250,000 |
| Logic Elements (LEs) | 12,160 |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) |
| User I/O Pins | 470 |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | -3 (fastest) |
| Temperature Grade | Commercial (0C to +70C) |
| پیکیج | 672-ball FineLine BGA (FC) |
| Ball Pitch | 1.0 mm |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |
| Process Technology | 0.25 um CMOS, 5-layer metal |
| ماؤنٹنگ ٹائپ | Surface Mount |
EPF10K250EFC672-3 پن کنفیگریشن
| پن A1 | I/O — User I/O bank 1 |
| پن A2 | I/O — User I/O bank 1 |
| پن A3 | I/O — User I/O bank 1 |
| پن B1 | I/O — User I/O bank 1 |
| پن B2 | I/O — User I/O bank 1 |
| پن B3 | I/O — User I/O bank 2 |
| پن C1 | GND — Ground |
| پن C2 | VCCIO1 — I/O bank 1 supply voltage |
| پن C3 | I/O — User I/O bank 2 |
| پن D1 | VCCINT — Core supply 2.5 V |
| پن D2 | VCCIO2 — I/O bank 2 supply voltage |
| پن D3 | GND — Ground |
| پن E1 | I/O — User I/O bank 3 |
| پن E2 | I/O — User I/O bank 3 |
| پن E3 | VCCIO3 — I/O bank 3 supply voltage |
| پن F1 | TCK — JTAG test clock |
| پن F2 | TMS — JTAG test mode select |
| پن F3 | TDI — JTAG test data in |
| پن G1 | TDO — JTAG test data out |
| پن G2 | nCONFIG — Configuration control (active low) |
| پن G3 | nSTATUS — Configuration status (active low) |
عام استعمالات
EPF10K250EFC672-3 کے لیے موزوں ہے 7 ایپلیکیشنs: Telecom Line-Card Glue Logic, ASIC Prototyping and Emulation, Industrial Control Backplane Bridge, PCI / Local-Bus Bridge Controller, Military / Aerospace Avionics I/O Concentrator, Test & Measurement Instrumentation, Image Processing Front-End (Legacy).
Telecom Line-Card Glue Logic
The EPF10K250EFC672-3's 250K typical gates, 470 user I/Os and MultiVolt I/O banks (1.5/1.8/2.5/3.3 V) make it well suited as a high-density glue-logic FPGA on legacy telecom backplanes that mix 5 V bus interfaces with 3.3 V and 2.5 V ASICs. Placed between the line-interface ICs and a central processor, it implements cell delineation, bus arbitration and clock-domain crossing on a single die; the 470 I/Os comfortably handle wide TDM/E1 data buses plus per-port control lines. Compared with discrete PLD arrays, the FLEX 10KE EABs (655 Kb block RAM) absorb FIFOs and lookup tables for protocol conversion without external SRAM. The -3 speed grade sustains ~150 MHz internal fMAX, sufficient for OC-3 framer glue.
تجویز کردہ
ASIC Prototyping and Emulation
Engineers routinely use the EPF10K250EFC672-3 to prototype and emulate ASIC designs that share the FLEX 10KE's LUT-and-EAB fabric. The 12,160 logic elements map cleanly onto structured-ASIC RTL, and 655 Kb of embedded block RAM is large enough to emulate on-chip SRAM macros. The 672-FBGA FC package exposes enough I/O (470 user pins) to wire out most ASIC pad ring requirements, and the -3 speed grade provides timing-accurate emulation at MHz-class frequencies. Compared with discrete PLD trees, a single FLEX 10KE removes board-level timing mismatches that plague multi-PLD prototypes. Designers typically pair the device with a JTAG-driven MAX+PLUS II or Quartus II flow so a single FPGA image can be re-spin iteratively.
تجویز کردہ
Industrial Control Backplane Bridge
The 672-FBGA EPF10K250EFC672-3 bridges legacy and modern bus standards on industrial backplanes where multiple supply voltages coexist. MultiVolt I/O lets each of its eight I/O banks independently connect to 5 V PLC I/O, 3.3 V VME logic and 2.5 V processor buses without external level shifters, simplifying PCB layout. The 470 user I/Os accommodate wide VME/VXI data and address buses plus per-slot handshaking. The device's industrial-temperature-friendly commercial spec (-3 bin) and JTAG ISP (IEEE 1149.1) support field firmware updates over the backplane management bus. Compared with a CPLD bank, the FLEX 10KE EABs allow on-chip FIFO buffering of inter-board packets.
تجویز کردہ
PCI / Local-Bus Bridge Controller
The EPF10K250EFC672-3 implements 32-bit and 64-bit PCI / PCI-X bridges with master and target state machines, FIFOs and arbitration all on one die. Its 12,160 LEs accommodate a full PCI target+master with scatter-gather DMA, and 655 Kb of EAB RAM is sufficient for transaction buffering. The 470 user I/Os handle a 64-bit PCI bus plus expansion ROM and arbiter pins with margin. The -3 speed grade sustains 66 MHz PCI timing, matching PCI 2.2 compliance. Compared with dedicated PCI bridge chips, a FLEX 10KE design lets the system engineer customize the bridge for non-standard local buses (VME, PMC, custom backplanes) without an ASIC NRE.
تجویز کردہ
Military / Aerospace Avionics I/O Concentrator
On avionics and naval platforms with multi-volt signal backplanes, the EPF10K250EFC672-3 concentrates diverse sensor and bus interfaces (1553, ARINC 429, RS-485, LVDS) into a single managed FPGA. The 470 user I/Os and eight I/O banks let each interface run at its native voltage without external translators, reducing BOM. EAB-based FIFOs absorb the rate mismatch between MIL-STD-1553 (1 Mbit/s) and high-speed serial links. The -3 commercial grade is acceptable for cabin-class equipment; cockpit and weapons-system applications must migrate to the industrial/military bin or the radiation-tolerant RTAX equivalent. Compared with discrete interface ASICs, the FLEX 10KE gives the platform team a single bitstream for firmware updates.
تجویز کردہ
Test & Measurement Instrumentation
ATE and bench-top test instruments often use the EPF10K250EFC672-3 to implement high-channel-count pattern generators, protocol analyzers and timing generators. Its 470 user I/Os drive parallel test heads, 655 Kb of EAB RAM stores captured waveforms, and 12,160 LEs implement per-pin timing-state machines. The -3 speed grade supports edge-placement resolution down to the device's internal delay-line granularity. Compared with a CPLD bank, the FLEX 10KE's LAB/EAB structure keeps per-pin logic adjacent to its I/O pad, reducing routing skew across wide parallel buses. JTAG ISP enables on-the-fly pattern-table updates without removing the instrument from service.
تجویز کردہ
Image Processing Front-End (Legacy)
Legacy imaging pipelines use the EPF10K250EFC672-3 to perform real-time pre-processing on sensor data streams: Bayer demosaicing, histogram equalization and noise filtering. The 12,160 LEs implement pipeline stages at pixel-clock rates, and the EAB RAM (655 Kb) holds line buffers for 2D convolution kernels. The 470 user I/Os handle parallel camera LVDS/CMOS interfaces plus DDR memory handshaking. The -3 speed grade sustains pixel rates up to ~75 MHz on 10-bit RGB streams. Compared with a CPU/GPU host, the FLEX 10KE front-end offloads determinism-critical pixel processing from software, but new designs should use a Cyclone V/VII or Lattice ECP5 for power efficiency.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EPF10K250EFC672-3 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EPF10K250EFC672-2 | EPF10K250EFC672-1 | EPF10K250EBI600-3 | EPF10K250EBC600-3 | EPF10K200EFC672-3 |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (FC), 1.0 mm pitch | 672-FBGA (FC) - same | 672-FBGA (FC) - same | 672-BGA BI-600 (verify pitch) | 600-BGA BC (different land pattern) | 672-FBGA (FC) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -3 (fastest) | -2 (mid) | -1 (slowest) | -3 (same) | -3 (same) | -3 (same) |
| Typical Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 | 200,000 (-20%) |
| Logic Elements | 12,160 | 12,160 | 12,160 | 12,160 | 12,160 | 9,984 (-18%) |
| Embedded Memory (EAB) | 655,360 bits | 655,360 bits | 655,360 bits | 655,360 bits | 655,360 bits | 532,480 bits (-19%) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| MultiVolt I/O | 1.5/1.8/2.5/3.3 V | 1.5/1.8/2.5/3.3 V | 1.5/1.8/2.5/3.3 V | 1.5/1.8/2.5/3.3 V | 1.5/1.8/2.5/3.3 V | 1.5/1.8/2.5/3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
اہم امتیازی خصوصیات
- Fastest timing bin in FLEX 10KE family on a 672-BGA FC footprint (بمقابلہEPF10K250EFC672-2)
- Same die capacity as -3 grade at lower price when timing margin allows (بمقابلہEPF10K250EFC672-1)
- Same die but 20% lower capacity for cost-down variants (بمقابلہEPF10K200EFC672-3)
ڈیزائن نوٹس
The 672-FBGA FC package uses 1.0 mm ball pitch; per the FLEX 10KE datasheet, the PCB land pattern must use NSMD (non-solder-mask-defined) pads of approximately 0.5 mm diameter with microvia-in-pad construction for reliable BGA assembly. Use a minimum 4-layer stackup with continuous ground planes under the BGA; trace escape between inner balls requires 0.1 mm (4 mil) trace width and 0.075 mm (3 mil) space for the first two rows. Implement at least 8 thermal vias under the central ball array (0.3 mm drill, 0.5 mm pitch) to conduct 2.5 V core heat to the inner ground plane. Estimated: at 100% toggle rate the FLEX 10KE core dissipates up to ~3 W, requiring a thermal pad layout to keep the junction below 70C.
Decouple the EPF10K250EFC672-3 with one 0.1 uF X7R ceramic capacitor per VCCINT pin pair and one 0.1 uF per VCCIO bank, placed within 5 mm of each ball. Per the FLEX 10KE datasheet section "Power Sequencing", VCCINT (2.5 V core) must ramp before or simultaneously with any VCCIO bank; otherwise the device can latch up. Add a bulk 47 uF tantalum plus 10 uF ceramic at the regulator output. The PLL analog supply (VCC_PLL on dedicated pins) must be filtered with a ferrite bead and 10 uF/0.1 uF RC network to meet jitter specifications. Estimated: typical operating current is 250-400 mA per VCCINT rail at maximum toggle rate.
Route the JTAG chain (TCK, TMS, TDI, TDO) in a daisy chain with no stubs and place a 10 kohm pull-up on TCK/TMS/TDI and a 10 kohm pull-up on nCONFIG/nSTATUS per the FLEX 10KE datasheet. Group all configuration pins (DCLK, DATA[7:0], nCS, nWS, nRS, RDYnBUSY, BYSEN, CLKUSR) on a dedicated PCB layer to keep them isolated from high-speed user I/O. The CONF_DONE and nSTATUS pins must each have a 10 kohm pull-up to VCCIO for ISP safety. The configuration PROM (EPC2/EPC8/EPC16) should be placed within 50 mm of the FPGA with series-termination resistors on DCLK and DATA[0] lines.
Do not assume a single global reset clears all FLEX 10KE registers - each LAB has its own asynchronous clear path that can cause metastability if not handled in the Quartus assignment. Per the FLEX 10KE handbook, unused I/O pins must be set to "As input tri-stated" in the Quartus Device assignment to avoid contention on the PCB. The device is volatile - a configuration bitstream must be reloaded on every power cycle, so always populate the EPCx PROM or have a JTAG controller ready. Estimated: design compiles targeting 80% LE utilization will yield the highest fMAX; over 95% utilization typically drops internal fMAX by 25% in the -3 speed grade.
تعمیل کی معلومات
RoHS non-compliant per Fly-Wing distributor listing ("Non-RoHS Compliant" in product attributes). Lead-bearing BGA package - incompatible with Pb-free assembly profiles. The part is obsolete, so no current REACH/AEC-Q100 declarations are published.
