FSA2267L10X - 0.35Ω Dual SPDT Analog Switch | onsemi | Audio/Mobile
MPN: FSA2267L10X ✓ فعالFSA2267L10X جائزہ
An analog switch (also called a bilateral switch or transmission gate) is a solid-state device that uses MOSFET transistors to pass or block analog or digital signals with near-ideal behavior: low on-resistance, high off-isolation, and bidirectional current flow. Dual SPDT switches integrate two independent SPDT poles in a single IC, and are widely used in audio jack detection, headphone/microphone multiplexing, USB signal routing, and SIM/MUX switching in mobile phones. The FSA2267L10X belongs to the broader analog switch IC category, which sits hierarchically within interface ICs and signal- conditioning ICs in the mobile platform power-tree.
Key features include 2.7 V typical RON, 25 pC charge injection, 50 MHz -3 dB bandwidth, and 60 dB off-isolation at 1 MHz, plus a dedicated enable pin for sub-microamp standby. The 10-MicroPak footprint is only 1.6 mm × 1.3 mm, making it one of the smallest dual SPDT switches in the onsemi portfolio and a drop-in alternative to the FSA2267AL10X (slightly different supply range).
Architecturally, each switch uses parallel N-MOSFET and P-MOSFET pass transistors with charge-pump boosting, achieving rail-to-rail signal swing at the I/O pins while keeping RON low across the input common-mode range. Typical applications include smartphone headset audio switching, portable media player line-out routing, and USB 2.0 high-speed signal multiplexing.
When designing with this part, place decoupling capacitors within 2 mm of VCC, keep high-frequency analog traces short, and respect the absolute maximum rating of 4.6 V on VCC to avoid latch-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
کے لیے ڈراپ اِن متبادل FSA2267L10X — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
FSA2267AL10X
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
FSA2271TUMX
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
FSA2269TSUMX
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
NLAS5223BLMNR2G
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
FSA223MUX
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
FSA2267L10X-F113
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
FSA2267L10X زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| فنکشن | Dual SPDT Analog Switch (2-channel) |
| On Resistance (RON) | 0.35 Ω typical at VCC = 2.7 V |
| On Resistance Flatness | 0.5 Ω typical |
| Supply Voltage (VCC) | 1.65 V to 3.6 V |
| Quiescent Current (ICC) | 1 µA typical |
| Switch Off-Leakage | < 0.5 nA |
| Charge Injection | 25 pC typical |
| -3 dB Bandwidth | 50 MHz |
| Off-Isolation @ 1 MHz | 60 dB |
| Crosstalk @ 1 MHz | -60 dB |
| آپریٹنگ درجہ حرارت | -40 °C to +85 °C |
| پیکیج | 10-MicroPak (UQFN-10, 1.6 × 1.3 mm) with EP |
| ماؤنٹنگ ٹائپ | Surface Mount |
| MSL لیول | 1 |
| RoHS اسٹیٹس | Compliant |
| این ایبل پن | Yes (active-high) |
FSA2267L10X پن کنفیگریشن
| پن 1 | COM1 — Common terminal of switch 1 |
| پن 2 | NO1 — Normally-open terminal of switch 1 |
| پن 3 | NC1 — Normally-closed terminal of switch 1 |
| پن 4 | GND — Ground reference |
| پن 5 | EN — Active-high enable for both switches |
| پن 6 | NC2 — Normally-closed terminal of switch 2 |
| پن 7 | NO2 — Normally-open terminal of switch 2 |
| پن 8 | COM2 — Common terminal of switch 2 |
| پن 9 | VCC — Power supply (1.65 V to 3.6 V) |
| پن 10 | EP — Exposed pad - thermal and ground, must be soldered to PCB |
عام استعمالات
FSA2267L10X کے لیے موزوں ہے 6 ایپلیکیشنs: Smartphone Headset Audio Switching, USB 2.0 High-Speed Signal Multiplexing, Portable Media Player Line-Out Routing, SIM Card / Data Line Multiplexing, Audio Codec Signal Path Multiplexing, Portable Medical Audio Monitoring Devices.
Smartphone Headset Audio Switching
The FSA2267L10X is purpose-designed for routing stereo headphone and mono microphone signals in smartphone audio jacks. Its 0.35 Ω on-resistance preserves dynamic range and channel balance, while 60 dB off-isolation at 1 MHz suppresses crosstalk between left and right channels. The part's 1 µA quiescent current keeps standby drain negligible, an important metric for always-listening mobile platforms. The 10-MicroPak 1.6 × 1.3 mm footprint fits inside the tightest headset-interface PCBs and leaves board area for the audio codec and Class-D amplifier. Charge injection of 25 pC is well below the audibility threshold, so headphone pop-and-click during channel switching is suppressed.
تجویز کردہ
USB 2.0 High-Speed Signal Multiplexing
The FSA2267L10X's 50 MHz -3 dB bandwidth easily passes the 240 MHz fundamental of USB 2.0 high-speed signalling, and its 0.35 Ω RON minimizes insertion loss on the D+/D- data lines. In mobile and tablet designs, this switch multiplexes USB data between the application processor, an external connector, and a charging IC. The bidirectional MOSFET pass transistors handle the half-duplex differential pair without distortion. The 25 pC charge injection keeps the data-line common-mode voltage stable during channel hand-off, reducing link re-training events. Surface-mount MicroPak construction also supports the high-density BGA layouts common under modern SoCs.
تجویز کردہ
Portable Media Player Line-Out Routing
Battery-powered portable media players use the FSA2267L10X to switch between headphone-amplifier output and line-level output. The wide 1.65 V to 3.6 V supply range lets a single part serve both 1.8 V Class-G amp rails and 3.3 V codec rails. Low off-leakage (<0.5 nA) prevents DC bias buildup on floating outputs during channel changes, which is critical for preserving audio stage DC-blocking capacitor charge. The 1 µA quiescent current extends playback time on small lithium cells, and the tiny 10-MicroPak footprint fits on the smallest portable player mainboards. onsemi specifies the part for THD+N well below audibility at line-level signal amplitudes.
تجویز کردہ
SIM Card / Data Line Multiplexing
Multi-SIM mobile handsets use the FSA2267L10X to multiplex data and control signals between the baseband processor and two SIM card slots. The bidirectional switch structure passes SIM-IO, SIM-RST, and SIM-CLK signals at full 5 MHz SIM clock rates without ringing. Low RON ensures voltage margin at the SIM card during high-current programming pulses. The enable pin allows the baseband to power-gate the SIM interface during deep sleep, taking quiescent current to sub-microamp levels. The compact UQFN-10 footprint leaves room for ESD protection diodes and decoupling capacitors in the SIM-card socket area.
تجویز کردہ
Audio Codec Signal Path Multiplexing
External audio accessories and docking stations use the FSA2267L10X to multiplex between an internal codec and an accessory-line input. The 60 dB off-isolation at 1 MHz prevents the accessory path from loading the internal codec output when disconnected. The ultra-low 0.35 Ω RON preserves the codec's noise floor and dynamic range, which matters for high-resolution 24-bit/192 kHz audio paths. The 1.65 V minimum supply supports direct connection to 1.8 V codec supplies without level shifters. The 10-MicroPak package simplifies layout in space-constrained dock and accessory designs where every square millimetre counts.
تجویز کردہ
Portable Medical Audio Monitoring Devices
Portable digital stethoscopes and electronic auscultation devices use the FSA2267L10X to route amplified body-sound signals between analog preprocessing and digital recording channels. The part's low on-resistance preserves the 0.1 Hz to 2 kHz diagnostic bandwidth without attenuation, while the 1 µA quiescent current extends battery life on coin-cell powered units. The 25 pC charge injection ensures clean channel transitions without audible artefacts in recorded samples. The 10-MicroPak footprint supports miniaturized form factors required for wearable diagnostic patches. onsemi specifies this part for general-purpose medical platforms; consult factory for FDA-cleared reference designs.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا FSA2267L10X — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | FSA2267AL10X | FSA2271TUMX | FSA2269TSUMX | NLAS5223BLMNR2G | FSA223MUX |
|---|---|---|---|---|---|---|
| Package | 10-MicroPak (UQFN-10) | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same |
| Brand | onsemi | onsemi | onsemi | onsemi | onsemi | onsemi |
| Supply Voltage | 1.65 V to 3.6 V | 2.3 V to 4.3 V | 1.65 V to 3.6 V | 1.65 V to 4.3 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V |
| Channels | 2 SPDT | 2 SPDT | 2 SPDT | 2 SPDT | 2 SPDT | 2 SPDT |
| Quiescent Current | 1 µA typ | 1 µA typ | 1 µA typ | 1 µA typ | 1 µA typ | 1 µA typ |
| Enable Pin | Yes (active-high) | Yes (active-high) | Yes | Yes | Yes | Yes |
اہم امتیازی خصوصیات
- Lowest on-resistance in onsemi 10-MicroPak dual SPDT family (بمقابلہNLAS5223BLMNR2G)
- Wider low-end supply voltage than FSA2267AL10X (بمقابلہFSA2267AL10X)
- Compact 1.6 × 1.3 mm footprint (بمقابلہFSA2271TUMX)
ڈیزائن نوٹس
Place a 0.1 µF X7R decoupling capacitor within 2 mm of the VCC pin, with a 10 µF bulk capacitor on the same supply rail. The FSA2267L10X draws only 1 µA quiescent, but the charge-pump that drives the MOSFET gates generates transient current spikes during switching; insufficient decoupling can couple these spikes into adjacent audio paths.
The exposed pad (pin 10) MUST be soldered to a PCB ground pad for thermal dissipation and electrical reference. Use an array of thermal vias to the inner ground plane. Keep high-frequency analog traces (COM1, COM2, NOx, NCx) short and matched in length to minimize channel-to-channel skew in stereo audio applications.
When routing USB 2.0 high-speed differential pairs through the switch, maintain 90 Ω differential impedance on the COM and NO/NC traces. The 50 MHz -3 dB bandwidth is sufficient for USB 2.0 but not USB 3.0 SuperSpeed; do not use this part for 5 Gbps paths. Place the switch as close as possible to the connector to minimize stub length.
Do not exceed 4.6 V on VCC - the part is not 5 V tolerant. Do not apply signals to NO/NC/COM pins before VCC is present, as this can trigger SCR latch-up in the CMOS pass transistors. Always enable the part (EN high) before applying analog signals to avoid charge-injection artefacts.
تعمیل کی معلومات
RoHS and REACH compliant per onsemi product page. Not AEC-Q100 qualified; for automotive applications consult onsemi automotive-grade portfolio.
