FSA2267L10X - 0.35Ω Dual SPDT Analog Switch | onsemi | Audio/Mobile
MPN: FSA2267L10X ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0.92 | $0.92 |
| 10 | $0.78 | $7.80 |
| 100 | $0.59 | $59.00 |
| 500 | $0.48 | $240.00 |
| 1,000 | $0.39 | $390.00 |
FSA2267L10X Overview
An analog switch (also called a bilateral switch or transmission gate) is a solid-state device that uses MOSFET transistors to pass or block analog or digital signals with near-ideal behavior: low on-resistance, high off-isolation, and bidirectional current flow. Dual SPDT switches integrate two independent SPDT poles in a single IC, and are widely used in audio jack detection, headphone/microphone multiplexing, USB signal routing, and SIM/MUX switching in mobile phones. The FSA2267L10X belongs to the broader analog switch IC category, which sits hierarchically within interface ICs and signal- conditioning ICs in the mobile platform power-tree.
Key features include 2.7 V typical RON, 25 pC charge injection, 50 MHz -3 dB bandwidth, and 60 dB off-isolation at 1 MHz, plus a dedicated enable pin for sub-microamp standby. The 10-MicroPak footprint is only 1.6 mm × 1.3 mm, making it one of the smallest dual SPDT switches in the onsemi portfolio and a drop-in alternative to the FSA2267AL10X (slightly different supply range).
Architecturally, each switch uses parallel N-MOSFET and P-MOSFET pass transistors with charge-pump boosting, achieving rail-to-rail signal swing at the I/O pins while keeping RON low across the input common-mode range. Typical applications include smartphone headset audio switching, portable media player line-out routing, and USB 2.0 high-speed signal multiplexing.
When designing with this part, place decoupling capacitors within 2 mm of VCC, keep high-frequency analog traces short, and respect the absolute maximum rating of 4.6 V on VCC to avoid latch-up. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for FSA2267L10X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
FSA2267AL10X
✅ Drop-In📋 Reference alternative (not in catalog)
FSA2271TUMX
✅ Drop-In📋 Reference alternative (not in catalog)
FSA2269TSUMX
✅ Drop-In📋 Reference alternative (not in catalog)
NLAS5223BLMNR2G
✅ Drop-In📋 Reference alternative (not in catalog)
FSA223MUX
✅ Drop-In📋 Reference alternative (not in catalog)
FSA2267L10X-F113
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
FSA2267L10X Maximum Ratings & Electrical Characteristics
| Function | Dual SPDT Analog Switch (2-channel) |
| On Resistance (RON) | 0.35 Ω typical at VCC = 2.7 V |
| On Resistance Flatness | 0.5 Ω typical |
| Supply Voltage (VCC) | 1.65 V to 3.6 V |
| Quiescent Current (ICC) | 1 µA typical |
| Switch Off-Leakage | < 0.5 nA |
| Charge Injection | 25 pC typical |
| -3 dB Bandwidth | 50 MHz |
| Off-Isolation @ 1 MHz | 60 dB |
| Crosstalk @ 1 MHz | -60 dB |
| Operating Temperature | -40 °C to +85 °C |
| Package | 10-MicroPak (UQFN-10, 1.6 × 1.3 mm) with EP |
| Mounting Type | Surface Mount |
| MSL Level | 1 |
| RoHS Status | Compliant |
| Enable Pin | Yes (active-high) |
FSA2267L10X Pin Configuration
| Pin 1 | COM1 — Common terminal of switch 1 |
| Pin 2 | NO1 — Normally-open terminal of switch 1 |
| Pin 3 | NC1 — Normally-closed terminal of switch 1 |
| Pin 4 | GND — Ground reference |
| Pin 5 | EN — Active-high enable for both switches |
| Pin 6 | NC2 — Normally-closed terminal of switch 2 |
| Pin 7 | NO2 — Normally-open terminal of switch 2 |
| Pin 8 | COM2 — Common terminal of switch 2 |
| Pin 9 | VCC — Power supply (1.65 V to 3.6 V) |
| Pin 10 | EP — Exposed pad - thermal and ground, must be soldered to PCB |
Typical Applications
FSA2267L10X is suitable for 6 applications: Smartphone Headset Audio Switching, USB 2.0 High-Speed Signal Multiplexing, Portable Media Player Line-Out Routing, SIM Card / Data Line Multiplexing, Audio Codec Signal Path Multiplexing, Portable Medical Audio Monitoring Devices.
Smartphone Headset Audio Switching
The FSA2267L10X is purpose-designed for routing stereo headphone and mono microphone signals in smartphone audio jacks. Its 0.35 Ω on-resistance preserves dynamic range and channel balance, while 60 dB off-isolation at 1 MHz suppresses crosstalk between left and right channels. The part's 1 µA quiescent current keeps standby drain negligible, an important metric for always-listening mobile platforms. The 10-MicroPak 1.6 × 1.3 mm footprint fits inside the tightest headset-interface PCBs and leaves board area for the audio codec and Class-D amplifier. Charge injection of 25 pC is well below the audibility threshold, so headphone pop-and-click during channel switching is suppressed.
Recommended
USB 2.0 High-Speed Signal Multiplexing
The FSA2267L10X's 50 MHz -3 dB bandwidth easily passes the 240 MHz fundamental of USB 2.0 high-speed signalling, and its 0.35 Ω RON minimizes insertion loss on the D+/D- data lines. In mobile and tablet designs, this switch multiplexes USB data between the application processor, an external connector, and a charging IC. The bidirectional MOSFET pass transistors handle the half-duplex differential pair without distortion. The 25 pC charge injection keeps the data-line common-mode voltage stable during channel hand-off, reducing link re-training events. Surface-mount MicroPak construction also supports the high-density BGA layouts common under modern SoCs.
Recommended
Portable Media Player Line-Out Routing
Battery-powered portable media players use the FSA2267L10X to switch between headphone-amplifier output and line-level output. The wide 1.65 V to 3.6 V supply range lets a single part serve both 1.8 V Class-G amp rails and 3.3 V codec rails. Low off-leakage (<0.5 nA) prevents DC bias buildup on floating outputs during channel changes, which is critical for preserving audio stage DC-blocking capacitor charge. The 1 µA quiescent current extends playback time on small lithium cells, and the tiny 10-MicroPak footprint fits on the smallest portable player mainboards. onsemi specifies the part for THD+N well below audibility at line-level signal amplitudes.
Recommended
SIM Card / Data Line Multiplexing
Multi-SIM mobile handsets use the FSA2267L10X to multiplex data and control signals between the baseband processor and two SIM card slots. The bidirectional switch structure passes SIM-IO, SIM-RST, and SIM-CLK signals at full 5 MHz SIM clock rates without ringing. Low RON ensures voltage margin at the SIM card during high-current programming pulses. The enable pin allows the baseband to power-gate the SIM interface during deep sleep, taking quiescent current to sub-microamp levels. The compact UQFN-10 footprint leaves room for ESD protection diodes and decoupling capacitors in the SIM-card socket area.
Recommended
Audio Codec Signal Path Multiplexing
External audio accessories and docking stations use the FSA2267L10X to multiplex between an internal codec and an accessory-line input. The 60 dB off-isolation at 1 MHz prevents the accessory path from loading the internal codec output when disconnected. The ultra-low 0.35 Ω RON preserves the codec's noise floor and dynamic range, which matters for high-resolution 24-bit/192 kHz audio paths. The 1.65 V minimum supply supports direct connection to 1.8 V codec supplies without level shifters. The 10-MicroPak package simplifies layout in space-constrained dock and accessory designs where every square millimetre counts.
Recommended
Portable Medical Audio Monitoring Devices
Portable digital stethoscopes and electronic auscultation devices use the FSA2267L10X to route amplified body-sound signals between analog preprocessing and digital recording channels. The part's low on-resistance preserves the 0.1 Hz to 2 kHz diagnostic bandwidth without attenuation, while the 1 µA quiescent current extends battery life on coin-cell powered units. The 25 pC charge injection ensures clean channel transitions without audible artefacts in recorded samples. The 10-MicroPak footprint supports miniaturized form factors required for wearable diagnostic patches. onsemi specifies this part for general-purpose medical platforms; consult factory for FDA-cleared reference designs.
Recommended
Recommended Products Summary
Engineering reference data for FSA2267L10X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | FSA2267AL10X | FSA2271TUMX | FSA2269TSUMX | NLAS5223BLMNR2G | FSA223MUX |
|---|---|---|---|---|---|---|
| Package | 10-MicroPak (UQFN-10) | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same | 10-MicroPak (UQFN-10) - same |
| Brand | onsemi | onsemi | onsemi | onsemi | onsemi | onsemi |
| Supply Voltage | 1.65 V to 3.6 V | 2.3 V to 4.3 V | 1.65 V to 3.6 V | 1.65 V to 4.3 V | 1.65 V to 3.6 V | 1.65 V to 3.6 V |
| Channels | 2 SPDT | 2 SPDT | 2 SPDT | 2 SPDT | 2 SPDT | 2 SPDT |
| Quiescent Current | 1 µA typ | 1 µA typ | 1 µA typ | 1 µA typ | 1 µA typ | 1 µA typ |
| Enable Pin | Yes (active-high) | Yes (active-high) | Yes | Yes | Yes | Yes |
Key Differentiators
- Lowest on-resistance in onsemi 10-MicroPak dual SPDT family (vs NLAS5223BLMNR2G)
- Wider low-end supply voltage than FSA2267AL10X (vs FSA2267AL10X)
- Compact 1.6 × 1.3 mm footprint (vs FSA2271TUMX)
Design Notes
Place a 0.1 µF X7R decoupling capacitor within 2 mm of the VCC pin, with a 10 µF bulk capacitor on the same supply rail. The FSA2267L10X draws only 1 µA quiescent, but the charge-pump that drives the MOSFET gates generates transient current spikes during switching; insufficient decoupling can couple these spikes into adjacent audio paths.
The exposed pad (pin 10) MUST be soldered to a PCB ground pad for thermal dissipation and electrical reference. Use an array of thermal vias to the inner ground plane. Keep high-frequency analog traces (COM1, COM2, NOx, NCx) short and matched in length to minimize channel-to-channel skew in stereo audio applications.
When routing USB 2.0 high-speed differential pairs through the switch, maintain 90 Ω differential impedance on the COM and NO/NC traces. The 50 MHz -3 dB bandwidth is sufficient for USB 2.0 but not USB 3.0 SuperSpeed; do not use this part for 5 Gbps paths. Place the switch as close as possible to the connector to minimize stub length.
Do not exceed 4.6 V on VCC - the part is not 5 V tolerant. Do not apply signals to NO/NC/COM pins before VCC is present, as this can trigger SCR latch-up in the CMOS pass transistors. Always enable the part (EN high) before applying analog signals to avoid charge-injection artefacts.
Compliance Information
RoHS and REACH compliant per onsemi product page. Not AEC-Q100 qualified; for automotive applications consult onsemi automotive-grade portfolio.
