MC33912G5ACR2 - LIN SBC, 2x LDO, DC Motor Predriver | NXP
MPN: MC33912G5ACR2 ✓ فعالMC33912G5ACR2 جائزہ
Key specifications include a 5.5 V to 27 V supply range (5.5 V to 18 V for serial operation), 4.5 mA typical supply current, -40 °C to +125 °C operating temperature, and integrated IEC61000-4-2 ±6 kV ESD protection on the LIN pin. The SBC combines physical-layer LIN with analog watchdogs, a window watchdog, cyclic-sense wake-up, and a configurable fail-safe state machine - functions that would otherwise require four to five discrete ICs in a body-electronic module.
The device's linear regulator outputs (V1: 5.0 V at 60 mA continuous / 200 mA peak, V2: 5.0 V at 20 mA / 200 mA peak) supply the MCU and external sensors directly from the 12 V automotive bus. Its high-side / low-side motor pre-driver supports up to 1.0 A continuous load current, while the Isense differential amplifier and analog multiplexer expose battery voltage, internal temperature, V1/V2 rail voltages and external analog inputs (L1-L4) over SPI for ECU diagnostics.
Architecturally, the MC33912G5ACR2 uses a 32-bit SPI interface (max 4 MHz), an internal bandgap reference, and three low-power modes (Normal, Stop with limited V1 current, and Sleep with cyclic-sense wake-up) - all selectable via the SPI command set. The Enhanced EMC (G5) variant improves LIN ESD to ±6 kV contact and adds ISO7637 3b transient immunity compared with the base MC33912.
Typical applications include automotive door modules (window lift, mirror adjust, door lock), seat-position motors, body controllers, steering-column switches, and HVAC flap motors, all requiring a regulated 5 V rail plus LIN connectivity. The pre-driver can also drive small relays and 5 V / 12 V lamps, enabling one-chip solution designs.
When designing with the MC33912G5ACR2, derate the pre-driver to 0.7 A at 125 °C and follow NXP AN2465 layout practice: keep the LIN bus pin's protection network within 10 mm of the connector, and place the V1 / V2 bulk capacitors' ground return close to the LQFP exposed pad. The 32-LQFP-EP package provides a thermal resistance around 38 °C/W with a properly soldered exposed pad.
This page consolidates distributor pricing, drop-in same-brand and cross-brand alternatives, and practical EMC / thermal guidance not found in any single manufacturer document.
کے لیے ڈراپ اِن متبادل MC33912G5ACR2 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MC33912G5ACR2 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Function, Mounting Type, Operating Temperature, Package, RoHS Status.
MC33912BACR2
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MC33912G5AEF
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MC33912G5AFR2
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
TLX9062-Q1
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
UJA1076TW/3V3
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MC33912G5ACR2 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| فنکشن | LIN System Basis Chip with DC Motor Pre-driver and Current Sense |
| Supply Voltage Range | 5.5 V to 27 V (serial comm. 5.5 V to 18 V) |
| Typical Supply Current | 4.5 mA |
| آپریٹنگ درجہ حرارت | -40 °C to +125 °C |
| LDO Regulator 1 (V1) Output | 5.0 V, 60 mA continuous / 200 mA peak |
| LDO Regulator 2 (V2) Output | 5.0 V, 20 mA continuous / 200 mA peak |
| LIN Transceiver Standard | LIN 2.0 / 2.1 / SAE J2602 |
| LIN ESD (IEC 61000-4-2 contact) | ±6.0 kV minimum |
| Motor Pre-driver Current | Up to 1.0 A (high-side / low-side) |
| Current Sense Amplifier | Differential Isense H/L inputs with selectable gain |
| SPI Interface | 32-bit, up to 4 MHz |
| پیکیج | 32-LQFP (7x7 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Packaging | Tape & Reel (TR) |
| RoHS اسٹیٹس | Compliant (Pb-free) |
MC33912G5ACR2 پن کنفیگریشن
| پن 1 | RXD — LIN bus receive output to MCU (open-drain) |
| پن 2 | TXD — LIN bus transmit input from MCU |
| پن 3 | LIN — LIN bus physical layer pin |
| پن 4 | VBAT — Battery supply input (5.5 V - 27 V) |
| پن 5 | GND — Ground reference |
| پن 6 | V1 — 5 V LDO output 1 (60 mA continuous) |
| پن 7 | V2 — 5 V LDO output 2 (20 mA continuous) |
| پن 8 | RST — Reset output to MCU |
| پن 9 | CS — Chip Select (SPI active low) |
| پن 10 | SCLK — SPI clock input |
| پن 11 | MOSI — SPI master-out-slave-in data |
| پن 12 | MISO — SPI master-in-slave-out data |
| پن 13 | INT — Interrupt output to MCU |
| پن 14 | L1 — Wake-up input 1 / analog input |
| پن 15 | L2 — Wake-up input 2 / analog input |
| پن 16 | L3 — Wake-up input 3 / analog input |
| پن 17 | L4 — Wake-up input 4 / analog input |
| پن 18 | HS — High-side motor pre-driver output |
| پن 19 | LS — Low-side motor pre-driver output |
| پن 20 | ISENSEH — Current-sense differential amplifier high input |
| پن 21 | ISENSEL — Current-sense differential amplifier low input |
| پن 22 | VSENSE — Current-sense amplifier reference input |
| پن 23 | SOC — State-of-charge / battery sense input |
| پن 24 | WAKE — Wake-up input (high-voltage) |
| پن 25 | EN — Enable input (high-voltage) |
| پن 26 | BK — Battery switch input |
| پن 27 | TEMP — Internal temperature sensor output |
| پن 28 | VCC — Internal 5 V regulator (decoupling) |
| پن 29 | VDD — MCU I/O reference supply |
| پن 30 | OSC — Oscillator input |
| پن 31 | NC — Not connected |
| پن 32 | EPAD — Exposed thermal pad (must be soldered to GND plane) |
عام استعمالات
MC33912G5ACR2 کے لیے موزوں ہے 6 ایپلیکیشنs: Automotive Door Module (Window Lift / Mirror Adjust), Seat-Position Motor Control, Body Control Module LIN Sub-node, Steering-Column Switch Module, HVAC Flap-Motor Actuator, Power Lift-Gate / Trunk-Lid Relay Control.
Automotive Door Module (Window Lift / Mirror Adjust)
The MC33912G5ACR2 fits automotive door-module designs because it integrates the LIN 2.0/2.1/SAEJ2602 transceiver, two 5 V LDOs (60 mA MCU + 20 mA sensor rail), and a 1 A high-side/low-side motor pre-driver in one 32-LQFP. Why this combination works: a single LIN bus transaction from the BCM can command window lift, mirror-fold, or door-lock motors while the on-chip Isense amplifier (selectable gain, internal MUX) reports motor current back over SPI for anti-pinch diagnostics. Performance trade-off: the 32-LQFP exposed pad (≈38 °C/W theta_JA on a 4-layer board) allows the SBC to dissipate up to 1 W continuously without heatsinking, but at 1 A pre-driver current the SBC must be placed adjacent to the motor connector to keep EMI loop area small.
تجویز کردہ
Seat-Position Motor Control
The MC33912G5ACR2 powers multi-motor seat-position modules through its LIN tranceiver plus independent DC motor pre-driver. Engineers use V1 (5 V / 60 mA) to feed the host MCU and V2 (5 V / 20 mA peak) to feed position Hall sensors; the pre-driver switches each seat motor in H-bridge configuration while the on-chip window watchdog ensures ASIL-rated safe state on MCU lock-up. Performance trade-off: at 0.5 A average motor current, the LQFP-EP allows the SBC to share the same heat-spreader copper flood with adjacent load drivers, simplifying the seat-floor PCB layout without auxiliary cooling.
تجویز کردہ
Body Control Module LIN Sub-node
Acting as a sub-node on the BCM's LIN bus, the MC33912G5ACR2 brings regulated 5 V rails, wake-up handling via L1-L4 dedicated inputs, and a high-side/low-side pre-driver for relay-driven loads such as seat heaters or interior lighting. Why it fits: cyclic-sense wake-up current is below 30 µA (per NXP datasheet), allowing sustained battery park-mode operation of the entire door-network node. Performance trade-off: the Enhanced-EMC G5 LIN ESD rating (±6 kV IEC61000-4-2) eliminates the external TVS, but the BCM designer must still apply NXP AN2465 LIN track-layout rules to qualify for OEM EMC.
تجویز کردہ
Steering-Column Switch Module
Steering-column switches need isolated LIN connectivity with deterministic wake-up behavior when the driver pushes a button. The MC33912G5ACR2's cyclic-sense wake-up plus L1-L4 direct-wake inputs are tuned for this use case: pressing any switch triggers a wake-up event which the SBC then commits to LIN bus, all while keeping the entire node consuming less than 100 µA while parked. Performance trade-off: the 32-LQFP-EP 7x7 mm footprint lets four MC33912 instances (column-right, column-left, wiper, indicator) share a single small PCB behind the steering wheel without thermal problems.
تجویز کردہ
HVAC Flap-Motor Actuator
In HVAC damper actuators, the MC33912G5ACR2 supplies the LIN interface plus a small DC motor drive (0.3-0.5 A typical). Why it fits: the on-chip differential Isense amplifier directly reads a low-side shunt, sending motor-current telemetry back to the BCM for stall/over-current diagnostics. Performance trade-off: the integrated LIN + LDO + pre-driver combination replaces 3 discrete ICs, reducing BOM cost by approximately 25-30% versus a discrete implementation. Need a higher-current HVAC blower motor? Pair this SBC with an external H-bridge such as the NXP MC33899.
تجویز کردہ
Power Lift-Gate / Trunk-Lid Relay Control
Lift-gate control modules require both LIN-connected sensor/button interfaces and multi-channel relay drive. The MC33912G5ACR2's pre-driver plus L1-L4 wake inputs make it a one-chip solution when paired with external logic-level MOSFETs or small automotive relays. Why it fits: the on-chip 32-bit SPI bus reads back VBAT, V1/V2 voltages, MCU temperature and L1-L4 state via an internal analog MUX, enabling end-of-line diagnostics. Performance trade-off: the 32-LQFP part feels comfortable when sourced through the 12 V lift-gate harness, but at full VBAT = 27 V continuous and 0.5 A pre-driver load the SBC must be derated to 0.7 A; never use it as the primary high-current lift-gate motor drive.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا MC33912G5ACR2 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | MC33912BACR2 | MC33912G5AEF | MC33912G5AFR2 | TLX9062-Q1 | UJA1076TW/3V3 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Texas Instruments | NXP Semiconductors |
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) |
| Supply Voltage | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | ||
| LIN ESD (kV) | ±6 kV contact (G5 Enhanced EMC) | ±4 kV (no Enhanced EMC) | ±8 kV (TI internal TVS) | ±6 kV contact | ||
| LDO Current (MCU rail) | 60 mA continuous | 60 mA continuous | 100 mA continuous | 100 mA continuous | ||
| DC Motor Pre-Driver Current | 1.0 A | 1.0 A | 0.5 A | Not present | ||
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | ||
| AEC-Q100 | Yes | Yes | Yes | Yes |
اہم امتیازی خصوصیات
- Enhanced-EMC ±6 kV LIN ESD without external TVS (بمقابلہMC33912BACR2)
- Higher continuous MCU LDO current than competing TI SBC (بمقابلہTLX9062-Q1)
- Integrated 1.0 A motor pre-driver eliminates external H-bridge (بمقابلہUJA1076TW/3V3)
ڈیزائن نوٹس
Per NXP AN2465 EMC guidelines, route the LIN trace on the top layer with a continuous 4 mm clearance to chassis ground. The 33 Ω series resistor and parallel TVS (e.g. PESD1LIN) must sit within 10 mm of the connector. Without this layout practice the Enhanced-EMC ±6 kV ESD rating can drop by 2-3 kV in real OEM chamber testing.
Estimated thermal resistance from junction to ambient on a JEDEC EIA/JESD51 4-layer test board with a soldered exposed pad is approximately 38 °C/W. At VBAT = 14 V and 1.0 A pre-driver current, the SBC dissipates about 0.5 W internally, raising junction temperature to roughly 65 °C above ambient. Above 0.8 A continuous at 125 °C the internal thermal protection will throttle; either derate the pre-driver current or expand the copper flood beneath the EPAD.
Place a 47 µF / 50 V X7R ceramic capacitor (or 100 µF electrolytic in parallel with 100 nF) on the VBAT pin within 5 mm of the package. The bulk capacitor absorbs ISO7637 3a/3b transient energy that would otherwise collapse V1 / V2 and reset the host MCU. V1 and V2 each require a 1 µF X7R cap placed within 3 mm of their respective pins.
تعمیل کی معلومات
RoHS and REACH compliant per NXP product page. AEC-Q100 Grade 1 automotive qualified for -40 °C to +125 °C. Halogen-free status not explicitly stated in the verified web data - confirm via NXP environmental certificate.
