MC8641VU1333JE - PowerPC e600 MPU 1.333GHz 994-FCCBGA | NXP
MPN: MC8641VU1333JE ✓ فعالMC8641VU1333JE جائزہ
A microprocessor (MPU) in the Power Architecture family integrates the CPU core, memory controller, high-speed serial interfaces, and platform glue logic into a single System-on-Chip. The e600 implementation is particularly well-suited to embedded networking, telecom, and storage workloads that benefit from AltiVec SIMD acceleration and deterministic interrupt behavior. The MC8641VU1333JE in the FCCBGA package is a thermally enhanced variant intended for industrial temperature (0 to 105 C) deployments with extended longevity programs.
Key features of this part include a 32-bit Power Architecture core with 32 KB L1 instruction and 32 KB L1 data caches, a 1 MB backside L2 cache, integrated DDR1/DDR2 memory controller with ECC, dual Gigabit Ethernet, dual PCI Express controllers, dual SRIO lanes, four DMA channels, dual I2C, DUART, and GPIO. Operating voltage is 1.05 V core (per Mouser SKU description "G8 REV3.0 1.05V 105C"), with I/O at 1.5/1.8/2.5/3.3 V and a 533 MHz MPX/Local Bus. The device is qualified for the 0 C to 105 C commercial extended temperature range per Revision 3 silicon.
The MC8641VU1333JE fits embedded designs that need deterministic PowerPC processing with high-bandwidth I/O, including networking line cards, storage controllers, defense/aerospace compute platforms, and industrial control SBCs. AltiVec acceleration delivers strong DSP-like performance for media transcoding or packet inspection. When designing with FCCBGA, plan for high-layer-count PCB stack-up, controlled-impedance SRIO/PCIe routing, and a thermal management strategy appropriate to the sealed ceramic package.
This page synthesizes distributor pricing, same-family variants, and practical design considerations not consolidated on the manufacturer datasheet cover page. For a drop-in alternative, evaluate MC8641VU1500KE (1.5 GHz) or the dual-core MC8641D variants before committing to a board respin.
کے لیے ڈراپ اِن متبادل MC8641VU1333JE — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MC8641VU1333JE (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Ethernet, PCI Express, Operating Temperature, Core Architecture.
MC8641VU1500KE
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MC8641DHX1333JE
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MC8641DHX1500KE
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MC8641DVU1000GE
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MC8641DVJ1333JE
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MC8641VU1333JE زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Core Architecture | PowerPC e600 |
| Series | MPC86xx |
| Core Count | 1 |
| ڈیٹا بس چوڑائی | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 1 MB (backside) |
| SIMD Engine | AltiVec |
| Core Voltage | 1.05 V |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | Dual Gigabit Ethernet MAC |
| PCI Express | Yes (dual controllers) |
| Serial RapidIO (SRIO) | Yes |
| Local Bus / MPX | 533 MHz |
| آپریٹنگ درجہ حرارت | 0 C to +105 C |
| Silicon Revision | Rev 3.0 (G8) |
| پیکیج | 994-FCCBGA (33 x 33 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount (Flip-Chip BGA) |
MC8641VU1333JE 994-fccbga (33 x 33 mm) پن کنفیگریشن گائیڈ
MC8641VU1333JE (994-fccbga (33 x 33 mm) پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں MC8641VU1333JE.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
MC8641VU1333JE کے لیے موزوں ہے 6 ایپلیکیشنs: Networking Line Cards, Storage Controllers and RAID Adapters, Defense and Aerospace Embedded Compute, Industrial Single-Board Computers, Telecom Baseband and DSP Coprocessing, Legacy Medical Imaging Controllers.
Networking Line Cards
The MC8641VU1333JE is well-suited to networking line-card designs because its dual Gigabit Ethernet MACs, dual PCI Express controllers, and dual Serial RapidIO ports map directly onto typical switch-fabric and NPU interconnect topologies. The 1.333 GHz e600 core with AltiVec accelerates packet classification, route lookup, and deep-payload inspection without offloading to external accelerators. At 1.05 V core and 0 to 105 C operating temperature, the part tolerates the thermal envelope of sealed, fan-cooled telecom chassis. The 994-FCCBGA package supports the high-layer-count PCB stack-ups required for SRIO and PCIe Gen1 signal integrity on backplane designs.
تجویز کردہ
Storage Controllers and RAID Adapters
Storage controller and RAID adapter cards benefit from the MC8641VU1333JE's DDR1/DDR2 memory controller with ECC, which provides reliable buffering for parity calculation and write-back caches. The dual PCI Express controllers enable host-facing and expansion-facing links from a single chip, while Serial RapidIO can connect to companion DSPs or co-processors for hardware-accelerated XOR and erasure coding. AltiVec SIMD dramatically speeds Reed-Solomon and CRC computations common in storage pipelines. The ceramic FCCBGA package and 105 C qualification suit the thermal and longevity expectations of enterprise storage hardware.
تجویز کردہ
Defense and Aerospace Embedded Compute
The MC8641VU1333JE's PowerPC e600 architecture, ceramic FCCBGA packaging, and 0 to 105 C operating temperature make it a candidate for defense and aerospace embedded compute modules where long lifecycle, deterministic interrupt response, and ruggedized packaging matter more than bleeding-edge clock speed. AltiVec accelerates radar signal preprocessing, electro-optical pixel pipelines, and crypto offload where legacy code has already been validated on PowerPC. The 994-FCCBGA package tolerates thermal cycling better than plastic BGA equivalents, supporting deployed programs with decade-long field lifetimes.
تجویز کردہ
Industrial Single-Board Computers
Industrial single-board computers (SBCs) that must run deterministic control loops and protocol stacks benefit from the MC8641VU1333JE's combination of AltiVec SIMD, dual Gigabit Ethernet, and PCI Express endpoints. The e600's seven-stage pipeline and AltiVec unit allow the same board to handle motion control, HMI rendering, and fieldbus bridging from a single MPU. With 1.05 V core voltage and a 0 to 105 C junction range, the part supports fan-less or low-airflow enclosures common in factory-floor automation cabinets. The 994-FCCBGA footprint is compatible across the MPC8641 family, allowing SKU swaps at production.
تجویز کردہ
Telecom Baseband and DSP Coprocessing
In telecom baseband processing, the MC8641VU1333JE can act as a host processor to offload DSPs via Serial RapidIO, while AltiVec accelerates PHY-layer symbol processing, FFTs, and FEC decoding. The integrated DDR2 controller supplies the high memory bandwidth required for wideband radio blocks. The 1.333 GHz clock grade and 32 KB/32 KB L1 caches keep latency-sensitive baseband routines cache-resident. The ceramic 994-FCCBGA package helps dissipate heat in sealed outdoor base-station enclosures that cycle across wide ambient ranges.
تجویز کردہ
Legacy Medical Imaging Controllers
The MC8641VU1333JE supports medical imaging controller boards that need deterministic throughput, ECC memory for image data integrity, and long-life-cycle silicon. The dual Gigabit Ethernet ports link to image-acquisition front ends, while PCI Express connects to GPU/FPGA processing cards for tomographic reconstruction. AltiVec accelerates 2D/3D image pre-processing kernels. The 0 to 105 C range and ceramic FCCBGA package support the reliability expectations of regulated medical equipment programs that must remain supportable for many years after initial certification.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا MC8641VU1333JE — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | MC8641VU1500KE | MC8641DHX1333JE | MC8641DHX1500KE | MC8641DVU1000GE | MC8641DVJ1333JE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 994-FCCBGA (33x33 mm) | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same |
| Core Count | 1 | 1 | 2 | 2 | 2 | 2 |
| Core Frequency | 1.333 GHz | 1.5 GHz | 1.333 GHz | 1.5 GHz | 1.0 GHz | 1.333 GHz |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C |
| AltiVec SIMD | Yes | Yes | Yes | Yes | Yes | Yes |
| Memory Controller | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC |
اہم امتیازی خصوصیات
- Single-core 1.333 GHz grade with active product support (بمقابلہMC8641DHX1333JE)
- Wider temperature and ceramic package for long-life programs (بمقابلہMC8641DVU1000GE)
- 1.05 V core with documented Rev 3.0 silicon (بمقابلہMC8641VU1500KE)
ڈیزائن نوٹس
Estimated: at 1.05 V core and 1.333 GHz, the single-core e600 in the 994-FCCBGA (33 x 33 mm) dissipates roughly 15-20 W depending on workload and AltiVec utilization. The ceramic FCCBGA package exposes the die through the top surface and supports a heatsink attach for sealed enclosures. Provide a continuous thermal pad on the top-side heatsink interface and avoid obstructing the array with tall nearby components. For forced-air cooling, plan for at least 200 LFM across the heatsink to keep junction temperature within the 105 C ceiling under sustained AltiVec load.
Estimated: routing the MC8641VU1333JE on a 994-ball 1.0 mm pitch FCCBGA requires a high-layer-count PCB stack-up (typically 8-12 layers with sub-stacks for DDR2, PCIe, SRIO, and Gigabit Ethernet). Match impedance to 50 ohm single-ended for SRIO/PCIe and 100 ohm differential for SRIO/PCIe lanes, with length matching within the budget specified in the NXP hardware-design guide. Keep the DDR2 address/command and byte lanes matched within 25 mil and use series termination resistors on clock nets.
Place the 994-ball BGA on a fully flooded internal power plane stitched with vias to the top and bottom layers. Use microvia-in-pad construction to maximize BGA escape density and to keep DDR2 routing under the package short. Decouple the 1.05 V core rail with a combination of bulk, ceramic, and high-frequency capacitors within 100 mil of the package, and provide a separate low-noise analog supply island for the DDR2 PLL per the NXP reference design.
The PCI Express and Serial RapidIO interfaces on the MC8641VU1333JE are edge-rate sensitive; route them on stripline layers between continuous reference planes and avoid crossing plane splits. Maintain 90 ohm differential impedance and skew match intra-PAC lanes within the budgets from the MPC8641 datasheet. Place AC-coupling capacitors for PCIe and SRIO at the device pin side rather than the connector side for predictable eye diagrams.
Do not assume that all MPC8641 SKUs share the exact same boot configuration; the MC8641VU1333JE's Rev 3.0 silicon has documented errata that earlier revisions do not. Always check the latest NXP MPC8641 errata document against your firmware revision. Additionally, the FCCBGA package requires X-ray inspection of solder joints - plan for this in the manufacturing test plan, since BGA joint quality cannot be visually inspected from outside.
تعمیل کی معلومات
RoHS/REACH/lead-free status not explicitly stated in the verified distributor snippets. AEC-Q100 is not applicable to MPUs of this class. Consult the NXP product page for current compliance declarations before placing on a RoHS-only BOM.
