MC8641VU1333JE - PowerPC e600 MPU 1.333GHz 994-FCCBGA | NXP
N.º de pieza: MC8641VU1333JE ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $416.32 | $416,32 |
| 10 | $395.5 | $3.955,00 |
| 100 | $374.69 | $37.469,00 |
| 500 | $353.87 | $176.935,00 |
| 1.000 | $333.06 | $333.060,00 |
MC8641VU1333JE Descripción general
A microprocessor (MPU) in the Power Architecture family integrates the CPU core, memory controller, high-speed serial interfaces, and platform glue logic into a single System-on-Chip. The e600 implementation is particularly well-suited to embedded networking, telecom, and storage workloads that benefit from AltiVec SIMD acceleration and deterministic interrupt behavior. The MC8641VU1333JE in the FCCBGA package is a thermally enhanced variant intended for industrial temperature (0 to 105 C) deployments with extended longevity programs.
Key features of this part include a 32-bit Power Architecture core with 32 KB L1 instruction and 32 KB L1 data caches, a 1 MB backside L2 cache, integrated DDR1/DDR2 memory controller with ECC, dual Gigabit Ethernet, dual PCI Express controllers, dual SRIO lanes, four DMA channels, dual I2C, DUART, and GPIO. Operating voltage is 1.05 V core (per Mouser SKU description "G8 REV3.0 1.05V 105C"), with I/O at 1.5/1.8/2.5/3.3 V and a 533 MHz MPX/Local Bus. The device is qualified for the 0 C to 105 C commercial extended temperature range per Revision 3 silicon.
The MC8641VU1333JE fits embedded designs that need deterministic PowerPC processing with high-bandwidth I/O, including networking line cards, storage controllers, defense/aerospace compute platforms, and industrial control SBCs. AltiVec acceleration delivers strong DSP-like performance for media transcoding or packet inspection. When designing with FCCBGA, plan for high-layer-count PCB stack-up, controlled-impedance SRIO/PCIe routing, and a thermal management strategy appropriate to the sealed ceramic package.
This page synthesizes distributor pricing, same-family variants, and practical design considerations not consolidated on the manufacturer datasheet cover page. For a drop-in alternative, evaluate MC8641VU1500KE (1.5 GHz) or the dual-core MC8641D variants before committing to a board respin.
Alternativas directas para MC8641VU1333JE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC8641VU1333JE (mismo factor de forma y huella) — difiere en Package, Ethernet, PCI Express, Operating Temperature, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC8641VU1500KE
✅ Sustitución directa✓ En stock
$195 / unidad
Ver hoja de datos →MC8641DHX1333JE
✅ Sustitución directa✓ En stock
$149 / unidad
Ver hoja de datos →MC8641DHX1500KE
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC8641DVU1000GE
✅ Sustitución directa✓ En stock
$295.5 / unidad
Ver hoja de datos →MC8641DVJ1333JE
✅ Sustitución directa✓ En stock
$660 / unidad
Ver hoja de datos →MC8641VU1333JE Valores máximos y características eléctricas
| Core Architecture | PowerPC e600 |
| Series | MPC86xx |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 1 MB (backside) |
| SIMD Engine | AltiVec |
| Core Voltage | 1.05 V |
| Memory Controller | DDR1/DDR2 with ECC |
| Ethernet | Dual Gigabit Ethernet MAC |
| PCI Express | Yes (dual controllers) |
| Serial RapidIO (SRIO) | Yes |
| Local Bus / MPX | 533 MHz |
| Temperatura de funcionamiento | 0 C to +105 C |
| Silicon Revision | Rev 3.0 (G8) |
| Encapsulado | 994-FCCBGA (33 x 33 mm) |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) |
Guía de configuración de pines de MC8641VU1333JE 994-fccbga (33 x 33 mm)
Configuración de pines para MC8641VU1333JE (encapsulado 994-fccbga (33 x 33 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC8641VU1333JE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC8641VU1333JE es adecuado para 6 aplicacións: Networking Line Cards, Storage Controllers and RAID Adapters, Defense and Aerospace Embedded Compute, Industrial Single-Board Computers, Telecom Baseband and DSP Coprocessing, Legacy Medical Imaging Controllers.
Networking Line Cards
The MC8641VU1333JE is well-suited to networking line-card designs because its dual Gigabit Ethernet MACs, dual PCI Express controllers, and dual Serial RapidIO ports map directly onto typical switch-fabric and NPU interconnect topologies. The 1.333 GHz e600 core with AltiVec accelerates packet classification, route lookup, and deep-payload inspection without offloading to external accelerators. At 1.05 V core and 0 to 105 C operating temperature, the part tolerates the thermal envelope of sealed, fan-cooled telecom chassis. The 994-FCCBGA package supports the high-layer-count PCB stack-ups required for SRIO and PCIe Gen1 signal integrity on backplane designs.
Recomendado
Storage Controllers and RAID Adapters
Storage controller and RAID adapter cards benefit from the MC8641VU1333JE's DDR1/DDR2 memory controller with ECC, which provides reliable buffering for parity calculation and write-back caches. The dual PCI Express controllers enable host-facing and expansion-facing links from a single chip, while Serial RapidIO can connect to companion DSPs or co-processors for hardware-accelerated XOR and erasure coding. AltiVec SIMD dramatically speeds Reed-Solomon and CRC computations common in storage pipelines. The ceramic FCCBGA package and 105 C qualification suit the thermal and longevity expectations of enterprise storage hardware.
Recomendado
Defense and Aerospace Embedded Compute
The MC8641VU1333JE's PowerPC e600 architecture, ceramic FCCBGA packaging, and 0 to 105 C operating temperature make it a candidate for defense and aerospace embedded compute modules where long lifecycle, deterministic interrupt response, and ruggedized packaging matter more than bleeding-edge clock speed. AltiVec accelerates radar signal preprocessing, electro-optical pixel pipelines, and crypto offload where legacy code has already been validated on PowerPC. The 994-FCCBGA package tolerates thermal cycling better than plastic BGA equivalents, supporting deployed programs with decade-long field lifetimes.
Recomendado
Industrial Single-Board Computers
Industrial single-board computers (SBCs) that must run deterministic control loops and protocol stacks benefit from the MC8641VU1333JE's combination of AltiVec SIMD, dual Gigabit Ethernet, and PCI Express endpoints. The e600's seven-stage pipeline and AltiVec unit allow the same board to handle motion control, HMI rendering, and fieldbus bridging from a single MPU. With 1.05 V core voltage and a 0 to 105 C junction range, the part supports fan-less or low-airflow enclosures common in factory-floor automation cabinets. The 994-FCCBGA footprint is compatible across the MPC8641 family, allowing SKU swaps at production.
Recomendado
Telecom Baseband and DSP Coprocessing
In telecom baseband processing, the MC8641VU1333JE can act as a host processor to offload DSPs via Serial RapidIO, while AltiVec accelerates PHY-layer symbol processing, FFTs, and FEC decoding. The integrated DDR2 controller supplies the high memory bandwidth required for wideband radio blocks. The 1.333 GHz clock grade and 32 KB/32 KB L1 caches keep latency-sensitive baseband routines cache-resident. The ceramic 994-FCCBGA package helps dissipate heat in sealed outdoor base-station enclosures that cycle across wide ambient ranges.
Recomendado
Legacy Medical Imaging Controllers
The MC8641VU1333JE supports medical imaging controller boards that need deterministic throughput, ECC memory for image data integrity, and long-life-cycle silicon. The dual Gigabit Ethernet ports link to image-acquisition front ends, while PCI Express connects to GPU/FPGA processing cards for tomographic reconstruction. AltiVec accelerates 2D/3D image pre-processing kernels. The 0 to 105 C range and ceramic FCCBGA package support the reliability expectations of regulated medical equipment programs that must remain supportable for many years after initial certification.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC8641VU1333JE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC8641VU1500KE | MC8641DHX1333JE | MC8641DHX1500KE | MC8641DVU1000GE | MC8641DVJ1333JE |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 994-FCCBGA (33x33 mm) | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same | 994-FCCBGA (33x33 mm) - same |
| Core Count | 1 | 1 | 2 | 2 | 2 | 2 |
| Core Frequency | 1.333 GHz | 1.5 GHz | 1.333 GHz | 1.5 GHz | 1.0 GHz | 1.333 GHz |
| Core Voltage | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C |
| AltiVec SIMD | Yes | Yes | Yes | Yes | Yes | Yes |
| Memory Controller | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC | DDR1/DDR2 + ECC |
Diferenciadores clave
- Single-core 1.333 GHz grade with active product support (frente a MC8641DHX1333JE)
- Wider temperature and ceramic package for long-life programs (frente a MC8641DVU1000GE)
- 1.05 V core with documented Rev 3.0 silicon (frente a MC8641VU1500KE)
Notas de diseño
Estimated: at 1.05 V core and 1.333 GHz, the single-core e600 in the 994-FCCBGA (33 x 33 mm) dissipates roughly 15-20 W depending on workload and AltiVec utilization. The ceramic FCCBGA package exposes the die through the top surface and supports a heatsink attach for sealed enclosures. Provide a continuous thermal pad on the top-side heatsink interface and avoid obstructing the array with tall nearby components. For forced-air cooling, plan for at least 200 LFM across the heatsink to keep junction temperature within the 105 C ceiling under sustained AltiVec load.
Estimated: routing the MC8641VU1333JE on a 994-ball 1.0 mm pitch FCCBGA requires a high-layer-count PCB stack-up (typically 8-12 layers with sub-stacks for DDR2, PCIe, SRIO, and Gigabit Ethernet). Match impedance to 50 ohm single-ended for SRIO/PCIe and 100 ohm differential for SRIO/PCIe lanes, with length matching within the budget specified in the NXP hardware-design guide. Keep the DDR2 address/command and byte lanes matched within 25 mil and use series termination resistors on clock nets.
Place the 994-ball BGA on a fully flooded internal power plane stitched with vias to the top and bottom layers. Use microvia-in-pad construction to maximize BGA escape density and to keep DDR2 routing under the package short. Decouple the 1.05 V core rail with a combination of bulk, ceramic, and high-frequency capacitors within 100 mil of the package, and provide a separate low-noise analog supply island for the DDR2 PLL per the NXP reference design.
The PCI Express and Serial RapidIO interfaces on the MC8641VU1333JE are edge-rate sensitive; route them on stripline layers between continuous reference planes and avoid crossing plane splits. Maintain 90 ohm differential impedance and skew match intra-PAC lanes within the budgets from the MPC8641 datasheet. Place AC-coupling capacitors for PCIe and SRIO at the device pin side rather than the connector side for predictable eye diagrams.
Do not assume that all MPC8641 SKUs share the exact same boot configuration; the MC8641VU1333JE's Rev 3.0 silicon has documented errata that earlier revisions do not. Always check the latest NXP MPC8641 errata document against your firmware revision. Additionally, the FCCBGA package requires X-ray inspection of solder joints - plan for this in the manufacturing test plan, since BGA joint quality cannot be visually inspected from outside.
Información de cumplimiento
RoHS/REACH/lead-free status not explicitly stated in the verified distributor snippets. AEC-Q100 is not applicable to MPUs of this class. Consult the NXP product page for current compliance declarations before placing on a RoHS-only BOM.
