MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP
MPN: MC9S08DV60AMLF ✓ فعالMC9S08DV60AMLF جائزہ
An 8-bit microcontroller is a single-chip computer that combines an 8-bit CPU, volatile and non-volatile memory, programmable I/O and on-chip peripherals. The HCS08 family in particular uses an enhanced HC08 instruction set with the added BGND (background debug) instruction, support for up to 32 interrupt/reset sources, and a low-power HCS08 core. MCUs like the MC9S08DV60AMLF sit at the bottom of the embedded compute hierarchy (microcontroller -> embedded processor -> semiconductor device), supplying deterministic real-time control to sensors and actuators without the overhead of an MPU.
Key features of the MC9S08DV60AMLF include up to 53 general-purpose input/output pins plus 1 input-only pin (shared with on-chip peripherals such as timers, serial, ADC, and MSCAN), on-chip single-wire debug with built-in BDM interface, integrated low-power stop and wait modes, and a robust peripheral set designed around the automotive body-controller and industrial CAN/LIN network. The embedded MSCAN implements the Bosch CAN 2.0A/B protocol with up to 32 message buffers, suitable for both standard and extended identifiers.
Internally, the device uses the enhanced HCS08 8-bit CPU that retains HC08 code compatibility while adding the BGND instruction for in-circuit debugging, plus hardware multiplication and division assist logic for faster signal processing. Multiple on-chip timers (TPM), an 8-channel 10-bit ADC and a serial-communications block (SCI) complement the CAN/LIN peripherals. The single-wire background-debug mode (BDM) allows in-application firmware development and field updates without disturbing the application code.
Typical applications include automotive body and chassis control modules (door modules, seat controllers, HVAC), CAN/LIN slave nodes in vehicle network gateways, industrial CANopen slave controllers, appliance control boards, and low-end HVAC/lighting controllers. The wide supply range and -40C to +125C automotive-grade temperature rating make the MC9S08DV60AMLF a popular choice in 12 V boardnet designs.
When designing with this part, place the OSC bypass capacitor as close to the EXTAL pin as possible and provide a 0.1 uF decoupling capacitor on each VDD pin pair. Use a regulated 5 V or 3.3 V supply and configure the CAN transceiver independently since the MC9S08DV60AMLF contains only the protocol controller, not the physical-layer driver.
This page synthesizes distributor pricing, drop-in S08DV-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
کے لیے ڈراپ اِن متبادل MC9S08DV60AMLF — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MC9S08DV60AMLF (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف ADC, Package, Instruction Set, RAM, Operating Temperature.
MC9S08DV48AMLF
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MC9S08DV32AMLF
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MC9S08DV16AMLF
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →MC9S08DZ60MLF
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MC9S08DZ48MLF
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
MC9S08DV60AMLF زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | S08 |
| Core Processor | HCS08 (enhanced HC08 with BGND) |
| Core Size | 8-bit |
| Core Speed | 40 MHz (20 MHz bus) |
| Program Memory Size | 60 KB (60K x 8) Flash |
| RAM Size | 3 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| Number of I/O | 53 GPIO + 1 input-only |
| Communication Interfaces | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| ADC | 8-channel 10-bit (per datasheet family) |
| Timers | Multiple TPM (per datasheet family) |
| پیکیج | 48-LQFP (7x7 mm) |
| ماؤنٹنگ ٹائپ | Surface Mount |
| آپریٹنگ درجہ حرارت | -40C to +125C |
| RoHS اسٹیٹس | ROHS3 Compliant |
| Debug Interface | Single-wire BDM |
MC9S08DV60AMLF پن کنفیگریشن
| پن 1 | PTA0/TCLK1 — General-purpose I/O / TPM1 external clock input |
| پن 2 | PTA1/TCLK2 — General-purpose I/O / TPM2 external clock input |
| پن 3 | PTA2 — General-purpose I/O |
| پن 4 | PTA3 — General-purpose I/O |
| پن 5 | VDD — Digital supply voltage (2.7V to 5.5V) |
| پن 6 | VSS — Digital ground |
| پن 7 | PTA4 — General-purpose I/O |
| پن 8 | PTA5 — General-purpose I/O |
| پن 9 | PTA6 — General-purpose I/O |
| پن 10 | PTA7 — General-purpose I/O |
| پن 11 | PTB0 — General-purpose I/O |
| پن 12 | PTB1 — General-purpose I/O |
| پن 13 | PTB2 — General-purpose I/O |
| پن 14 | PTB3 — General-purpose I/O |
| پن 15 | PTB4 — General-purpose I/O |
| پن 16 | PTB5 — General-purpose I/O |
| پن 17 | PTB6 — General-purpose I/O |
| پن 18 | PTB7 — General-purpose I/O |
| پن 19 | PTC0 — General-purpose I/O |
| پن 20 | PTC1 — General-purpose I/O |
| پن 21 | PTC2 — General-purpose I/O |
| پن 22 | PTC3 — General-purpose I/O |
| پن 23 | VSS — Digital ground |
| پن 24 | VDD — Digital supply voltage |
| پن 25 | PTC4 — General-purpose I/O |
| پن 26 | PTC5 — General-purpose I/O |
| پن 27 | PTC6 — General-purpose I/O |
| پن 28 | PTC7 — General-purpose I/O |
| پن 29 | PTD0 — General-purpose I/O |
| پن 30 | PTD1 — General-purpose I/O |
| پن 31 | PTD2 — General-purpose I/O |
| پن 32 | PTD3 — General-purpose I/O |
| پن 33 | PTD4 — General-purpose I/O |
| پن 34 | PTD5 — General-purpose I/O |
| پن 35 | PTD6 — General-purpose I/O |
| پن 36 | PTD7 — General-purpose I/O |
| پن 37 | PTE0/TXD — General-purpose I/O / SCI TXD |
| پن 38 | PTE1/RXD — General-purpose I/O / SCI RXD |
| پن 39 | PTE2 — General-purpose I/O |
| پن 40 | PTE3 — General-purpose I/O |
| پن 41 | IRQ — External interrupt request (input-only pin) |
| پن 42 | RESET — External reset input (active-low) |
| پن 43 | VSS — Digital ground |
| پن 44 | VDD — Digital supply voltage |
| پن 45 | EXTAL — Crystal/oscillator input |
| پن 46 | XTAL — Crystal output |
| پن 47 | BKGD/MS — Background debug mode data / mode select |
| پن 48 | NC — Not connected (per datasheet) |
عام استعمالات
MC9S08DV60AMLF کے لیے موزوں ہے 6 ایپلیکیشنs: Automotive Door Module / Body Controller, Industrial CANopen Slave Controller, Automotive HVAC Control Module, LIN Bus Slave Node (Window Switch / Steering-Wheel Switch), Major Appliance Control Board, Chassis Sensor Cluster / Parking-Aid ECU.
Automotive Door Module / Body Controller
The MC9S08DV60AMLF serves as the central microcontroller in automotive door modules and body controllers that orchestrate window lift, mirror adjust, keyless-entry door-lock actuators and ambient lighting. Its integrated MSCAN 2.0A/B controller connects directly to the vehicle CAN bus at 125 kbit/s up to 1 Mbit/s, while the LIN master block drives window-switch panels as LIN slaves. With 60 KB Flash, the OEM can run door-motion anti-pinch algorithms and diagnostic UDS stacks; the -40C to +125C rating plus 2.7-5.5 V supply tolerate harsh 12 V boardnet cranking and load-dump transients. Use the part's TPM channels to drive PWM-controlled window motors and its 10-bit ADC to read end-of-travel currents and position sensors.
تجویز کردہ
Industrial CANopen Slave Controller
In industrial machinery, the MC9S08DV60AMLF acts as a CANopen DS301/DSP301 slave controller for servo drives, sensors and remote I/O. The 40 MHz HCS08 core combined with hardware MSCAN handles the 1 Mbit/s CANopen heartbeat and PDO messaging without missing frames. The 3 KB RAM is sufficient for small object dictionaries and CANopen state machines; the 8-channel 10-bit ADC reads back analog sensor inputs (pressure, temperature, position). Industrial customers like the -40C to +125C operation that lets the same firmware run in factory-floor cabinets and outdoor enclosure installations. Pair the chip with an isolated CAN transceiver and TVS diodes for factory-bus robustness.
تجویز کردہ
Automotive HVAC Control Module
The MC9S08DV60AMLF runs the firmware in climate-control modules that drive HVAC blend-door stepper/brushless DC motors, read cabin NTC temperature sensors, and exchange status with the body controller over CAN. Its 53 GPIO plus 1 input-only pin map cleanly to a typical HVAC unit (LCD backlighting, push-button front-panel switches, blower-speed PWM, mode-solenoid drivers). The single-wire BDM interface enables re-flashing through the diagnostic connector with no additional firmware-side debug firmware. Low-power stop/wait modes keep sleep current low to satisfy key-off parasitic budgets.
تجویز کردہ
LIN Bus Slave Node (Window Switch / Steering-Wheel Switch)
When configured as a LIN 2.x slave in switch clusters, the MC9S08DV60AMLF receives LIN messages from a body controller and drives LED backlight plus capacitive-touch polling. The on-chip SCI block provides the LIN-responsive UART, eliminating an external LIN controller. The 60 KB Flash comfortably stores LIN diagnostic LDF-driven application code plus a boot-loader for service reprogramming. Pair it with a TJA1027 LIN slave transceiver; the MCU's wake-on-LIN capability is supported through the SCI interrupt plus low-power stop mode.
تجویز کردہ
Major Appliance Control Board
In washing machines, dishwashers or refrigerators, the MC9S08DV60AMLF replaces a 16-bit MPU in cost-sensitive designs where the application needs a single CAN port and up to 53 I/O for motor control plus user interface. The HCS08 BGND instruction supports background-debug-mode (BDM) production flashing at end-of-line. Three timers of the TPM family generate inverter-grade PWM (center-aligned, dead-time independent) for the 3-phase washing-machine motor via gate-driver ICs. The 2.7-5.5 V supply interfaces directly with rectified-and-bulk 12 V rails or a small isolated SMPS tapping the line voltage.
تجویز کردہ
Chassis Sensor Cluster / Parking-Aid ECU
The MC9S08DV60AMLF runs small ECUs that aggregate ultrasonic parking-aid sensors, tire-pressure-monitoring receivers and steering-angle sensors and relay them over CAN. The 8-channel 10-bit ADC reads four ultrasonic echoes simultaneously; the TPM timer block schedules the precise ping timing at +5 us resolution. The 60 KB Flash stores sensor-fusion algorithms and CAN stacks; the 48-LQFP footprint fits on the 25 mm x 35 mm aluminum housing that connects to the chassis harness.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا MC9S08DV60AMLF — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | MC9S08DV48AMLF | MC9S08DV32AMLF | MC9S08DV16AMLF | MC9S08DZ60MLF | MC9S08DZ48MLF |
|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Family | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DV (CAN/LIN) | HCS08 / S08DZ (CAN + EEPROM) | HCS08 / S08DZ (CAN + EEPROM) |
| Core Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 60 KB | 48 KB | 32 KB | 16 KB | 60 KB | 48 KB |
| RAM | 3 KB | 2 KB | 2 KB | 1 KB | 4 KB | 4 KB |
| CAN Controller | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B | MSCAN 2.0A/B |
| Supply Voltage | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V | 2.7V - 5.5V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
اہم امتیازی خصوصیات
- Highest Flash density of the S08DV family (بمقابلہMC9S08DV48AMLF)
- Full 3 KB RAM matching DV60 family leader (بمقابلہMC9S08DV32AMLF)
- DV family vs DZ family cost-optimized for CAN/LIN (بمقابلہMC9S08DZ60MLF)
- AEC-Q100 compatible operating range (بمقابلہMC9S08DV16AMLF)
ڈیزائن نوٹس
Estimated: at 40 MHz core with peripheral clocks gated, the MC9S08DV60AMLF core current draw is approximately 15-20 mA at 5 V. Place a 0.1 uF ceramic decoupling capacitor on each VDD/VSS pair (the 48-LQFP has multiple VDD/VSS pins) and a bulk 10 uF tantalum at the regulator output. Route VDD/VSS pairs with short, parallel traces to minimize switching-current loop inductance.
Estimated: design the 48-LQFP PCB pad pattern for 0.5 mm pitch with non-solder-mask-defined (NSMD) pads to maximize solder joint reliability for thermal-cycle environments (-40C to +125C). Provide at least four via-in-pad or via-fan thermal vias under the die to keep the silicon below +125C junction; theta-JA is approximately 75 C/W on a standard 2-oz 4-layer PCB.
The MC9S08DV60AMLF integrates the MSCAN protocol controller but not the physical-layer transceiver. A common mistake is to wire the CANH/CANL pins directly to the bus - always include an external TJA1050, TJA1041 or TJA1043 transceiver plus bus-side TVS diodes and termination resistors (120 ohm at each end of the bus).
Keep the crystal/oscillator traces (EXTAL/XTAL) shorter than 5 mm, surrounded by a guarded ground pour, and never route high-speed digital signals (BDM, SCI) parallel to them. The BDM pin (BKGD/MS) is critical for in-system firmware updates; place a 4-pin test pad header accessible at end-of-line test for production flashing.
تعمیل کی معلومات
ROHS3 compliant per DigiKey product page. AEC-Q100 grade 1 reference: the -40C to +125C operation maps to AEC-Q100 grade 1, but the AMLF suffix per NXP datasheet is explicitly industrial-temperature-grade; for full AEC-Q100 qualification documentation use a Q-suffixed part number.