آخری بار خریداری کا نوٹس: MPC875ZT66 اپنی زندگی کے اختتام کے قریب ہے۔ آخری آرڈر کی تاریخ: ہم سے رابطہ کریں. دستیاب متبادل پرزے دیکھیں →
NXP Semiconductors

MPC875ZT66 - 66MHz 32-Bit PowerQUICC Processor | NXP

MPN: MPC875ZT66 ✗ اختتامِ زندگی
3.3 V Vdss 256-pin PBGA (23 mm x 23 mm) Package 66 MHz Speed
MOQ: 1 |

MPC875ZT66 جائزہ

The NXP Semiconductors MPC875ZT66 is a 32-bit Power Architecture communications processor based on the PowerQUICC MPC8xx family, operating at 66 MHz and housed in a 256-pin PBGA package measuring 23 mm by 23 mm. It combines a communications-oriented processor core with integrated networking and peripheral functions for embedded networking, communications, and industrial-control equipment. The device is identified as end of life by NXP, so current availability should be confirmed before committing to a new design.

A communications processor is a specialized microprocessor architecture designed to move protocol and network traffic efficiently. The MPC875ZT66 belongs to the broader embedded microprocessor category and uses the Power Architecture instruction set, while its PowerQUICC name identifies the communications-oriented integration used in routers, gateways, line cards, and industrial communications equipment. The 256-pin PBGA provides the required ball-grid interconnect for the processor and its external interface functions.

Key verified characteristics include one 32-bit core, a 66 MHz operating frequency, a 3.3 V supply description, 0.18 µm process information, and an operating temperature range of 0 °C to 95 °C. The package is listed as a 256-pin BGA or PBGA, with a square package shape and a stated peak reflow temperature of 245 °C. These details make the MPC875ZT66 primarily a legacy embedded communications solution rather than a modern low-power edge-computing device.

Typical engineering uses include embedded Ethernet equipment, protocol-conversion gateways, industrial communication controllers, network interface appliances, and communication line cards. The processor's 66 MHz clock and single-core architecture are suitable for systems whose main task is deterministic control or protocol handling rather than intensive user-interface rendering or high-performance data processing.

A practical design consideration is package complexity. A 256-ball PBGA requires a multilayer PCB, careful escape routing, controlled impedance, and assembly-process qualification. Because the product is marked end of life, designers should preserve the original footprint and verify long-term supply, firmware support, and software-tool compatibility before using it in a new production release.

This product page combines verified distributor and manufacturer information, package and lifecycle details, practical BGA implementation guidance, and an honest assessment of drop-in replacement availability for engineers planning maintenance, repair, or redesign work around the legacy MPC875ZT66 platform.

کے لیے ڈراپ اِن متبادل MPC875ZT66 — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔

اس سیریز میں مختلف ورژن

اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں MPC875ZT66 (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Process Technology, Core Architecture, Operating Temperature, Package, Core Count.

NXP Semiconductors
Process Technology: 0.18 um CMOS
Core Architecture: Power Architecture (PowerQUICC MPC8xx)
Operating Temperature: -40C to +100C
موازنہ کریں MPC875ZT66 →
NXP Semiconductors
Process Technology: 0.18 um
Core Architecture: Power Architecture, 32-bit
Operating Temperature: 0 C to +95 C
موازنہ کریں MPC875ZT66 →
NXP Semiconductors
Process Technology: 0.18 µm CMOS
Core Architecture: MPC8xx (PowerPC) - 32-bit
Operating Temperature: 0 °C to +95 °C
موازنہ کریں MPC875ZT66 →

MPC875VR66

✅ ڈراپ-اِن
NXP Semiconductors
📦 256-PBGA (23x23)
Microprocessor (MPU) · PowerQUICC MPC8xx · MPC8xx (PowerPC) - 32-bit · 66 MHz · 87 MIPS · 1 · 0.18 µm CMOS · 3.3 V

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

MPC870CZT66

✅ ڈراپ-اِن
NXP Semiconductors
📦 256-PBGA (23x23)
Power Architecture (PowerQUICC MPC8xx) · 1 · 32-bit · 66 MHz · 3.3 V · -40C to +100C · 0.18 um CMOS · 256-PBGA (23x23 mm)

قیمت کے لیے رابطہ کریں

ڈیٹا شیٹ دیکھیں →

MPC875ZT66 زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات

Processor Type MPC8xx communications processor
Architecture Power Architecture
Core Count 1 core
Data Width 32-bit
زیادہ سے زیادہ کلاک فریکوئنسی 66 MHz
سپلائی وولٹیج 3.3 V
Process Technology 0.18 µm
آپریٹنگ درجہ حرارت رینج 0 °C to 95 °C
Package Type 256-pin PBGA (23 mm x 23 mm)
Package Code HBGA
Terminal Count 256
Package Shape Square
Peak Reflow Temperature 245 °C
Application Category Networking and communications applications

MPC875ZT66 square پن کنفیگریشن گائیڈ

MPC875ZT66 (square پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔

MPC875ZT66 کے لیے square پیکیج پن آؤٹ ڈایاگرام

کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں MPC875ZT66.

رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔

عام استعمالات

MPC875ZT66 کے لیے موزوں ہے 6 ایپلیکیشنs: Industrial Ethernet Gateway, Protocol Conversion Gateway, Network Line-Card Controller, Embedded Communication Controller, Network Equipment Management Processor, Legacy Communication Appliance.

🏭

Industrial Ethernet Gateway

The MPC875ZT66 fits a legacy industrial Ethernet gateway when the equipment already uses a 66 MHz PowerQUICC software base and requires deterministic communications processing. Its 32-bit single-core architecture can handle protocol conversion, device management, and supervisory traffic without introducing a multicore platform. The 256-pin PBGA provides the ball-grid interface needed for a complex communications processor, but the 0 °C to 95 °C range must be checked against enclosure temperatures. Because the part is end of life, new gateways should prioritize a supported processor unless retaining the existing board and software materially reduces qualification cost.

🌐

Protocol Conversion Gateway

The MPC875ZT66 is suited to a protocol-conversion gateway whose principal task is moving framed data between legacy industrial or telecommunications interfaces. Its PowerQUICC architecture and 66 MHz frequency provide a dedicated communications-processing platform, while the single 32-bit core avoids the complexity of a multiprocessor design. A production upgrade should confirm that all serial interfaces, timer interrupts, DMA channels, and memory-mapped registers can be reproduced by the selected successor. Legacy availability and firmware maintenance are the dominant concerns for this use case.

🖥️

Network Line-Card Controller

The MPC875ZT66 can serve as the control processor in a legacy network line-card or communications appliance because it was designed around the PowerQUICC MPC8xx family for networking and communications equipment. The verified 66 MHz clock and 32-bit architecture suit supervisory traffic, configuration, status monitoring, and protocol handling. Its 256-pin PBGA requires a multilayer board and careful power, ground, and high-speed routing, however, and the end-of-life status creates long-term sourcing risk. A line-card refresh should evaluate newer controllers unless board reuse makes this processor substantially more economical.

🔧

Embedded Communication Controller

The MPC875ZT66 is applicable to embedded communication controllers that must combine protocol handling with supervisory control in a compact industrial or telecommunications design. Its single 32-bit core at 66 MHz provides a straightforward execution model for deterministic tasks, and the operating range of 0 °C to 95 °C covers many controlled environments. The dense 256-ball package does not, however, reduce total design effort because escape routing, layer transitions, assembly inspection, and thermal analysis remain necessary. Firmware support and source-code access should be assessed before extending the platform’s service life.

📡

Network Equipment Management Processor

The MPC875ZT66 can act as an equipment-management processor for a legacy router, gateway, or communications module that performs configuration, telemetry, and control-plane functions. PowerQUICC communications architecture aligns with this role, and the 66 MHz operating frequency supports the control workload associated with typical embedded management tasks. Implementation requires exact preservation of interrupt routing, Ethernet media interfaces, memory mapping, and boot behavior if an existing PCB is reused. For newly deployed equipment, support availability and end-of-life procurement are more significant than retaining the original processor family.

📱

Legacy Communication Appliance

The MPC875ZT66 remains useful in a legacy communication appliance when redesigning the processor, board, and software would introduce unnecessary field risk. It offers one 32-bit Power Architecture core at 66 MHz in a 256-pin PBGA, matching the processor class historically used in communications equipment. A maintenance program should archive the system software, schematics, firmware, and approved-component list because new production is constrained by end-of-life status. The 0 °C to 95 °C operating range and 3.3 V supply description must be reconciled with the original design before continued use.

تجویز کردہ پروڈکٹس کا خلاصہ

KSZ8081RNC Single-channel Ethernet transceiver for industrial connectivity استعمال ہوتا ہے: Industrial Ethernet Gateway LAN8720AI-CP Embedded 10/100 Ethernet physical-layer interface استعمال ہوتا ہے: Industrial Ethernet Gateway MAX232DR Texas Instruments استعمال ہوتا ہے: Protocol Conversion Gateway, Legacy Communication Appliance ISO1211DR Texas Instruments استعمال ہوتا ہے: Protocol Conversion Gateway KSZ9031RNXIA Microchip Technology استعمال ہوتا ہے: Network Line-Card Controller TCAN332DR Texas Instruments استعمال ہوتا ہے: Network Line-Card Controller TJA1051T/3 High-speed CAN transceiver for industrial control links استعمال ہوتا ہے: Embedded Communication Controller SN75176DR RS-485/RS-422 interface transceiver استعمال ہوتا ہے: Embedded Communication Controller W25Q64JVSSIQ Serial flash for firmware and configuration storage استعمال ہوتا ہے: Network Equipment Management Processor EN25Q01D2H-T Small serial EEPROM for parameter storage استعمال ہوتا ہے: Network Equipment Management Processor CP2102N-A01-GQFN20R Silicon Labs استعمال ہوتا ہے: Legacy Communication Appliance
What is the MPC875ZT66 processor used for?
The MPC875ZT66 is a single-core, 32-bit PowerQUICC communications processor designed for networking and communications equipment. According to the NXP product-page snippet, it operates at 66 MHz and uses the Power Architecture, making it appropriate for protocol handling, embedded Ethernet equipment, gateways, and industrial communications controllers. The part is listed as end of life, so its use is primarily suited to maintaining an existing platform rather than starting a new design.
What are the key specifications of MPC875ZT66 that engineers should know?
The MPC875ZT66 combines one 32-bit Power Architecture core with a 66 MHz clock and a 3.3 V supply in a 256-pin PBGA package. Verified listings also identify a 0.18 µm process, 0 °C to 95 °C operating range, and 23 mm by 23 mm package dimensions. According to the NXP product page and distributor records, its primary role is communications processing in networking equipment. Detailed memory, peripheral, and I/O specifications require the original manufacturer datasheet.
Is MPC875ZT66 still active or end of life?
The MPC875ZT66 is listed as end of life by NXP Semiconductors. The manufacturer product-page search result explicitly labels the part “End of Life” and points to discontinuation and replacement information. Buyers should therefore treat inventory as legacy supply rather than guaranteed production availability. For a continuing product, request written lifecycle, lot traceability, and refurbishment details from the distributor before releasing a new production order.
What package does the MPC875ZT66 use?
The MPC875ZT66 uses a 256-pin PBGA, also described in distributor data as a 256-BGA, with dimensions of 23 mm by 23 mm. Other listings identify the package code as HBGA, a square package shape, 256 terminals, and a 245 °C peak reflow temperature. The 256-ball footprint requires advanced PCB construction and assembly. Confirm the manufacturer mechanical drawing before layout because generic HBGA and PBGA naming conventions can describe different ball pitches and land patterns.
Where can I download the MPC875ZT66 datasheet?
The official MPC875ZT66 datasheet is available through the NXP product page at https://www.nxp.com/part/MPC875ZT66, whose Data Sheet link appears in the verified search result. An archived PDF is also indexed by Alldatasheet. The manufacturer document should be preferred for pin assignments, electrical limits, memory interfaces, and package drawings. No datasheet revision identifier or page count is asserted here because those details were not supplied in the verified source data.
Where can I find the MPC875ZT66 pinout and package drawing?
The authoritative MPC875ZT66 pinout and package drawing must be obtained from the linked NXP manufacturer datasheet. The verified records establish a 256-pin square HBGA/PBGA package, but they do not provide a trustworthy ball-by-ball assignment that can be reproduced here. Do not infer the 256 connections from generic package drawings. Verify pin numbering, ball pitch, power rails, ground balls, and exposed thermal requirements against the exact manufacturer document before PCB or assembly release.
Is MPC875ZT66 suitable for industrial networking and communications?
Yes, the MPC875ZT66 is suitable for legacy embedded networking and communications applications within its verified 0 °C to 95 °C range. Its single 32-bit Power Architecture core at 66 MHz is intended for communications-oriented processing rather than workloads requiring multiple cores or modern accelerator performance. The suitability of a specific product still depends on interface requirements, software support, lifecycle expectations, and the availability of an approved replacement.
Can MPC870CZT66 replace an MPC875ZT66?
MPC870CZT66 is the closest candidate identified in the supplied cross-reference results, but it should not be treated as a confirmed drop-in replacement without a detailed pin, voltage, timing, and memory-map review. The available comparison result confirms that it is a related MPC8xx processor, yet the supplied data does not establish identical package dimensions, ballout, or every operating limit. Treat it as a design-review candidate rather than a guaranteed PCB-compatible substitute.
What is the best drop-in replacement for MPC875ZT66?
No confirmed drop-in replacement for the MPC875ZT66 was established by the supplied evidence. MPC875VR66 and MPC870CZT66 are related candidates, while MPC852TCVR100A and HD6417750BP200M are comparison parts with materially different clock or architecture data. The manufacturer’s replacement and product-change information should be checked before selection. A true drop-in requires an identical 256-ball footprint, compatible I/O voltage, matching reset and clock behavior, and acceptable software compatibility.
MPC875ZT66 vs MPC875VR66 - which is better for a legacy design?
MPC875ZT66 and MPC875VR66 appear closely related, and MPC875VR66 is the more plausible physical substitute candidate in the supplied results. However, the verified snippets do not provide a complete package drawing, voltage table, or function-by-function comparison proving pin-to-pin equivalence. Choose MPC875VR66 only after NXP documentation confirms identical ballout, I/O levels, reset behavior, clock configuration, and software requirements for the target revision.
When should I choose MPC875ZT66 over a newer communications processor?
Choose the MPC875ZT66 only when maintaining an existing 66 MHz PowerQUICC platform offers substantially lower redesign risk than migrating software and hardware. Its established 32-bit Power Architecture environment may preserve familiar drivers, control code, and board qualification. For new products, favor a currently supported processor with modern security, tooling, supply assurance, and lower lifecycle risk. The end-of-life designation makes the cost of future availability and software support a primary concern.
Where to buy MPC875ZT66 online?
The verified marketplace listing for MPC875ZT66 is available through DigiKey, where it is offered by Flip Electronics, while Octopart lists pricing and availability sources from three distributors. Additional distributor listings appear through Rochester Electronics, Ampheo, YIC Electronics, Kynix, and Vyrian. Because no current numeric price or stock quantity was supplied, request a written quotation and availability confirmation before ordering, especially for an end-of-life 256-ball BGA.
What is the price of MPC875ZT66?
A verified numeric price for MPC875ZT66 was not included in the supplied data, so no amount can be stated reliably as of 2026-10-29. DigiKey and Octopart expose distributor price information, and the individual distributor pages accept RFQ or purchase inquiries. For legacy inventory, request lot-specific pricing, date codes, traceability, inspection status, and a quotation that remains valid for the build schedule.
Is MPC875ZT66 in stock and what is its lead time?
Stock status and lead time for MPC875ZT66 are not confirmed in the supplied data as of 2026-10-29. The DigiKey search result says “Buy now, ships today,” but that wording does not establish quantity available for every order size or traceable factory-new stock. Ask the selected distributor to confirm allocated inventory, scheduled delivery, lot date code, and whether the price is based on immediate stock or an aftermarket acquisition.
What can replace MPC875ZT66?
MPC875VR66 is the leading same-family replacement candidate identified in the supplied comparison data, but no part is confirmed as a true drop-in replacement. MPC870CZT66 is another related MPC8xx option, while MPC852TCVR100A and HD6417750BP200M differ in at least clock or processor architecture. Engineers should review the NXP cross-reference and end-of-life notices, then compare package drawings, pin multiplexing, electrical characteristics, boot behavior, and software before approving a substitute.

کے لیے انجینئرنگ ریفرنس ڈیٹا MPC875ZT66 — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔

انتخاب کی گائیڈ

Choose the MPC875ZT66 when maintaining an existing PowerQUICC-based platform is materially safer than redesigning hardware and software. Its verified combination of one 32-bit core, 66 MHz operation, 3.3 V supply, and 256-pin PBGA is appropriate for legacy networking and industrial communications equipment, especially where board reuse avoids requalification cost. Consider MPC875VR66 as the first same-family candidate for review, but verify its complete package, voltage, timing, and software compatibility before treating it as a drop-in. Evaluate MPC870CZT66 only after confirming its ballout and peripheral mapping. The listed HD6417750BP200M and MPC852TCVR100A are comparison references rather than proven drop-ins because their package and architecture data are incomplete or materially different. For new products, favor a supported processor unless long-term supply and migration costs make retaining the legacy MPC875ZT66 unavoidable.

متبادلات کے ساتھ موازنہ

پیرامیٹر یہ پروڈکٹ MPC875VR66 MPC870CZT66
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 256-PBGA (23x23) 256-PBGA (23x23) 256-PBGA (23x23)
Processor Type MPC8xx communications processor MPC8xx microprocessor MPC8xx microprocessor
Architecture Power Architecture, 32-bit Power Architecture, 32-bit Power Architecture, 32-bit

اہم امتیازی خصوصیات

  • Directly identified PowerQUICC communications processor (بمقابلہHD6417750BP200M)
  • Lower clock rate than the identified 200 MHz Hitachi comparison part (بمقابلہHD6417750BP200M)
  • Established 66 MHz operating point with a verified 3.3 V supply description (بمقابلہMPC852TCVR100A)

ڈیزائن نوٹس

Treat the 256-pin PBGA as a high-density, multilayer-routing problem rather than a conventional leaded package. Place power and ground connections according to the exact manufacturer land pattern, provide short return paths for every supply transition, and use the original mechanical drawing to define pad geometry and ball-pitch constraints. Do not derive the footprint from generic HBGA libraries because similarly named packages can differ in ball count, pitch, and pad design.

Thermal design must use the exact manufacturer junction-temperature, package, and PCB data because processor dissipation depends on voltage, activity, I/O loading, and the assembled board. The verified package information identifies a square 256-pin HBGA/PBGA with a 245 °C peak reflow temperature, but it does not provide thermal resistance or maximum power. Use the original datasheet limits and perform a board-level thermal estimate rather than adopting a generic junction-temperature value.

Do not approve a substitute solely because the MPN is similar or the processor family matches. Confirm the ballout, power and ground pins, I/O voltage tolerance, reset and boot behavior, clock requirements, memory interface, peripheral multiplexing, and interrupt routing. Also verify operating-temperature and lifecycle requirements. The supplied search results identify comparison candidates but do not include a complete manufacturer cross-reference table, so board-level validation and firmware regression testing remain essential.

تعمیل کی معلومات

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
لیڈ فری
Unknown
ہیلوجن فری
Unknown
کنفلیکٹ منرلز
Unknown

The supplied verified data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable to this legacy communications processor based on the provided product classification.

ڈیٹا کی تصدیق کی تاریخ: 2026-10-29 — ڈیٹا XAIPART کی کمپوننٹ انجینئرنگ ٹیم کے ذریعے تصدیق شدہ اور ترتیب شدہ

متعلقہ تلاشیں

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متعلقہ اجزاء اور اصطلاحات

NXP Semiconductors MPC875ZT66 MPC875VR66 MPC870CZT66 MPC852TCVR100A HD6417750BP200M PowerQUICC MPC8xx Power Architecture 32-bit microprocessor communications processor embedded microprocessor network processor semiconductor 256-pin PBGA HBGA BGA package family surface-mount package 66 MHz 3.3 V 0.18 µm process Ethernet industrial communications power management RoHS REACH
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