PIC32MM0016GPL036-I/MV - 25MHz 32-bit MCU 16KB Flash UQFN-40
MPN: PIC32MM0016GPL036-I/MV ✓ فعالPIC32MM0016GPL036-I/MV جائزہ
A 32-bit microcontroller (MCU) integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. Within the taxonomy: PIC32MM0016GPL036-I/MV -> 32-bit microcontroller -> microcontroller -> embedded processor -> semiconductor. The MIPS32 microAptiv UC core executes the MIPS instruction set with single-cycle hardware multiply/divide and a deterministic interrupt response, giving PIC24/PIC32MX users a migration path to 32-bit performance without leaving the MPLAB ecosystem.
Key features of this device include 16 KB Flash (16K x 8), 4 KB SRAM, 25 MHz max CPU clock, 3.3 V typical supply (2.0-3.6 V range), 500 nA sleep current for eXtreme Low Power (XLP) battery applications, 6 channels of 10-bit ADC, Core Independent Peripherals (CIPs), and a wide operating temperature range of -40 C to +85 C (industrial grade, denoted by the "-I" suffix). The 40-UQFN package exposes a thermal pad that must be soldered to the PCB ground plane for proper thermal dissipation and electrical performance.
The PIC32MM architecture supports up to 25 MIPS throughput and includes 4-wire SPI, I2C, and UART communication peripherals, multiple 16-bit timers, a real-time clock, and a chargeable capacitive touch sensing module. The combination of deterministic MIPS performance and ultra-low sleep current enables duty-cycled IoT endpoints that wake briefly to perform a measurement, transmit, and return to deep sleep.
Typical applications include low-power IoT sensor nodes, wearable fitness/health devices, remote controls, battery-powered HVAC sensors, smart home edge nodes, and consumer HMI where a small footprint and long battery life are mandatory. The 5x5 mm UQFN package is well-suited for compact PCB layouts.
When designing with this MCU, place a 100 nF decoupling capacitor adjacent to each VDD pin, route the exposed pad to a continuous ground plane, and use MPLAB X IDE with XC32 compiler for firmware development. The 500 nA sleep mode requires careful peripheral gating; leave unused peripherals clock-gated to minimize quiescent draw.
This page synthesizes distributor pricing snapshots, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single resource for sourcing and substituting this PIC32MM device.
کے لیے ڈراپ اِن متبادل PIC32MM0016GPL036-I/MV — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں PIC32MM0016GPL036-I/MV (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, Operating Temperature, ADC, Timers.
PIC32MM0016GPL036T-I/MV
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →PIC32MM0016GPL036-E/MV
✅ ڈراپ-اِن📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
PIC32MM0016GPL028T-I/SS
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →PIC32MM0016GPL036-I/MV زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Core | MIPS32 microAptiv UC |
| CPU Architecture | 32-bit RISC |
| Max CPU Frequency | 25 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Supply Voltage (VDD) | 2.0 V to 3.6 V (3.3 V typical) |
| آپریٹنگ درجہ حرارت | -40 C to +85 C (industrial) |
| Sleep Current | 500 nA typical (XLP mode) |
| پیکیج | 40-UQFN (5x5 mm) with exposed pad |
| پن کی تعداد | 40 |
| ADC | 10-bit, 6 channels |
| Communication Peripherals | I2C, SPI, UART |
| Timers | Multiple 16-bit |
| ماؤنٹنگ ٹائپ | Surface Mount |
| RoHS اسٹیٹس | Compliant |
PIC32MM0016GPL036-I/MV پن کنفیگریشن
| پن 1 | RA0 — GPIO/analog input |
| پن 2 | RA1 — GPIO/analog input |
| پن 3 | RA2 — GPIO/analog input |
| پن 4 | RA3 — GPIO/analog input |
| پن 5 | VDD — Positive supply 2.0-3.6 V |
| پن 6 | VSS — Ground |
| پن 7 | RA4 — GPIO/analog input |
| پن 8 | RA5 — GPIO/analog input |
| پن 9 | RA6 — GPIO/analog input |
| پن 10 | RA7 — GPIO/analog input |
| پن 11 | RB0 — GPIO/programming |
| پن 12 | RB1 — GPIO/programming |
| پن 13 | RB2 — GPIO |
| پن 14 | RB3 — GPIO |
| پن 15 | RB4 — GPIO |
| پن 16 | RB5 — GPIO |
| پن 17 | RB6 — GPIO |
| پن 18 | RB7 — GPIO |
| پن 19 | RB8 — GPIO |
| پن 20 | RB9 — GPIO |
| پن 21 | RB10 — GPIO |
| پن 22 | RB11 — GPIO |
| پن 23 | RC0 — GPIO |
| پن 24 | RC1 — GPIO |
| پن 25 | RC2 — GPIO |
| پن 26 | RC3 — GPIO |
| پن 27 | RC4 — GPIO |
| پن 28 | RC5 — GPIO |
| پن 29 | RC6 — GPIO |
| پن 30 | RC7 — GPIO |
| پن 31 | RC8 — GPIO |
| پن 32 | RC9 — GPIO |
| پن 33 | VSS — Ground |
| پن 34 | VDD — Positive supply |
| پن 35 | RD0 — GPIO |
| پن 36 | RD1 — GPIO |
| پن 37 | RD2 — GPIO |
| پن 38 | RD3 — GPIO |
| پن 39 | OSCI — Crystal oscillator input |
| پن 40 | OSCO — Crystal oscillator output |
عام استعمالات
PIC32MM0016GPL036-I/MV کے لیے موزوں ہے 6 ایپلیکیشنs: Battery-Powered IoT Sensor Node, Wearable Fitness Device, Smart Home Edge Sensor, Industrial HVAC Sensor Module, Consumer Remote Control HMI, Low-Cost Metering Endpoint.
Battery-Powered IoT Sensor Node
The PIC32MM0016GPL036-I/MV's 500 nA XLP sleep current and 16 KB Flash make it ideal for wireless sensor endpoints that wake, transmit, and sleep. With a typical duty cycle of 1% (1 ms active per 100 ms), the average current draw is dominated by sleep current, enabling coin-cell battery lifetimes of 3-5 years. The 5x5 mm UQFN footprint integrates alongside sub-GHz radios like the Microchip MICRF112, and the 6-channel 10-bit ADC connects directly to analog sensors (temperature, light, moisture). MPLAB X IDE with the XC32 free compiler supports full firmware development; the 25 MHz MIPS core completes sensor reads and packet assembly in <2 ms, well within the active window.
تجویز کردہ
Wearable Fitness Device
Wearable fitness trackers demand small footprint, low power, and sufficient MIPS to process accelerometer data in real time. The PIC32MM0016GPL036-I/MV's 40-UQFN (5x5 mm) package fits wristbands with strict size constraints, while its 500 nA sleep current between heart-rate samples preserves multi-day battery life. The Core Independent Peripherals (CIPs) offload sensor sampling from the CPU, leaving the 25 MHz MIPS core free to run step-counting or skin-temperature algorithms. The on-chip 10-bit ADC supports battery-voltage monitoring and optical heart-rate photodiode readout with appropriate external op-amp conditioning.
تجویز کردہ
Smart Home Edge Sensor
Smart-home edge sensors (motion, leak, smoke) benefit from the PIC32MM0016GPL036-I/MV's deterministic MIPS performance, low cost, and robust industrial temperature range. With 16 KB Flash, vendors can fit Zigbee or Thread application code plus proprietary driver logic in a single MCU; the 4 KB SRAM supports network state and event buffers. The exposed-pad UQFN-40 package delivers adequate thermal performance in enclosed housings. The integrated 10-bit ADC handles direct sensor readout (PIR, photodiode), while I2C/SPI/UART connect to radios like the SAM R34 or ATWINC1500.
تجویز کردہ
Industrial HVAC Sensor Module
HVAC duct and zone sensors operate in -20 C to +70 C ambient and demand long MTBF, which the PIC32MM0016GPL036-I/MV's industrial -40 C to +85 C rating and 500 nA sleep current support. The 40-UQFN (MV) footprint suits compact 4-wire duct-mounted modules where PCB size is constrained to ~10x10 mm. The 6-channel 10-bit ADC handles airflow pressure, humidity, and temperature via multi-sensor arrays. MPLAB Harmony framework enables rapid integration of HVAC control logic, and the on-chip 16-bit timers drive triac phase-control outputs for damper actuator control.
تجویز کردہ
Consumer Remote Control HMI
Low-end universal remote controls and BLE-beacon clickers use the PIC32MM0016GPL036-I/MV for its low cost and small footprint. The Core Independent Peripherals (CIPs) handle capacitive touch buttons without CPU intervention, dropping active current to near-sleep levels during user input. The 16 KB Flash accommodates IR protocol libraries (NEC, RC5, Sony) plus BLE pairing state machines, while the 4 KB SRAM supports button debounce and LED PWM fading. The 25 MHz MIPS core handles encryption for secure-pairing flows in modern remote designs.
تجویز کردہ
Low-Cost Metering Endpoint
Electricity, water, and gas meters require a low-power MCU that can sleep for 99% of the time and wake briefly to read a sensor and transmit. The PIC32MM0016GPL036-I/MV's 500 nA XLP sleep, 16 KB Flash, and 25 MHz MIPS throughput fit this duty profile exactly. The integrated 10-bit ADC reads current/voltage dividers, while the on-chip UART drives optical or RF M-bus modules. The exposed-pad UQFN-40 package dissipates the small power losses from UART transmissions without thermal issues. Industrial temperature grade supports outdoor cabinet installation.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا PIC32MM0016GPL036-I/MV — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | PIC32MM0016GPL036T-I/MV | PIC32MM0016GPL036-E/MV | PIC32MM0016GPL028T-I/SS |
|---|---|---|---|---|
| Package | 40-UQFN (5x5 mm) | 40-UQFN (5x5) - same | 40-UQFN (5x5) - same | 40-UQFN (5x5) - same /MV; SSOP variant differs |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 microAptiv UC, 32-bit | MIPS32 microAptiv UC, 32-bit | MIPS32 microAptiv UC, 32-bit | MIPS32 microAptiv UC, 32-bit |
| Max CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 16 KB | 16 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C |
| Sleep Current | 500 nA (XLP) | 500 nA | 500 nA | 500 nA |
اہم امتیازی خصوصیات
- Lowest-memory member of PIC32MM GPL family (بمقابلہPIC32MM0016GPL036T-I/MV)
- Extended temperature option available (بمقابلہPIC32MM0016GPL036-E/MV)
- Industrial-grade temperature and XLP 500 nA sleep (بمقابلہPIC32MM0016GPL028T-I/SS)
ڈیزائن نوٹس
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (pins 5 and 34 for this 40-UQFN device), with a single 10 uF bulk capacitor on the supply rail. Route the exposed thermal pad (EP) directly to a continuous ground plane to minimize ground bounce during ADC sampling. Avoid long traces between the MCU and the decoupling capacitors; inductance in series with VDD creates voltage transients that can reset the MCU under load-step conditions.
The 40-UQFN (5x5 mm) package has a center exposed pad (pin 41, internally bonded to VSS) that must be soldered to the PCB ground plane with an array of thermal vias for heat dissipation. Use a 3x3 or larger via array under the pad to reduce thermal resistance below 30 C/W. Ensure the ground plane extends unbroken under the package to provide a stable reference for the 10-bit ADC; a split ground or signal traces crossing under the EP will degrade ADC accuracy.
Estimated: At 25 MHz active mode with all peripherals on, core current draw is ~7 mA at 3.3 V, dissipating ~23 mW - well within the package's thermal limit. In deep-sleep (XLP) mode, current drops to 500 nA, dissipating ~1.7 uW. The thermal pad keeps junction temperature rise well under 5 C in both modes. No external heatsink is required for typical IoT duty cycles below 1% active.
Do not leave unused GPIO pins floating; configure them as outputs driven low or as inputs with internal pull-ups enabled to prevent parasitic current draw through the input buffer. Avoid enabling peripherals in firmware without first disabling their clocks; leaving the UART or ADC clocked in sleep mode can increase quiescent current from 500 nA to 50-100 uA, defeating the XLP advantage. Always configure the WDT (watchdog timer) or use the RTCC alarm for periodic wake-up rather than busy-loop polling.
تعمیل کی معلومات
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; choose automotive-grade PIC32MK family for AEC-Q100 requirements. Lead-free reflow profile per JEDEC J-STD-020.
