PIC32MM0016GPL036-I/MV - 25MHz 32-bit MCU 16KB Flash UQFN-40
料号： PIC32MM0016GPL036-I/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.56 | $25.60 |
| 100 | $2.28 | $228.00 |
| 500 | $2.03 | $1,015.00 |
| 1,000 | $1.8 | $1,800.00 |
PIC32MM0016GPL036-I/MV 概述
A 32-bit microcontroller (MCU) integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. Within the taxonomy: PIC32MM0016GPL036-I/MV -> 32-bit microcontroller -> microcontroller -> embedded processor -> semiconductor. The MIPS32 microAptiv UC core executes the MIPS instruction set with single-cycle hardware multiply/divide and a deterministic interrupt response, giving PIC24/PIC32MX users a migration path to 32-bit performance without leaving the MPLAB ecosystem.
Key features of this device include 16 KB Flash (16K x 8), 4 KB SRAM, 25 MHz max CPU clock, 3.3 V typical supply (2.0-3.6 V range), 500 nA sleep current for eXtreme Low Power (XLP) battery applications, 6 channels of 10-bit ADC, Core Independent Peripherals (CIPs), and a wide operating temperature range of -40 C to +85 C (industrial grade, denoted by the "-I" suffix). The 40-UQFN package exposes a thermal pad that must be soldered to the PCB ground plane for proper thermal dissipation and electrical performance.
The PIC32MM architecture supports up to 25 MIPS throughput and includes 4-wire SPI, I2C, and UART communication peripherals, multiple 16-bit timers, a real-time clock, and a chargeable capacitive touch sensing module. The combination of deterministic MIPS performance and ultra-low sleep current enables duty-cycled IoT endpoints that wake briefly to perform a measurement, transmit, and return to deep sleep.
Typical applications include low-power IoT sensor nodes, wearable fitness/health devices, remote controls, battery-powered HVAC sensors, smart home edge nodes, and consumer HMI where a small footprint and long battery life are mandatory. The 5x5 mm UQFN package is well-suited for compact PCB layouts.
When designing with this MCU, place a 100 nF decoupling capacitor adjacent to each VDD pin, route the exposed pad to a continuous ground plane, and use MPLAB X IDE with XC32 compiler for firmware development. The 500 nA sleep mode requires careful peripheral gating; leave unused peripherals clock-gated to minimize quiescent draw.
This page synthesizes distributor pricing snapshots, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single resource for sourcing and substituting this PIC32MM device.
直接替换替代料： PIC32MM0016GPL036-I/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： PIC32MM0016GPL036-I/MV （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, ADC, Timers.
快速对比工具——选择替代料号进行并排对比：
PIC32MM0016GPL036T-I/MV
✅ 直接替换✓ 有现货
$1.82 / 个
查看数据手册 →PIC32MM0016GPL036-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
PIC32MM0016GPL028T-I/SS
✅ 直接替换✓ 有现货
$0.5588 / 个
查看数据手册 →PIC32MM0016GPL036-I/MV 最大额定值与电气特性
| Core | MIPS32 microAptiv UC |
| CPU Architecture | 32-bit RISC |
| Max CPU Frequency | 25 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data Memory (SRAM) | 4 KB |
| Supply Voltage (VDD) | 2.0 V to 3.6 V (3.3 V typical) |
| 工作温度 | -40 C to +85 C (industrial) |
| Sleep Current | 500 nA typical (XLP mode) |
| 封装 | 40-UQFN (5x5 mm) with exposed pad |
| 引脚数量 | 40 |
| ADC | 10-bit, 6 channels |
| Communication Peripherals | I2C, SPI, UART |
| Timers | Multiple 16-bit |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
PIC32MM0016GPL036-I/MV 引脚配置
| 引脚 1 | RA0 — GPIO/analog input |
| 引脚 2 | RA1 — GPIO/analog input |
| 引脚 3 | RA2 — GPIO/analog input |
| 引脚 4 | RA3 — GPIO/analog input |
| 引脚 5 | VDD — Positive supply 2.0-3.6 V |
| 引脚 6 | VSS — Ground |
| 引脚 7 | RA4 — GPIO/analog input |
| 引脚 8 | RA5 — GPIO/analog input |
| 引脚 9 | RA6 — GPIO/analog input |
| 引脚 10 | RA7 — GPIO/analog input |
| 引脚 11 | RB0 — GPIO/programming |
| 引脚 12 | RB1 — GPIO/programming |
| 引脚 13 | RB2 — GPIO |
| 引脚 14 | RB3 — GPIO |
| 引脚 15 | RB4 — GPIO |
| 引脚 16 | RB5 — GPIO |
| 引脚 17 | RB6 — GPIO |
| 引脚 18 | RB7 — GPIO |
| 引脚 19 | RB8 — GPIO |
| 引脚 20 | RB9 — GPIO |
| 引脚 21 | RB10 — GPIO |
| 引脚 22 | RB11 — GPIO |
| 引脚 23 | RC0 — GPIO |
| 引脚 24 | RC1 — GPIO |
| 引脚 25 | RC2 — GPIO |
| 引脚 26 | RC3 — GPIO |
| 引脚 27 | RC4 — GPIO |
| 引脚 28 | RC5 — GPIO |
| 引脚 29 | RC6 — GPIO |
| 引脚 30 | RC7 — GPIO |
| 引脚 31 | RC8 — GPIO |
| 引脚 32 | RC9 — GPIO |
| 引脚 33 | VSS — Ground |
| 引脚 34 | VDD — Positive supply |
| 引脚 35 | RD0 — GPIO |
| 引脚 36 | RD1 — GPIO |
| 引脚 37 | RD2 — GPIO |
| 引脚 38 | RD3 — GPIO |
| 引脚 39 | OSCI — Crystal oscillator input |
| 引脚 40 | OSCO — Crystal oscillator output |
典型应用
PIC32MM0016GPL036-I/MV 适用于 6 应用s: Battery-Powered IoT Sensor Node, Wearable Fitness Device, Smart Home Edge Sensor, Industrial HVAC Sensor Module, Consumer Remote Control HMI, Low-Cost Metering Endpoint.
Battery-Powered IoT Sensor Node
The PIC32MM0016GPL036-I/MV's 500 nA XLP sleep current and 16 KB Flash make it ideal for wireless sensor endpoints that wake, transmit, and sleep. With a typical duty cycle of 1% (1 ms active per 100 ms), the average current draw is dominated by sleep current, enabling coin-cell battery lifetimes of 3-5 years. The 5x5 mm UQFN footprint integrates alongside sub-GHz radios like the Microchip MICRF112, and the 6-channel 10-bit ADC connects directly to analog sensors (temperature, light, moisture). MPLAB X IDE with the XC32 free compiler supports full firmware development; the 25 MHz MIPS core completes sensor reads and packet assembly in <2 ms, well within the active window.
推荐
Wearable Fitness Device
Wearable fitness trackers demand small footprint, low power, and sufficient MIPS to process accelerometer data in real time. The PIC32MM0016GPL036-I/MV's 40-UQFN (5x5 mm) package fits wristbands with strict size constraints, while its 500 nA sleep current between heart-rate samples preserves multi-day battery life. The Core Independent Peripherals (CIPs) offload sensor sampling from the CPU, leaving the 25 MHz MIPS core free to run step-counting or skin-temperature algorithms. The on-chip 10-bit ADC supports battery-voltage monitoring and optical heart-rate photodiode readout with appropriate external op-amp conditioning.
推荐
Smart Home Edge Sensor
Smart-home edge sensors (motion, leak, smoke) benefit from the PIC32MM0016GPL036-I/MV's deterministic MIPS performance, low cost, and robust industrial temperature range. With 16 KB Flash, vendors can fit Zigbee or Thread application code plus proprietary driver logic in a single MCU; the 4 KB SRAM supports network state and event buffers. The exposed-pad UQFN-40 package delivers adequate thermal performance in enclosed housings. The integrated 10-bit ADC handles direct sensor readout (PIR, photodiode), while I2C/SPI/UART connect to radios like the SAM R34 or ATWINC1500.
推荐
Industrial HVAC Sensor Module
HVAC duct and zone sensors operate in -20 C to +70 C ambient and demand long MTBF, which the PIC32MM0016GPL036-I/MV's industrial -40 C to +85 C rating and 500 nA sleep current support. The 40-UQFN (MV) footprint suits compact 4-wire duct-mounted modules where PCB size is constrained to ~10x10 mm. The 6-channel 10-bit ADC handles airflow pressure, humidity, and temperature via multi-sensor arrays. MPLAB Harmony framework enables rapid integration of HVAC control logic, and the on-chip 16-bit timers drive triac phase-control outputs for damper actuator control.
推荐
Consumer Remote Control HMI
Low-end universal remote controls and BLE-beacon clickers use the PIC32MM0016GPL036-I/MV for its low cost and small footprint. The Core Independent Peripherals (CIPs) handle capacitive touch buttons without CPU intervention, dropping active current to near-sleep levels during user input. The 16 KB Flash accommodates IR protocol libraries (NEC, RC5, Sony) plus BLE pairing state machines, while the 4 KB SRAM supports button debounce and LED PWM fading. The 25 MHz MIPS core handles encryption for secure-pairing flows in modern remote designs.
推荐
Low-Cost Metering Endpoint
Electricity, water, and gas meters require a low-power MCU that can sleep for 99% of the time and wake briefly to read a sensor and transmit. The PIC32MM0016GPL036-I/MV's 500 nA XLP sleep, 16 KB Flash, and 25 MHz MIPS throughput fit this duty profile exactly. The integrated 10-bit ADC reads current/voltage dividers, while the on-chip UART drives optical or RF M-bus modules. The exposed-pad UQFN-40 package dissipates the small power losses from UART transmissions without thermal issues. Industrial temperature grade supports outdoor cabinet installation.
推荐
推荐产品汇总
工程参考数据： PIC32MM0016GPL036-I/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PIC32MM0016GPL036T-I/MV | PIC32MM0016GPL036-E/MV | PIC32MM0016GPL028T-I/SS |
|---|---|---|---|---|
| Package | 40-UQFN (5x5 mm) | 40-UQFN (5x5) - same | 40-UQFN (5x5) - same | 40-UQFN (5x5) - same /MV; SSOP variant differs |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 microAptiv UC, 32-bit | MIPS32 microAptiv UC, 32-bit | MIPS32 microAptiv UC, 32-bit | MIPS32 microAptiv UC, 32-bit |
| Max CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 16 KB | 16 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +125 C (Extended) | -40 C to +85 C |
| Sleep Current | 500 nA (XLP) | 500 nA | 500 nA | 500 nA |
关键差异点
- Lowest-memory member of PIC32MM GPL family （对比 PIC32MM0016GPL036T-I/MV)
- Extended temperature option available （对比 PIC32MM0016GPL036-E/MV)
- Industrial-grade temperature and XLP 500 nA sleep （对比 PIC32MM0016GPL028T-I/SS)
设计说明
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (pins 5 and 34 for this 40-UQFN device), with a single 10 uF bulk capacitor on the supply rail. Route the exposed thermal pad (EP) directly to a continuous ground plane to minimize ground bounce during ADC sampling. Avoid long traces between the MCU and the decoupling capacitors; inductance in series with VDD creates voltage transients that can reset the MCU under load-step conditions.
The 40-UQFN (5x5 mm) package has a center exposed pad (pin 41, internally bonded to VSS) that must be soldered to the PCB ground plane with an array of thermal vias for heat dissipation. Use a 3x3 or larger via array under the pad to reduce thermal resistance below 30 C/W. Ensure the ground plane extends unbroken under the package to provide a stable reference for the 10-bit ADC; a split ground or signal traces crossing under the EP will degrade ADC accuracy.
Estimated: At 25 MHz active mode with all peripherals on, core current draw is ~7 mA at 3.3 V, dissipating ~23 mW - well within the package's thermal limit. In deep-sleep (XLP) mode, current drops to 500 nA, dissipating ~1.7 uW. The thermal pad keeps junction temperature rise well under 5 C in both modes. No external heatsink is required for typical IoT duty cycles below 1% active.
Do not leave unused GPIO pins floating; configure them as outputs driven low or as inputs with internal pull-ups enabled to prevent parasitic current draw through the input buffer. Avoid enabling peripherals in firmware without first disabling their clocks; leaving the UART or ADC clocked in sleep mode can increase quiescent current from 500 nA to 50-100 uA, defeating the XLP advantage. Always configure the WDT (watchdog timer) or use the RTCC alarm for periodic wake-up rather than busy-loop polling.
合规信息
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; choose automotive-grade PIC32MK family for AEC-Q100 requirements. Lead-free reflow profile per JEDEC J-STD-020.
