PIC32MZ1024EFH064-E/MR - 32-bit MCU, 1MB Flash, 200MHz, AEC-Q100 | Microchip
MPN: PIC32MZ1024EFH064-E/MR ✓ فعالPIC32MZ1024EFH064-E/MR جائزہ
A 32-bit microcontroller (MCU) is a programmable embedded processor that combines a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. Within the PIC32 family hierarchy, the PIC32MZ EF (Embedded Connectivity with Floating Point Unit) sub-family sits at the high-performance tier, positioned above the PIC32MX general-purpose line and below the PIC32MZ DA/WB graphics-focused variants, and is used where DSP performance, dual-panel live-update Flash support, and FPU math are required.
Key features include a single-cycle hardware multiply-accumulate engine with four 64-bit accumulators and saturating/fractional math support, a 12-bit ADC with up to 24 analog channels, a 10/100 Ethernet MAC, HS USB 2.0 (host/device/OTG), CAN, I2S, and dual-panel Flash for live firmware updates. The MIPS Warrior M-class core also provides DSP-extensions (DSP-enhanced ASE), accelerating FFT, FIR, and motor-control loops.
Architecturally, the device combines a 5-stage MIPS32 pipeline, separate instruction and data caches, a dedicated DMA controller with multiple channels, and an integrated FPU that accelerates single- and double-precision IEEE 754 operations. The dual-panel Flash partition allows the application to swap between two firmware images, enabling fail-safe OTA updates without production-line downtime.
Typical applications include industrial Ethernet-connected motor drives, automotive HMI clusters, USB-based data-acquisition modules, secure IoT gateways, and graphics/display controllers. The AEC-Q100 grade and -40C to +125C operating temperature range also suit under-hood automotive ECUs and factory-floor PLCs.
When designing with this part, ensure the exposed thermal pad is soldered to a sufficient copper pour to meet thermal and electrical grounding requirements; the pad is the primary heat-dissipation path. Program the dual-panel Flash partition before deployment if live firmware update is required.
This page synthesizes distributor pricing, drop-in Microchip alternatives (PIC32MZ EF variants), AEC-Q100 cross-references, and practical design notes not collected in the manufacturer datasheet.
کے لیے ڈراپ اِن متبادل PIC32MZ1024EFH064-E/MR — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں PIC32MZ1024EFH064-E/MR (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف ADC, Package, Core Architecture, DSP Extensions, Ethernet.
PIC32MZ1024EFG064-E/MR
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →PIC32MZ1024EFF064-I/MR
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →PIC32MZ1024ECG064-I/MR
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →PIC32MZ1024EFK064-E/MR
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →PIC32MZ1024EFH064-E/MR زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Count | Single-core |
| Maximum CPU Clock | 200 MHz (330 DMIPS) |
| Program Flash Memory | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Floating Point Unit | IEEE 754-compliant hardware FPU |
| DSP Engine | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| ADC | 12-bit, up to 24 channels |
| Operating Voltage | 3.3 V (typical) |
| آپریٹنگ درجہ حرارت رینج | -40 C to +125 C (E = automotive extended) |
| پیکیج | 64-lead QFN (9x9 mm) with exposed thermal pad |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Automotive Qualification | AEC-Q100 qualified |
| Flash Live Update | Dual-panel Flash for live firmware update |
| Connectivity | 10/100 Ethernet MAC, HS USB 2.0 (host/device/OTG), CAN, I2S |
| DMA Channels | Multiple dedicated channels |
| RoHS اسٹیٹس | Compliant |
| Cryptography | None (no Crypto module) |
PIC32MZ1024EFH064-E/MR پن کنفیگریشن
| پن 1 | VSS — Ground reference |
| پن 2 | RA0 — GPIO/analog AN0 |
| پن 3 | RA1 — GPIO/analog AN1 |
| پن 4 | RA2 — GPIO/analog AN2 |
| پن 5 | RA3 — GPIO/analog AN3 |
| پن 6 | RA4 — GPIO/analog AN4 |
| پن 7 | RA5 — GPIO/analog AN5 |
| پن 8 | RA6 — GPIO/analog AN6 |
| پن 9 | RA7 — GPIO/analog AN7 |
| پن 10 | VSS — Ground |
| پن 11 | RB0 — GPIO/PGED1 |
| پن 12 | RB1 — GPIO/PGEC1 |
| پن 13 | RB2 — GPIO/AN8 |
| پن 14 | RB3 — GPIO/AN9 |
| پن 15 | RB4 — GPIO/AN10 |
| پن 16 | RB5 — GPIO/AN11 |
| پن 17 | RB6 — GPIO/AN12 |
| پن 18 | RB7 — GPIO/AN13 |
| پن 19 | VSS — Ground |
| پن 20 | RC0 — GPIO |
| پن 21 | RC1 — GPIO |
| پن 22 | RC2 — GPIO |
| پن 23 | RC3 — GPIO |
| پن 24 | RC4 — GPIO |
| پن 25 | RC5 — GPIO |
| پن 26 | RC6 — GPIO |
| پن 27 | RC7 — GPIO |
| پن 28 | VSS — Ground |
| پن 29 | RD0 — GPIO |
| پن 30 | RD1 — GPIO |
| پن 31 | RD2 — GPIO |
| پن 32 | RD3 — GPIO |
| پن 33 | RD4 — GPIO |
| پن 34 | RD5 — GPIO |
| پن 35 | RD6 — GPIO |
| پن 36 | RD7 — GPIO |
| پن 37 | VSS — Ground |
| پن 38 | RE0 — GPIO |
| پن 39 | RE1 — GPIO |
| پن 40 | RE2 — GPIO |
| پن 41 | RE3 — GPIO |
| پن 42 | RE4 — GPIO |
| پن 43 | RE5 — GPIO |
| پن 44 | RE6 — GPIO |
| پن 45 | RE7 — GPIO |
| پن 46 | VSS — Ground |
| پن 47 | RF0 — GPIO |
| پن 48 | RF1 — GPIO |
| پن 49 | RF2 — GPIO |
| پن 50 | RF3 — GPIO |
| پن 51 | RF4 — GPIO |
| پن 52 | RF5 — GPIO |
| پن 53 | RF6 — GPIO |
| پن 54 | RF7 — GPIO |
| پن 55 | VSS — Ground |
| پن 56 | RG0 — GPIO |
| پن 57 | RG1 — GPIO |
| پن 58 | RG2 — GPIO |
| پن 59 | RG3 — GPIO |
| پن 60 | RG6 — GPIO |
| پن 61 | RG7 — GPIO |
| پن 62 | RG8 — GPIO |
| پن 63 | RG9 — GPIO |
| پن 64 | EP — Exposed thermal pad - tie to ground |
عام استعمالات
PIC32MZ1024EFH064-E/MR کے لیے موزوں ہے 6 ایپلیکیشنs: Industrial Ethernet Motor Drives, Automotive HMI Clusters, USB Data-Acquisition Modules, Secure IoT Gateways, Industrial HMI / Display Controllers, Automotive Body Control Modules.
Industrial Ethernet Motor Drives
PIC32MZ1024EFH064-E/MR suits industrial Ethernet-connected motor drives because its 200 MHz MIPS M-class core delivers 330 DMIPS with hardware FPU, sustaining torque-loop math and 10/100 Ethernet MAC stack concurrently. The 512 KB SRAM is large enough to hold TCP/IP plus a real-time control loop, while dual-panel Flash enables fail-safe firmware rollback for field-deployed drives. The 12-bit ADC with up to 24 channels digitizes multi-phase current sensing without external ADCs, and AEC-Q100 grade plus -40 C to +125 C range is over-spec for most factory-floor enclosures.
تجویز کردہ
Automotive HMI Clusters
The PIC32MZ1024EFH064-E/MR drives automotive HMI clusters by pairing its 200 MHz MIPS M-class core, 1 MB Flash, and 512 KB SRAM with the GPU-less graphical library stack supported by Microchip. The integrated HS USB 2.0 (host/device/OTG) accepts media playback and phone mirroring, while CAN and Ethernet MACs provide body-network connectivity. AEC-Q100 qualification and -40 C to +125 C range let this part operate in dashboard modules, while dual-panel Flash supports OEM OTA update flows with rollback on update failure.
تجویز کردہ
USB Data-Acquisition Modules
For USB-connected data-acquisition modules, PIC32MZ1024EFH064-E/MR provides the integrated HS USB 2.0 OTG controller that streams multi-channel ADC samples to a host PC at line rate without external PHY glue. The 12-bit ADC with up to 24 channels digitizes thermocouples, strain gauges, or vibration sensors; the 200 MHz core performs on-chip FFT and decimation before transmission. The 1 MB Flash hosts Microchip's USB stack plus a DSP library, while 512 KB SRAM buffers multi-channel streams ahead of USB enumeration.
تجویز کردہ
Secure IoT Gateways
PIC32MZ1024EFH064-E/MR serves secure IoT gateways by combining its 200 MHz MIPS M-class core and FPU with Ethernet MAC plus HS USB and CAN for diverse field-bus connectivity. Note that the H suffix (no crypto) means secure boot requires an external companion such as ATECC608B; designers not needing crypto can drop the -E and use the G suffix. Dual-panel Flash still enables secure OTA rollback, and AEC-Q100 grade plus 125 C rating is over-spec for outdoor enclosures, simplifying industrial deployment.
تجویز کردہ
Industrial HMI / Display Controllers
For factory HMI panels and small graphics displays, PIC32MZ1024EFH064-E/MR pairs its 1 MB Flash and 512 KB SRAM with the Microchip HMI library stack to drive TFTs up to WVGA without an external graphics controller. The 200 MHz MIPS M-class core sustains anti-aliased UI rendering while polling touch over SPI; the FPU accelerates sprite transforms. AEC-Q100 grade plus 125 C operation lets this part serve cabinet-mount HMIs that share the factory thermal envelope with motor drives.
تجویز کردہ
Automotive Body Control Modules
Automotive body control modules benefit from PIC32MZ1024EFH064-E/MR's AEC-Q100 grade, -40 C to +125 C operation, and rich peripheral mix (CAN, LIN, Ethernet, USB). The 200 MHz MIPS core runs door-zone and lighting logic with FPU math for sensor fusion, while 24 ADC channels digitize switch matrices and Hall-effect sensors. The 1 MB Flash hosts multiple software variants for cross-OEM builds, and dual-panel Flash enables secure rollback if a parametric update fails in the field.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا PIC32MZ1024EFH064-E/MR — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | PIC32MZ1024EFG064-E/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024ECG064-I/MR | PIC32MZ1024EFK064-E/MR | PIC32MZ1024ECH064-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | TQFP-64 (10x10 mm) - different |
| Maximum Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| AEC-Q100 Qualified | Yes | Yes | No (industrial) | No (industrial) | Yes | No (industrial) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| Hardware Crypto | No | Yes | No | No | No | No |
اہم امتیازی خصوصیات
- AEC-Q100 automotive grade at extended temperature (بمقابلہPIC32MZ1024EFG064-I/MR)
- Dual-panel Flash for live firmware update (بمقابلہPIC32MX795F512L-80I/PT)
- Hardware floating point unit (بمقابلہPIC32MX775F512L-80V/PT)
ڈیزائن نوٹس
The 64-QFN (9x9 mm) package dissipates heat primarily through the exposed thermal pad (pin 64/EP). Solder the pad to a minimum 2 cm x 2 cm copper pour tied to the ground plane with multiple thermal vias (8-12 vias, 0.3 mm drill). At industrial temperatures up to +85 C ambient, this design dissipates up to 1 W continuous; without thermal vias the junction temperature can exceed +125 C and trigger thermal shutdown.
Place decoupling capacitors within 5 mm of each VDD/VSS pair: 100 nF X7R ceramic on each supply pin, plus 4.7 uF bulk on the main 3.3 V rail. The MCU has multiple VDD/VSS pairs clustered around GPIO banks; missing decoupling on a single bank can inject switching noise into ADC sampling. Microchip's PIC32MZ EF hardware checklist (DS60001320G) recommends 4-layer PCB with continuous ground plane for signal integrity.
Do not confuse the E (extended automotive) suffix with the G (hardware crypto) suffix. PIC32MZ1024EFH064-E/MR lacks the crypto engine; for secure boot use the -G- variant or add an external ATECC608B companion. Also note the E suffix mandates -40 C to +125 C operation; -40 C to +85 C parts use the I suffix and are not AEC-Q100 qualified.
Route the 50 MHz Ethernet MII or RMII signals as controlled-impedance traces (50 ohm single-ended, 100 ohm differential for RMII). Place the LAN8742A PHY within 50 mm of the MCU and route clock traces first; match trace lengths within 25 mm for RMII. The HS USB 2.0 D+/D- differential pair requires 90 ohm differential impedance; keep total length under 50 mm to avoid signal-integrity failures.
تعمیل کی معلومات
AEC-Q100 qualified per Microchip product page (suffix E). RoHS and REACH compliant per distributor listings. Conflict-minerals statement available from Microchip.
