PIC32MZ1024EFH064-E/MR - 32-bit MCU, 1MB Flash, 200MHz, AEC-Q100 | Microchip
Référence : PIC32MZ1024EFH064-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.94 | $119,40 |
| 100 | $10.78 | $1 078,00 |
| 500 | $9.62 | $4 810,00 |
| 1 000 | $8.74 | $8 740,00 |
PIC32MZ1024EFH064-E/MR Présentation
A 32-bit microcontroller (MCU) is a programmable embedded processor that combines a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals on a single silicon die. Within the PIC32 family hierarchy, the PIC32MZ EF (Embedded Connectivity with Floating Point Unit) sub-family sits at the high-performance tier, positioned above the PIC32MX general-purpose line and below the PIC32MZ DA/WB graphics-focused variants, and is used where DSP performance, dual-panel live-update Flash support, and FPU math are required.
Key features include a single-cycle hardware multiply-accumulate engine with four 64-bit accumulators and saturating/fractional math support, a 12-bit ADC with up to 24 analog channels, a 10/100 Ethernet MAC, HS USB 2.0 (host/device/OTG), CAN, I2S, and dual-panel Flash for live firmware updates. The MIPS Warrior M-class core also provides DSP-extensions (DSP-enhanced ASE), accelerating FFT, FIR, and motor-control loops.
Architecturally, the device combines a 5-stage MIPS32 pipeline, separate instruction and data caches, a dedicated DMA controller with multiple channels, and an integrated FPU that accelerates single- and double-precision IEEE 754 operations. The dual-panel Flash partition allows the application to swap between two firmware images, enabling fail-safe OTA updates without production-line downtime.
Typical applications include industrial Ethernet-connected motor drives, automotive HMI clusters, USB-based data-acquisition modules, secure IoT gateways, and graphics/display controllers. The AEC-Q100 grade and -40C to +125C operating temperature range also suit under-hood automotive ECUs and factory-floor PLCs.
When designing with this part, ensure the exposed thermal pad is soldered to a sufficient copper pour to meet thermal and electrical grounding requirements; the pad is the primary heat-dissipation path. Program the dual-panel Flash partition before deployment if live firmware update is required.
This page synthesizes distributor pricing, drop-in Microchip alternatives (PIC32MZ EF variants), AEC-Q100 cross-references, and practical design notes not collected in the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ1024EFH064-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ1024EFH064-E/MR (même facteur de forme et même empreinte) — différant par ADC, Package, Core Architecture, DSP Extensions, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ1024EFG064-E/MR
✅ Remplacement direct✓ En stock
$9.42 / unité
Voir la fiche technique →PIC32MZ1024EFF064-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.65 / unité
Voir la fiche technique →PIC32MZ1024ECG064-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.9 / unité
Voir la fiche technique →PIC32MZ1024EFK064-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.05 / unité
Voir la fiche technique →PIC32MZ1024EFH064-E/MR Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Count | Single-core |
| Maximum CPU Clock | 200 MHz (330 DMIPS) |
| Program Flash Memory | 1 MB (1024 KB) |
| SRAM | 512 KB |
| Floating Point Unit | IEEE 754-compliant hardware FPU |
| DSP Engine | Four 64-bit accumulators, single-cycle MAC, saturating and fractional math |
| ADC | 12-bit, up to 24 channels |
| Operating Voltage | 3.3 V (typical) |
| Plage de température de fonctionnement | -40 C to +125 C (E = automotive extended) |
| Boîtier | 64-lead QFN (9x9 mm) with exposed thermal pad |
| Type de montage | Surface Mount |
| Automotive Qualification | AEC-Q100 qualified |
| Flash Live Update | Dual-panel Flash for live firmware update |
| Connectivity | 10/100 Ethernet MAC, HS USB 2.0 (host/device/OTG), CAN, I2S |
| DMA Channels | Multiple dedicated channels |
| Statut RoHS | Compliant |
| Cryptography | None (no Crypto module) |
Configuration des broches de PIC32MZ1024EFH064-E/MR
| Broche 1 | VSS — Ground reference |
| Broche 2 | RA0 — GPIO/analog AN0 |
| Broche 3 | RA1 — GPIO/analog AN1 |
| Broche 4 | RA2 — GPIO/analog AN2 |
| Broche 5 | RA3 — GPIO/analog AN3 |
| Broche 6 | RA4 — GPIO/analog AN4 |
| Broche 7 | RA5 — GPIO/analog AN5 |
| Broche 8 | RA6 — GPIO/analog AN6 |
| Broche 9 | RA7 — GPIO/analog AN7 |
| Broche 10 | VSS — Ground |
| Broche 11 | RB0 — GPIO/PGED1 |
| Broche 12 | RB1 — GPIO/PGEC1 |
| Broche 13 | RB2 — GPIO/AN8 |
| Broche 14 | RB3 — GPIO/AN9 |
| Broche 15 | RB4 — GPIO/AN10 |
| Broche 16 | RB5 — GPIO/AN11 |
| Broche 17 | RB6 — GPIO/AN12 |
| Broche 18 | RB7 — GPIO/AN13 |
| Broche 19 | VSS — Ground |
| Broche 20 | RC0 — GPIO |
| Broche 21 | RC1 — GPIO |
| Broche 22 | RC2 — GPIO |
| Broche 23 | RC3 — GPIO |
| Broche 24 | RC4 — GPIO |
| Broche 25 | RC5 — GPIO |
| Broche 26 | RC6 — GPIO |
| Broche 27 | RC7 — GPIO |
| Broche 28 | VSS — Ground |
| Broche 29 | RD0 — GPIO |
| Broche 30 | RD1 — GPIO |
| Broche 31 | RD2 — GPIO |
| Broche 32 | RD3 — GPIO |
| Broche 33 | RD4 — GPIO |
| Broche 34 | RD5 — GPIO |
| Broche 35 | RD6 — GPIO |
| Broche 36 | RD7 — GPIO |
| Broche 37 | VSS — Ground |
| Broche 38 | RE0 — GPIO |
| Broche 39 | RE1 — GPIO |
| Broche 40 | RE2 — GPIO |
| Broche 41 | RE3 — GPIO |
| Broche 42 | RE4 — GPIO |
| Broche 43 | RE5 — GPIO |
| Broche 44 | RE6 — GPIO |
| Broche 45 | RE7 — GPIO |
| Broche 46 | VSS — Ground |
| Broche 47 | RF0 — GPIO |
| Broche 48 | RF1 — GPIO |
| Broche 49 | RF2 — GPIO |
| Broche 50 | RF3 — GPIO |
| Broche 51 | RF4 — GPIO |
| Broche 52 | RF5 — GPIO |
| Broche 53 | RF6 — GPIO |
| Broche 54 | RF7 — GPIO |
| Broche 55 | VSS — Ground |
| Broche 56 | RG0 — GPIO |
| Broche 57 | RG1 — GPIO |
| Broche 58 | RG2 — GPIO |
| Broche 59 | RG3 — GPIO |
| Broche 60 | RG6 — GPIO |
| Broche 61 | RG7 — GPIO |
| Broche 62 | RG8 — GPIO |
| Broche 63 | RG9 — GPIO |
| Broche 64 | EP — Exposed thermal pad - tie to ground |
Applications typiques
PIC32MZ1024EFH064-E/MR convient pour 6 applications: Industrial Ethernet Motor Drives, Automotive HMI Clusters, USB Data-Acquisition Modules, Secure IoT Gateways, Industrial HMI / Display Controllers, Automotive Body Control Modules.
Industrial Ethernet Motor Drives
PIC32MZ1024EFH064-E/MR suits industrial Ethernet-connected motor drives because its 200 MHz MIPS M-class core delivers 330 DMIPS with hardware FPU, sustaining torque-loop math and 10/100 Ethernet MAC stack concurrently. The 512 KB SRAM is large enough to hold TCP/IP plus a real-time control loop, while dual-panel Flash enables fail-safe firmware rollback for field-deployed drives. The 12-bit ADC with up to 24 channels digitizes multi-phase current sensing without external ADCs, and AEC-Q100 grade plus -40 C to +125 C range is over-spec for most factory-floor enclosures.
Recommandé
Automotive HMI Clusters
The PIC32MZ1024EFH064-E/MR drives automotive HMI clusters by pairing its 200 MHz MIPS M-class core, 1 MB Flash, and 512 KB SRAM with the GPU-less graphical library stack supported by Microchip. The integrated HS USB 2.0 (host/device/OTG) accepts media playback and phone mirroring, while CAN and Ethernet MACs provide body-network connectivity. AEC-Q100 qualification and -40 C to +125 C range let this part operate in dashboard modules, while dual-panel Flash supports OEM OTA update flows with rollback on update failure.
Recommandé
USB Data-Acquisition Modules
For USB-connected data-acquisition modules, PIC32MZ1024EFH064-E/MR provides the integrated HS USB 2.0 OTG controller that streams multi-channel ADC samples to a host PC at line rate without external PHY glue. The 12-bit ADC with up to 24 channels digitizes thermocouples, strain gauges, or vibration sensors; the 200 MHz core performs on-chip FFT and decimation before transmission. The 1 MB Flash hosts Microchip's USB stack plus a DSP library, while 512 KB SRAM buffers multi-channel streams ahead of USB enumeration.
Recommandé
Secure IoT Gateways
PIC32MZ1024EFH064-E/MR serves secure IoT gateways by combining its 200 MHz MIPS M-class core and FPU with Ethernet MAC plus HS USB and CAN for diverse field-bus connectivity. Note that the H suffix (no crypto) means secure boot requires an external companion such as ATECC608B; designers not needing crypto can drop the -E and use the G suffix. Dual-panel Flash still enables secure OTA rollback, and AEC-Q100 grade plus 125 C rating is over-spec for outdoor enclosures, simplifying industrial deployment.
Recommandé
Industrial HMI / Display Controllers
For factory HMI panels and small graphics displays, PIC32MZ1024EFH064-E/MR pairs its 1 MB Flash and 512 KB SRAM with the Microchip HMI library stack to drive TFTs up to WVGA without an external graphics controller. The 200 MHz MIPS M-class core sustains anti-aliased UI rendering while polling touch over SPI; the FPU accelerates sprite transforms. AEC-Q100 grade plus 125 C operation lets this part serve cabinet-mount HMIs that share the factory thermal envelope with motor drives.
Recommandé
Automotive Body Control Modules
Automotive body control modules benefit from PIC32MZ1024EFH064-E/MR's AEC-Q100 grade, -40 C to +125 C operation, and rich peripheral mix (CAN, LIN, Ethernet, USB). The 200 MHz MIPS core runs door-zone and lighting logic with FPU math for sensor fusion, while 24 ADC channels digitize switch matrices and Hall-effect sensors. The 1 MB Flash hosts multiple software variants for cross-OEM builds, and dual-panel Flash enables secure rollback if a parametric update fails in the field.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ1024EFH064-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ1024EFG064-E/MR | PIC32MZ1024EFF064-I/MR | PIC32MZ1024ECG064-I/MR | PIC32MZ1024EFK064-E/MR | PIC32MZ1024ECH064-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | TQFP-64 (10x10 mm) - different |
| Maximum Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| AEC-Q100 Qualified | Yes | Yes | No (industrial) | No (industrial) | Yes | No (industrial) |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C |
| Hardware Crypto | No | Yes | No | No | No | No |
Principaux différenciateurs
- AEC-Q100 automotive grade at extended temperature (vs PIC32MZ1024EFG064-I/MR)
- Dual-panel Flash for live firmware update (vs PIC32MX795F512L-80I/PT)
- Hardware floating point unit (vs PIC32MX775F512L-80V/PT)
Notes de conception
The 64-QFN (9x9 mm) package dissipates heat primarily through the exposed thermal pad (pin 64/EP). Solder the pad to a minimum 2 cm x 2 cm copper pour tied to the ground plane with multiple thermal vias (8-12 vias, 0.3 mm drill). At industrial temperatures up to +85 C ambient, this design dissipates up to 1 W continuous; without thermal vias the junction temperature can exceed +125 C and trigger thermal shutdown.
Place decoupling capacitors within 5 mm of each VDD/VSS pair: 100 nF X7R ceramic on each supply pin, plus 4.7 uF bulk on the main 3.3 V rail. The MCU has multiple VDD/VSS pairs clustered around GPIO banks; missing decoupling on a single bank can inject switching noise into ADC sampling. Microchip's PIC32MZ EF hardware checklist (DS60001320G) recommends 4-layer PCB with continuous ground plane for signal integrity.
Do not confuse the E (extended automotive) suffix with the G (hardware crypto) suffix. PIC32MZ1024EFH064-E/MR lacks the crypto engine; for secure boot use the -G- variant or add an external ATECC608B companion. Also note the E suffix mandates -40 C to +125 C operation; -40 C to +85 C parts use the I suffix and are not AEC-Q100 qualified.
Route the 50 MHz Ethernet MII or RMII signals as controlled-impedance traces (50 ohm single-ended, 100 ohm differential for RMII). Place the LAN8742A PHY within 50 mm of the MCU and route clock traces first; match trace lengths within 25 mm for RMII. The HS USB 2.0 D+/D- differential pair requires 90 ohm differential impedance; keep total length under 50 mm to avoid signal-integrity failures.
Informations de conformité
AEC-Q100 qualified per Microchip product page (suffix E). RoHS and REACH compliant per distributor listings. Conflict-minerals statement available from Microchip.
