XC3S5000-5FG900C - 5M Gate Spartan-3 FPGA | Xilinx
MPN: XC3S5000-5FG900C ✗ اختتامِ زندگیXC3S5000-5FG900C جائزہ
A field-programmable gate array is a digital semiconductor whose configurable logic blocks, programmable interconnects, and input/output resources are configured after manufacture. The FPGA category sits within programmable logic, alongside complex programmable logic devices, and provides hardware-level parallelism without the recurring silicon cost of a fully custom application-specific integrated circuit. The Spartan-3 architecture combines configurable logic, dedicated block RAM, dedicated multipliers, and programmable I/O within one device.
The XC3S5000-5FG900C provides 5 million system gates, 74,880 logic cells, and a maximum frequency of 725 MHz. Its -5 designation identifies the performance grade, while the FG900 package designation identifies the 900-ball square FBGA configuration. A 1.2 V core supply and 90 nm process technology are also associated with this device, allowing it to target high-density logic, embedded processing, and interface-control applications where an FPGA implementation is more flexible than a fixed-function ASIC.
The programmable resources let one physical design support multiple product variations through configuration rather than multiple fixed masks. Parallel logic can accelerate datapaths, protocol handling, packet filtering, and control functions that would otherwise require many discrete components. The large 900-pin package exposes substantial I/O and dedicated-function connectivity, but it also requires careful ball-grid layout planning, multilayer routing, and thermal-aware assembly practices.
Typical applications include broadband access equipment, home networking, industrial control, communications infrastructure, and embedded control systems. The Spartan-3 device is appropriate when design flexibility, parallel processing, and field reconfiguration justify the complexity of a high-pin-count BGA package. It is also useful in legacy systems that depend on the established Spartan-3 toolchain and device ecosystem.
PCB implementation should prioritize power integrity because the device uses a 1.2 V core and numerous high-speed I/O rails. Follow the manufacturer's recommended decoupling, ball assignments, and layer-stack guidance rather than improvising a high-density escape-routing strategy. Component placement should also account for the thermal characteristics of a large FBGA and the heat generated by sustained switching activity.
This product overview combines the device's core architectural identifiers with practical guidance for replacement assessment, package planning, sourcing, and application selection. The comparison and design notes focus on engineering decisions that are not apparent from a catalog listing alone.
کے لیے ڈراپ اِن متبادل XC3S5000-5FG900C — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں XC3S5000-5FG900C (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Package, System Gates.
XC3S5000-4FG900C
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
XC3S5000-4FG900I
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC3S5000-4FG900E
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC3S5000-5FG900I
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC3S5000-5FG900E
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
XC3S5000-5FG900C زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| FPGA Family | Spartan-3 |
| System Gates | 5 million gates |
| Logic Cells | 74,880 cells |
| Maximum Frequency | 725 MHz |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Performance Grade | -5 |
| Temperature Grade Suffix | C |
| پیکیج | 900-pin FG900 FBGA |
| Terminal Count | 900 balls |
| Package Shape | Square |
| ماؤنٹنگ ٹائپ | Surface Mount |
| Terminal Form | Ball |
XC3S5000-5FG900C square پن کنفیگریشن گائیڈ
XC3S5000-5FG900C (square پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں XC3S5000-5FG900C.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
XC3S5000-5FG900C کے لیے موزوں ہے 6 ایپلیکیشنs: Broadband Access Equipment, Industrial Networking and Control, Embedded Control and Instrumentation, Network Storage Interfaces, Data Acquisition and Signal Processing, Legacy Communications Adapters.
Broadband Access Equipment
The XC3S5000-5FG900C fits broadband access equipment requiring parallel packet classification, traffic shaping, and protocol-control functions. Its 74,880 logic cells and 725 MHz maximum frequency provide substantial configurable processing capacity, while the 900-ball FG900 package exposes a large number of external connections for line interfaces, memory, and control logic. A design team can place packet filters, queues, CRC engines, and administrative interfaces in one programmable device, reducing the need for separate fixed-function controllers. The principal trade-off is board complexity: the large BGA requires careful layer assignment, power delivery, signal conditioning, and assembly validation.
تجویز کردہ
Industrial Networking and Control
The XC3S5000-5FG900C is appropriate for industrial networking equipment combining Ethernet-facing logic, protocol conversion, motion control, and supervisory functions. Its configurable architecture allows multiple communication interfaces and real-time control paths to coexist in one FPGA, while the -5 grade provides a 725 MHz maximum frequency for timing-sensitive datapaths. The FG900 package offers more balls than small FPGA packages, which helps when a design needs several memories, transceivers, and isolated communications. For deployed factory equipment, the I- or E-grade ordering suffix should be selected when the commercial temperature class cannot cover the operating environment.
تجویز کردہ
Embedded Control and Instrumentation
The XC3S5000-5FG900C can serve as the central programmable controller in instrumentation that combines sequencing, data acquisition, local processing, and communication. With 74,880 logic cells, the device can host multiple parallel control engines instead of forcing them into a single processor pipeline. Its maximum frequency of 725 MHz supports demanding timing paths, and the 900-pin package provides substantial connectivity for converters, memory, clocks, and communications. Engineers should use the manufacturer timing and power constraints to partition high-speed and low-speed logic, while accounting for the large BGA's thermal and inspection requirements.
تجویز کردہ
Network Storage Interfaces
The XC3S5000-5FG900C is suitable for network storage controllers that require parallel handling of data paths, parity, error checking, and command logic. The FPGA's 5 million system gates and 74,880 logic cells allow multiple storage interfaces and data-processing pipelines to be implemented concurrently. Its 725 MHz maximum frequency supports demanding datapaths, while the 900-ball FG900 package supplies the pin count needed for wide external buses and several memory devices. The tradeoff is implementation effort: memory timing, I/O standards, clocking, and power sequencing must be validated together because the large package does not remove high-speed design constraints.
تجویز کردہ
Data Acquisition and Signal Processing
The XC3S5000-5FG900C can support parallel data-acquisition, filtering, and signal-conditioning logic where deterministic hardware execution is more valuable than a sequential processor approach. Its 74,880 logic cells allow multiple acquisition channels and digital filters to operate in parallel, and the listed 725 MHz maximum frequency provides margin for demanding timing paths. The FG900 package offers extensive connectivity for converters, clock sources, memories, and data outputs. Engineers should separate analog and digital zones on the PCB, control clock jitter, and follow the manufacturer's I/O and decoupling guidance to avoid degrading acquisition accuracy.
تجویز کردہ
Legacy Communications Adapters
The XC3S5000-5FG900C can be used in legacy communications adapters that need programmable protocol conversion, framing, buffering, and host-interface logic. A single high-density FPGA can consolidate several functions while preserving configuration flexibility for different line rates or customer configurations. Its 5 million system gates and 74,880 logic cells provide capacity for concurrent datapaths, and the 900-ball package accommodates substantial external connectivity. The design must still account for Spartan-3 migration constraints, board-level signal integrity, configuration-file management, and long-term software-tool support before use in a new production platform.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا XC3S5000-5FG900C — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | XC3S5000-4FG900C | XC3S5000-4FG900I | XC3S5000-4FG900E | XC3S5000-5FG900I | XC3S5000-5FG900E |
|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | 900-pin FG900 FBGA | 900-pin FG900 FBGA | 900-pin FG900 FBGA | 900-pin FG900 FBGA | 900-pin FG900 FBGA | 900-pin FG900 FBGA |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| Performance Grade | -5 | -4 | -4 | -4 | -5 | -5 |
| Temperature Grade Suffix | C | C | I | E | I | E |
اہم امتیازی خصوصیات
- Highest listed performance grade within the compared XC3S5000 FG900 options (بمقابلہXC3S5000-4FG900C)
- Maintains the -5 performance grade while covering a broader temperature class (بمقابلہXC3S5000-5FG900I)
- Offers the same high-density Spartan-3 architecture without a package redesign (بمقابلہXC3S5000-4FG900E)
ڈیزائن نوٹس
The 900-ball FG900 package requires a deliberate escape-routing strategy. Follow the manufacturer package drawing and recommended PCB stack-up rather than routing directly from arbitrary balls. Separate high-speed signal layers from noisy power stages, place decoupling capacitance near the relevant supply balls, and preserve the recommended reference-plane path beneath signal layers. Validate escape density and layer transitions with the actual component placement before releasing the fabrication package.
Plan the 1.2 V core rail and all supported I/O rails as a complete power-delivery network. Use the manufacturer power-decoupling topology, maintain the specified voltage tolerances, and avoid long shared paths between ball groups. Because the FG900 package contains many high-current connections, power and ground distribution require careful via staggering and plane segmentation. Validate steady-state and transient voltage at the device balls rather than relying only on measurements at the power regulator.
Estimate worst-case FPGA power before choosing the board thermal solution. Estimated: use the configured core and I/O activity from the final design, multiply each rail's calculated power by its supply voltage, and sum the rail totals. Compare that total with the board's thermal resistance under the intended airflow and ambient temperature. The large FGGA footprint can provide useful heat-spreading area, but it also concentrates thermal challenges when several high-utilization regions operate simultaneously.
Do not treat a same-package suffix change as an automatic production replacement. The -4 and -5 identifiers select different performance grades, while C, I, and E identify different temperature classes. Before substituting XC3S5000-4FG900C, XC3S5000-4FG900I, XC3S5000-4FG900E, XC3S5000-5FG900I, or XC3S5000-5FG900E, rerun timing analysis, confirm the environmental requirement, verify power behavior, and regenerate the device configuration with the selected speed grade.
تعمیل کی معلومات
No explicit RoHS, REACH, halogen-free, lead-free, conflict-minerals, or automotive qualification statement was identified. The AEC-Q100 field is marked not applicable because no automotive qualification is stated for this device.
