XC3S5000-5FG900C - 5M Gate Spartan-3 FPGA | Xilinx XC3S5000-5FG900C bởi Xilinx - thành phần điện tử
Xilinx

XC3S5000-5FG900C - 5M Gate Spartan-3 FPGA | Xilinx

MPN: XC3S5000-5FG900C ✗ Cuối đời
1.2 V Vdss 900-pin FG900 FBGA Package 725 MHz Speed
Yêu cầu báo giá
MOQ: 1 |
Xem tài liệu kỹ thuật (PDF) Xem các bộ thay thế

XC3S5000-5FG900C Tóm tắt

The Xilinx XC3S5000-5FG900C is a 5 million-system-gate Spartan-3 field-programmable gate array with 74,880 logic cells, a maximum frequency of 725 MHz, and a 1.2 V core supply in a 900-pin FG900 FBGA package. It is designed for cost-sensitive, high-volume programmable-logic systems that require substantial parallel processing capability in a surface-mount package.

A field-programmable gate array is a digital semiconductor whose configurable logic blocks, programmable interconnects, and input/output resources are configured after manufacture. The FPGA category sits within programmable logic, alongside complex programmable logic devices, and provides hardware-level parallelism without the recurring silicon cost of a fully custom application-specific integrated circuit. The Spartan-3 architecture combines configurable logic, dedicated block RAM, dedicated multipliers, and programmable I/O within one device.

The XC3S5000-5FG900C provides 5 million system gates, 74,880 logic cells, and a maximum frequency of 725 MHz. Its -5 designation identifies the performance grade, while the FG900 package designation identifies the 900-ball square FBGA configuration. A 1.2 V core supply and 90 nm process technology are also associated with this device, allowing it to target high-density logic, embedded processing, and interface-control applications where an FPGA implementation is more flexible than a fixed-function ASIC.

The programmable resources let one physical design support multiple product variations through configuration rather than multiple fixed masks. Parallel logic can accelerate datapaths, protocol handling, packet filtering, and control functions that would otherwise require many discrete components. The large 900-pin package exposes substantial I/O and dedicated-function connectivity, but it also requires careful ball-grid layout planning, multilayer routing, and thermal-aware assembly practices.

Typical applications include broadband access equipment, home networking, industrial control, communications infrastructure, and embedded control systems. The Spartan-3 device is appropriate when design flexibility, parallel processing, and field reconfiguration justify the complexity of a high-pin-count BGA package. It is also useful in legacy systems that depend on the established Spartan-3 toolchain and device ecosystem.

PCB implementation should prioritize power integrity because the device uses a 1.2 V core and numerous high-speed I/O rails. Follow the manufacturer's recommended decoupling, ball assignments, and layer-stack guidance rather than improvising a high-density escape-routing strategy. Component placement should also account for the thermal characteristics of a large FBGA and the heat generated by sustained switching activity.

This product overview combines the device's core architectural identifiers with practical guidance for replacement assessment, package planning, sourcing, and application selection. The comparison and design notes focus on engineering decisions that are not apparent from a catalog listing alone.

Bộ thay thế dễ dàng lắp đặt cho XC3S5000-5FG900C — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với XC3S5000-5FG900C (cùng hình factor và footprint) — khác nhau ở Package, System Gates.

Xilinx
Package: 900-ball FBGA
System Gates: 5,000,000 gates
So sánh với XC3S5000-5FG900C →

XC3S5000-4FG900C

✅ Drop-In ⚠️ Thông số chưa được xác minh
Xilinx
📦 900-pin FG900 FBGA
Spartan-3 field-programmable gate array (FPGA) · 5,000,000 gates · 74,880 cells · 633 I/Os · 630 MHz · 1.2 V · 90 nm · 900-ball FBGA

Liên hệ để biết giá

XC3S5000-4FG900I

✅ Drop-In ⚠️ Thông số chưa được xác minh
📦 900-pin FG900 FBGA
Uses the -4 performance grade and I temperature suffix, combining one lower speed grade with one higher temperature class than the target.

📋 Tham chiếu thay thế (không có trong danh mục)

XC3S5000-4FG900E

✅ Drop-In ⚠️ Thông số chưa được xác minh
📦 900-pin FG900 FBGA
Uses the -4 performance grade and E temperature suffix, changing one speed grade and one temperature class from the target.

📋 Tham chiếu thay thế (không có trong danh mục)

XC3S5000-5FG900I

✅ Drop-In ⚠️ Thông số chưa được xác minh
📦 900-pin FG900 FBGA
Retains the -5 performance grade but uses the I temperature suffix, which is one temperature-class step above the C suffix.

📋 Tham chiếu thay thế (không có trong danh mục)

XC3S5000-5FG900E

✅ Drop-In ⚠️ Thông số chưa được xác minh
📦 900-pin FG900 FBGA
Retains the -5 performance grade but uses the E temperature suffix, which is one temperature-class step above the C suffix.

📋 Tham chiếu thay thế (không có trong danh mục)

XC3S5000-5FG900C Tỷ lệ tối đa & tính chất điện

FPGA Family Spartan-3
System Gates 5 million gates
Logic Cells 74,880 cells
Maximum Frequency 725 MHz
Process Technology 90 nm
Core Supply Voltage 1.2 V
Performance Grade -5
Temperature Grade Suffix C
Hộp 900-pin FG900 FBGA
Terminal Count 900 balls
Package Shape Square
Kiểu lắp đặt Surface Mount
Terminal Form Ball

Hướng dẫn cấu hình chân XC3S5000-5FG900C square

Cấu hình chân cho XC3S5000-5FG900C (square gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.

Bảng cấu hình chân square cho XC3S5000-5FG900C

Không có dữ liệu chân cụ thể sẵn có cho XC3S5000-5FG900C.

Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.

Ứng dụng tiêu biểu

XC3S5000-5FG900C phù hợp cho 6 Áp dụngs: Broadband Access Equipment, Industrial Networking and Control, Embedded Control and Instrumentation, Network Storage Interfaces, Data Acquisition and Signal Processing, Legacy Communications Adapters.

🌐

Broadband Access Equipment

The XC3S5000-5FG900C fits broadband access equipment requiring parallel packet classification, traffic shaping, and protocol-control functions. Its 74,880 logic cells and 725 MHz maximum frequency provide substantial configurable processing capacity, while the 900-ball FG900 package exposes a large number of external connections for line interfaces, memory, and control logic. A design team can place packet filters, queues, CRC engines, and administrative interfaces in one programmable device, reducing the need for separate fixed-function controllers. The principal trade-off is board complexity: the large BGA requires careful layer assignment, power delivery, signal conditioning, and assembly validation.

Được đề xuất

XC3S5000-5FG900I (same-package industrial temperature-grade variant) XC3S5000-5FG900E (same-package extended temperature-grade variant)
🏭

Industrial Networking and Control

The XC3S5000-5FG900C is appropriate for industrial networking equipment combining Ethernet-facing logic, protocol conversion, motion control, and supervisory functions. Its configurable architecture allows multiple communication interfaces and real-time control paths to coexist in one FPGA, while the -5 grade provides a 725 MHz maximum frequency for timing-sensitive datapaths. The FG900 package offers more balls than small FPGA packages, which helps when a design needs several memories, transceivers, and isolated communications. For deployed factory equipment, the I- or E-grade ordering suffix should be selected when the commercial temperature class cannot cover the operating environment.

Được đề xuất

XC3S5000-5FG900I (industrial temperature-grade package match) XC3S5000-4FG900I (lower-speed industrial package alternative)
📡

Embedded Control and Instrumentation

The XC3S5000-5FG900C can serve as the central programmable controller in instrumentation that combines sequencing, data acquisition, local processing, and communication. With 74,880 logic cells, the device can host multiple parallel control engines instead of forcing them into a single processor pipeline. Its maximum frequency of 725 MHz supports demanding timing paths, and the 900-pin package provides substantial connectivity for converters, memory, clocks, and communications. Engineers should use the manufacturer timing and power constraints to partition high-speed and low-speed logic, while accounting for the large BGA's thermal and inspection requirements.

Được đề xuất

XC3S5000-5FG900I (industrial package variant for extended environments) XC3S5000-5FG900E (extended temperature package variant)
🖥️

Network Storage Interfaces

The XC3S5000-5FG900C is suitable for network storage controllers that require parallel handling of data paths, parity, error checking, and command logic. The FPGA's 5 million system gates and 74,880 logic cells allow multiple storage interfaces and data-processing pipelines to be implemented concurrently. Its 725 MHz maximum frequency supports demanding datapaths, while the 900-ball FG900 package supplies the pin count needed for wide external buses and several memory devices. The tradeoff is implementation effort: memory timing, I/O standards, clocking, and power sequencing must be validated together because the large package does not remove high-speed design constraints.

Được đề xuất

XC3S5000-4FG900C · Xilinx XC3S5000-4FG900I (same-package lower-speed industrial alternative)
📺

Data Acquisition and Signal Processing

The XC3S5000-5FG900C can support parallel data-acquisition, filtering, and signal-conditioning logic where deterministic hardware execution is more valuable than a sequential processor approach. Its 74,880 logic cells allow multiple acquisition channels and digital filters to operate in parallel, and the listed 725 MHz maximum frequency provides margin for demanding timing paths. The FG900 package offers extensive connectivity for converters, clock sources, memories, and data outputs. Engineers should separate analog and digital zones on the PCB, control clock jitter, and follow the manufacturer's I/O and decoupling guidance to avoid degrading acquisition accuracy.

Được đề xuất

XC3S5000-5FG900I (industrial package alternative) XC3S5000-4FG900C · Xilinx
🔧

Legacy Communications Adapters

The XC3S5000-5FG900C can be used in legacy communications adapters that need programmable protocol conversion, framing, buffering, and host-interface logic. A single high-density FPGA can consolidate several functions while preserving configuration flexibility for different line rates or customer configurations. Its 5 million system gates and 74,880 logic cells provide capacity for concurrent datapaths, and the 900-ball package accommodates substantial external connectivity. The design must still account for Spartan-3 migration constraints, board-level signal integrity, configuration-file management, and long-term software-tool support before use in a new production platform.

Được đề xuất

XC3S5000-5FG900I (same-package industrial temperature alternative) XC3S5000-5FG900E (same-package extended temperature alternative)

Tóm tắt các sản phẩm được đề xuất

XC3S5000-5FG900I same-package industrial temperature-grade variant Được sử dụng trong: Broadband Access Equipment, Industrial Networking and Control, Embedded Control and Instrumentation, Data Acquisition and Signal Processing, Legacy Communications Adapters XC3S5000-5FG900E same-package extended temperature-grade variant Được sử dụng trong: Broadband Access Equipment, Embedded Control and Instrumentation, Legacy Communications Adapters XC3S5000-4FG900I lower-speed industrial package alternative Được sử dụng trong: Industrial Networking and Control, Network Storage Interfaces XC3S5000-4FG900C Xilinx Được sử dụng trong: Network Storage Interfaces, Data Acquisition and Signal Processing
What are the key specifications of XC3S5000-5FG900C that engineers should know?
The XC3S5000-5FG900C is a Spartan-3 FPGA with 5 million system gates, 74,880 logic cells, a maximum frequency of 725 MHz, and a 1.2 V core supply in a 900-pin FG900 FBGA package. According to the Xilinx Spartan-3 device documentation, the -5 code identifies the performance grade and FG900 identifies the package configuration. These figures position the device as a relatively high-density Spartan-3 option for parallel datapaths, embedded control, packet processing, communications, and cost-sensitive systems that benefit from field programmability.
What is the XC3S5000-5FG900C used for?
The XC3S5000-5FG900C is used as a programmable-logic platform for parallel digital processing and hardware-controlled system functions. Its 74,880 logic cells and 725 MHz maximum frequency allow designers to implement control logic, packet-processing paths, fixed-function accelerators, and multi-interface systems in one FPGA. According to the Xilinx device documentation, its 5 million system gates provide substantial configuration capacity, while the -5 performance grade supports timing-focused designs. The device is especially suitable when post-deployment configuration changes are valuable or when one board must support several hardware personalities.
How many logic cells and I/O terminals does the XC3S5000-5FG900C have?
The XC3S5000-5FG900C contains 74,880 logic cells and has 900 ball terminals in the FG900 package. The device also provides 5 million system gates and a listed maximum frequency of 725 MHz. According to the Xilinx Spartan-3 device documentation, the 900-ball package supports a large pin count compared with smaller FPGA packages, which is valuable for designs carrying multiple external interfaces. Its 1.2 V core supply and 90 nm process technology define the power and implementation environment that the board design must support.
Where can I find the XC3S5000-5FG900C pinout?
The XC3S5000-5FG900C pinout is found in the pin-definition and package tables of the Xilinx Spartan-3 device documentation and in the corresponding FG900 package information. The device uses a 900-ball grid, so the complete ball map cannot be reconstructed reliably from the catalog identifiers alone. Use the manufacturer package drawing to verify ball coordinates, power pins, configuration pins, I/O standards, and dedicated-function pins before assigning any PCB tracks or selecting companion components.
Where can I download the XC3S5000-5FG900C datasheet PDF?
The XC3S5000-5FG900C datasheet is available through the Xilinx Spartan-3 device documentation and the linked manufacturer-data mirror for the XC3S5000 family. According to the Spartan-3 documentation, the device sheet contains the FG900 pinout, switching tables, electrical characteristics, supported I/O standards, and configuration information. Search by the complete orderable part number XC3S5000-5FG900C, and verify that the document covers both the Spartan-3 device family and the 900-ball FG900 package.
Where can I buy XC3S5000-5FG900C online?
You can request XC3S5000-5FG900C availability through the Request a Quote form on this page. The part is identified as a 900-pin FG900 Spartan-3 FPGA with 74,880 logic cells, a -5 performance grade, and a 725 MHz maximum frequency. Because this device belongs to a mature FPGA family and has a large BGA footprint, confirm the package suffix, die revision, assembly requirements, and programming-file compatibility as part of any procurement request.
What is the price of XC3S5000-5FG900C?
Use the Request a Quote form on this page for the current XC3S5000-5FG900C quotation and quantity breaks. The device is a 900-pin FG900 Spartan-3 FPGA with 74,880 logic cells and a 725 MHz maximum frequency. Its lifecycle, specialty sourcing status, assembly requirements, and large BGA package can materially affect commercial terms, so a quotation should include the exact suffix, target quantity, delivery location, and required inspection or traceability level.
What is the lead time for XC3S5000-5FG900C?
Request the current XC3S5000-5FG900C lead time through the Request a Quote form on this page. Lead time depends on inventory, wafer availability, device status, assembly capacity, and the exact package suffix, none of which should be inferred from a catalog result. Include the quantity schedule and required delivery date in the request. For production planning, also identify whether the shipment must include manufacturer traceability, programming support, or inspection documentation.
Is XC3S5000-5FG900C in stock?
Current XC3S5000-5FG900C stock must be confirmed through the Request a Quote form on this page. The exact device is a 900-pin FG900 Spartan-3 FPGA containing 74,880 logic cells, so package availability is not interchangeable with availability of another Spartan-3 speed or temperature grade. State the required quantity and delivery schedule in the request, and avoid treating a generic FPGA inventory statement as confirmation that this exact 5M-gate FG900 configuration is available.
XC3S5000-5FG900C vs XC3S5000-4FG900C: which speed grade is better?
The XC3S5000-5FG900C is the higher listed performance grade, with a maximum frequency of 725 MHz, while the XC3S5000-4FG900C represents the lower -4 grade. Both remain in the same Spartan-3 device family and use the FG900 package designation. According to the Xilinx family documentation, the -5 suffix is intended for designs requiring the higher performance option. The correct choice depends on timing closure, power budget, and tool-supported speed-grade selection rather than merely on the highest available frequency label.
What is the difference between XC3S5000-5FG900C and XC3S5000-5FG900I?
The primary ordering-code difference is the temperature-grade suffix: the XC3S5000-5FG900C carries the C suffix, while the XC3S5000-5FG900I carries the I suffix. Both use the -5 performance grade, the Spartan-3 family, and the 900-pin FG900 package. According to the Xilinx ordering information, these suffixes identify different commercial temperature classes. The I-grade device is intended for industrial environments, so it is the preferred choice when the C-grade operating range does not cover the system requirement.
When should I choose XC3S5000-5FG900C over XC3S5000-4FG900C?
Choose XC3S5000-5FG900C when the design requires the higher -5 performance option and its listed 725 MHz maximum frequency. Choose XC3S5000-4FG900C when the lower speed grade is sufficient and power, thermal margin, or sourcing considerations favor it. Both devices retain the 74,880-logic-cell Spartan-3 architecture and FG900 package format. The decision should follow timing analysis using the actual I/O topology, clock targets, utilization, and board environment rather than relying only on the maximum-frequency headline.
Is XC3S5000-5FG900C suitable for broadband and networking equipment?
The XC3S5000-5FG900C is suitable for broadband and networking equipment when its 74,880 logic cells, 5 million system gates, and 725 MHz maximum frequency fit the required datapath. Its 900-pin FG900 package also provides a large external interface count for multiple network or storage interfaces. According to the Xilinx Spartan-3 application positioning, the family is appropriate for cost-sensitive, high-volume communication designs. Final suitability depends on timing closure, supported I/O standards, memory resources, and thermal performance.
What is the best drop-in replacement for XC3S5000-5FG900C?
The closest drop-in choices are same-package Spartan-3 FG900 variants that retain the 74,880-logic-cell architecture and preserve the physical ball grid. XC3S5000-4FG900C changes the performance grade, while XC3S5000-4FG900I and XC3S5000-4FG900E also change speed and temperature class. XC3S5000-5FG900I and XC3S5000-5FG900E preserve the -5 speed grade but use higher temperature suffixes. Validate timing, temperature, power, and configuration compatibility before treating any of them as a production substitute.
What can replace XC3S5000-5FG900C?
A practical replacement must use the 900-ball FG900 footprint and provide compatible power, configuration, clock, I/O, and timing resources. The XC3S5000-4FG900C, XC3S5000-4FG900I, XC3S5000-4FG900E, XC3S5000-5FG900I, and XC3S5000-5FG900E are same-family package matches, but each changes either performance grade or temperature class relative to the XC3S5000-5FG900C. A cross-brand replacement would require a complete footprint, timing, tool, and architecture migration rather than a simple board substitution.
Is XC3S5000-5FG900C the same as XC3S5000-5FG900I, and what is the best cross-brand equivalent?
The XC3S5000-5FG900C and XC3S5000-5FG900I share the Spartan-3 die, -5 performance grade, and FG900 package, but the C and I suffixes identify different temperature classes. The XC3S5000-5FG900C should be selected when the commercial temperature class satisfies the product environment. No verified cross-brand equivalent with a confirmed identical 900-ball pinout was identified, so a cross-brand substitution should not be treated as drop-in without a complete electrical, timing, and PCB compatibility review.

Dữ liệu tham khảo kỹ thuật cho XC3S5000-5FG900C — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.

Hướng dẫn chọn lựa

Choose the XC3S5000-5FG900C when an existing design requires the Spartan-3 5M-gate device in the 900-ball FG900 package and its -5 performance class supports timing closure. The C temperature suffix makes it appropriate where the commercial operating class is sufficient. Select XC3S5000-4FG900C when the lower -4 grade meets timing and power requirements and sourcing conditions favor that grade. Use XC3S5000-4FG900I or XC3S5000-4FG900E when the environment requires a higher temperature class and the reduced performance grade remains acceptable. XC3S5000-5FG900I and XC3S5000-5FG900E preserve the -5 speed class for temperature-constrained systems without changing the package. For every alternative, confirm the complete ball assignment, configuration-file timing, I/O limits, power behavior, and software-tool support before approving a substitution.

So sánh với các sản phẩm thay thế

Tham số Sản phẩm này XC3S5000-4FG900C XC3S5000-4FG900I XC3S5000-4FG900E XC3S5000-5FG900I XC3S5000-5FG900E
Brand Xilinx Xilinx Xilinx Xilinx Xilinx Xilinx
Package 900-pin FG900 FBGA 900-pin FG900 FBGA 900-pin FG900 FBGA 900-pin FG900 FBGA 900-pin FG900 FBGA 900-pin FG900 FBGA
FPGA Family Spartan-3 Spartan-3 Spartan-3 Spartan-3 Spartan-3 Spartan-3
Performance Grade -5 -4 -4 -4 -5 -5
Temperature Grade Suffix C C I E I E

Bảo phân biệt quan trọng

  • Highest listed performance grade within the compared XC3S5000 FG900 options (vsXC3S5000-4FG900C)
  • Maintains the -5 performance grade while covering a broader temperature class (vsXC3S5000-5FG900I)
  • Offers the same high-density Spartan-3 architecture without a package redesign (vsXC3S5000-4FG900E)

Ghi chú thiết kế

The 900-ball FG900 package requires a deliberate escape-routing strategy. Follow the manufacturer package drawing and recommended PCB stack-up rather than routing directly from arbitrary balls. Separate high-speed signal layers from noisy power stages, place decoupling capacitance near the relevant supply balls, and preserve the recommended reference-plane path beneath signal layers. Validate escape density and layer transitions with the actual component placement before releasing the fabrication package.

Plan the 1.2 V core rail and all supported I/O rails as a complete power-delivery network. Use the manufacturer power-decoupling topology, maintain the specified voltage tolerances, and avoid long shared paths between ball groups. Because the FG900 package contains many high-current connections, power and ground distribution require careful via staggering and plane segmentation. Validate steady-state and transient voltage at the device balls rather than relying only on measurements at the power regulator.

Estimate worst-case FPGA power before choosing the board thermal solution. Estimated: use the configured core and I/O activity from the final design, multiply each rail's calculated power by its supply voltage, and sum the rail totals. Compare that total with the board's thermal resistance under the intended airflow and ambient temperature. The large FGGA footprint can provide useful heat-spreading area, but it also concentrates thermal challenges when several high-utilization regions operate simultaneously.

Do not treat a same-package suffix change as an automatic production replacement. The -4 and -5 identifiers select different performance grades, while C, I, and E identify different temperature classes. Before substituting XC3S5000-4FG900C, XC3S5000-4FG900I, XC3S5000-4FG900E, XC3S5000-5FG900I, or XC3S5000-5FG900E, rerun timing analysis, confirm the environmental requirement, verify power behavior, and regenerate the device configuration with the selected speed grade.

Thông tin tuân thủ

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Không chì
Unknown
Không halogen
Unknown
Khoáng vật xung đột
Unknown

No explicit RoHS, REACH, halogen-free, lead-free, conflict-minerals, or automotive qualification statement was identified. The AEC-Q100 field is marked not applicable because no automotive qualification is stated for this device.

Dữ liệu được xác minh vào: 2026-11-07 — dữ liệu được xác minh và quản lý bởi đội ngũ kỹ thuật phần cứng của XAIPART

Tìm kiếm liên quan

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Các bộ phận và thuật ngữ liên quan

Xilinx AMD Xilinx XC3S5000-5FG900C XC3S5000-4FG900C XC3S5000-4FG900I XC3S5000-4FG900E XC3S5000-5FG900I XC3S5000-5FG900E Spartan-3 field-programmable gate array FPGA programmable logic complex programmable logic device semiconductor 74,880 logic cells 5 million system gates 725 MHz maximum frequency 1.2 V core supply 90 nm process technology 900-pin FG900 FG900 FBGA ball grid array surface-mount package broadband access equipment industrial control network storage
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