5M160ZM100A5N - MAX V CPLD, 128 Macrocells, 100-FBGA | Intel
MPN: 5M160ZM100A5N ✓ Hoạt động5M160ZM100A5N Tóm tắt
A Complex Programmable Logic Device (CPLD) is a non-volatile programmable logic device that combines the deterministic timing of PAL/GAL architecture with on-chip flash configuration memory. In the broader programmable logic taxonomy, the MAX V family sits between small FPGAs (which offer higher logic density but require external configuration memory) and discrete logic gates (which offer no programmability). CPLDs are typically used for I/O expansion, bus bridging, power-up sequencing, and glue-logic tasks where instant-on behavior is required.
Key features of the 5M160ZM100A5N include 118.3 MHz internal fMAX, 14 ns pin-to-pin propagation delay (industrial grade), 25 µA typical standby current, and integrated flash configuration storage. The device also supports MultiVolt I/O, in-system programmability (ISP), and a built-in 8 Kbit user flash memory block. The A5N speed grade and industrial temperature rating (-40 °C to +85 °C) make it well suited for industrial control and automotive-adjacent applications.
Architecturally, the MAX V device uses a Logic Array Block (LAB) structure with 128 macrocells distributed across 4 Logic Array Blocks, each containing 16 macrocells. MultiCore architecture connects LABs through a programmable interconnect array (PIA), and the integrated flash memory holds both the configuration image and user-accessible flash sectors, eliminating the need for an external boot PROM.
Typical applications include I/O expansion and level translation in industrial PLCs, glue logic in telecom baseband boards, power-sequencing controllers for FPGA-based SoCs, and bus-bridging interfaces between legacy microcontrollers and modern processors. The instant-on capability is particularly attractive for safety-critical systems requiring deterministic configuration at power-up.
When designing with this device, ensure the JTAG chain respects the IEEE 1149.1 boundary-scan order and that VCCIO banks are properly decoupled with 0.1 µF and 10 µF capacitors placed close to the package balls. The internal flash programming voltage is generated on-chip; no external programming supply is required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho 5M160ZM100A5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với 5M160ZM100A5N (cùng hình factor và footprint) — khác nhau ở Package, Programming Interface, Operating Temperature, Mounting Type, Family.
5M160ZM100I5N
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Xem tài liệu →5M160ZM100A5N Tỷ lệ tối đa & tính chất điện
| Family | MAX V |
| Logic Elements / Macrocells | 128 macrocells |
| Maximum User I/Os | 79 |
| Operating Frequency (fMAX) | 118.3 MHz |
| Propagation Delay (tPD) | 14 ns (industrial, A5 speed grade) |
| Core Supply Voltage (VCCINT) | 1.8 V (internal) |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V |
| User Flash Memory | 8 Kbits |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) |
| Standby Current (ICCSTBY) | 25 µA typical |
| Nhiệt độ hoạt động | -40 °C to +85 °C (industrial) |
| Hộp | 100-ball Micro FBGA (M100) 6x6 mm, 0.5 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
| Lead-Free | Yes |
Cấu hình chân 5M160ZM100A5N
| Chân A1 | I/O — User I/O pin (bank 1) |
| Chân A2 | I/O — User I/O pin (bank 1) |
| Chân A3 | I/O — User I/O pin (bank 1) |
| Chân A4 | I/O — User I/O pin (bank 1) |
| Chân A5 | I/O — User I/O pin (bank 1) |
| Chân A6 | I/O — User I/O pin (bank 1) |
| Chân A7 | I/O — User I/O pin (bank 1) |
| Chân A8 | I/O — User I/O pin (bank 1) |
| Chân A9 | I/O — User I/O pin (bank 1) |
| Chân A10 | I/O — User I/O pin (bank 1) |
| Chân B1 | GND — Ground |
| Chân B2 | I/O — User I/O pin (bank 2) |
| Chân B3 | I/O — User I/O pin (bank 2) |
| Chân B4 | I/O — User I/O pin (bank 2) |
| Chân B5 | I/O — User I/O pin (bank 2) |
| Chân B6 | I/O — User I/O pin (bank 2) |
| Chân B7 | I/O — User I/O pin (bank 2) |
| Chân B8 | I/O — User I/O pin (bank 2) |
| Chân B9 | I/O — User I/O pin (bank 2) |
| Chân B10 | VCCIO1 — I/O supply voltage bank 1 |
| Chân C1 | I/O — User I/O pin (bank 3) |
| Chân C2 | I/O — User I/O pin (bank 3) |
| Chân C3 | I/O — User I/O pin (bank 3) |
| Chân C4 | I/O — User I/O pin (bank 3) |
| Chân C5 | GND — Ground |
| Chân C6 | I/O — User I/O pin (bank 3) |
| Chân C7 | I/O — User I/O pin (bank 3) |
| Chân C8 | I/O — User I/O pin (bank 3) |
| Chân C9 | I/O — User I/O pin (bank 3) |
| Chân C10 | VCCIO2 — I/O supply voltage bank 2 |
| Chân D1 | I/O — User I/O pin (bank 4) |
| Chân D2 | I/O — User I/O pin (bank 4) |
| Chân D3 | I/O — User I/O pin (bank 4) |
| Chân D4 | TDI — JTAG Test Data In |
| Chân D5 | TMS — JTAG Test Mode Select |
| Chân D6 | TCK — JTAG Test Clock |
| Chân D7 | TDO — JTAG Test Data Out |
| Chân D8 | I/O — User I/O pin (bank 4) |
| Chân D9 | I/O — User I/O pin (bank 4) |
| Chân D10 | VCCIO3 — I/O supply voltage bank 3 |
| Chân E1 | I/O — User I/O pin (bank 5) |
| Chân E2 | I/O — User I/O pin (bank 5) |
| Chân E3 | I/O — User I/O pin (bank 5) |
| Chân E4 | I/O — User I/O pin (bank 5) |
| Chân E5 | GND — Ground |
| Chân E6 | I/O — User I/O pin (bank 5) |
| Chân E7 | I/O — User I/O pin (bank 5) |
| Chân E8 | I/O — User I/O pin (bank 5) |
| Chân E9 | I/O — User I/O pin (bank 5) |
| Chân E10 | VCCIO4 — I/O supply voltage bank 4 |
| Chân F1 | I/O — User I/O pin (bank 6) |
| Chân F2 | I/O — User I/O pin (bank 6) |
| Chân F3 | I/O — User I/O pin (bank 6) |
| Chân F4 | I/O — User I/O pin (bank 6) |
| Chân F5 | VCCINT — Core supply voltage (1.8 V internal) |
| Chân F6 | I/O — User I/O pin (bank 6) |
| Chân F7 | I/O — User I/O pin (bank 6) |
| Chân F8 | I/O — User I/O pin (bank 6) |
| Chân F9 | I/O — User I/O pin (bank 6) |
| Chân F10 | VCCIO5 — I/O supply voltage bank 5 |
| Chân G1 | I/O — User I/O pin (bank 7) |
| Chân G2 | I/O — User I/O pin (bank 7) |
| Chân G3 | I/O — User I/O pin (bank 7) |
| Chân G4 | I/O — User I/O pin (bank 7) |
| Chân G5 | GND — Ground |
| Chân G6 | I/O — User I/O pin (bank 7) |
| Chân G7 | I/O — User I/O pin (bank 7) |
| Chân G8 | I/O — User I/O pin (bank 7) |
| Chân G9 | I/O — User I/O pin (bank 7) |
| Chân G10 | VCCIO6 — I/O supply voltage bank 6 |
| Chân H1 | I/O — User I/O pin (bank 8) |
| Chân H2 | I/O — User I/O pin (bank 8) |
| Chân H3 | I/O — User I/O pin (bank 8) |
| Chân H4 | I/O — User I/O pin (bank 8) |
| Chân H5 | nCONFIG — Configuration start input (active low) |
| Chân H6 | nSTATUS — Configuration status output (active low) |
| Chân H7 | CONF_DONE — Configuration done output |
| Chân H8 | I/O — User I/O pin (bank 8) |
| Chân H9 | I/O — User I/O pin (bank 8) |
| Chân H10 | VCCIO7 — I/O supply voltage bank 7 |
| Chân J1 | I/O — User I/O pin (bank 8) |
| Chân J2 | I/O — User I/O pin (bank 8) |
| Chân J3 | I/O — User I/O pin (bank 8) |
| Chân J4 | I/O — User I/O pin (bank 8) |
| Chân J5 | I/O — User I/O pin (bank 8) |
| Chân J6 | I/O — User I/O pin (bank 8) |
| Chân J7 | I/O — User I/O pin (bank 8) |
| Chân J8 | I/O — User I/O pin (bank 8) |
| Chân J9 | I/O — User I/O pin (bank 8) |
| Chân J10 | GND — Ground |
Ứng dụng tiêu biểu
5M160ZM100A5N phù hợp cho 6 Áp dụngs: Industrial PLC I/O Expansion and Level Translation, FPGA/SoC Power Sequencing Controller, Bus Bridging Between Legacy MCU and Modern Processor, Glue Logic for Telecom Baseband Boards, Automotive-Grade I/O Expansion (Non-Safety Domain), Test and Measurement Equipment Front-End Logic.
Industrial PLC I/O Expansion and Level Translation
The 5M160ZM100A5N is well matched to industrial PLC I/O expansion because its 79 user I/Os and MultiVolt bank architecture (1.2 V to 3.3 V) allow direct interfacing between 1.8 V microcontroller buses and 3.3 V or 5 V-tolerant field-side peripherals without external level shifters. The 128 macrocells comfortably accommodate 8-bit to 16-bit address decoding, interrupt steering, and timing-critical control registers typical of PLC backplane logic. The 25 µA typical standby current supports always-on industrial nodes where energy budget is tight. The instant-on non-volatile flash configuration ensures deterministic startup, a regulatory requirement in many safety-rated PLCs. Per the MAX V datasheet, the industrial -40 °C to +85 °C operating range covers the majority of factory-floor enclosures without derating. For companion parts, the 5M1270 series offers similar functionality in larger packages, while discrete logic gates can offload simple functions.
Được đề xuất
FPGA/SoC Power Sequencing Controller
The 5M160ZM100A5N serves as a dedicated power-sequencing controller for FPGA and SoC rails because its instant-on flash-based configuration provides deterministic enable-signal timing at power-up, eliminating the configuration latency of SRAM-based FPGAs. Per the MAX V datasheet, the device can generate multiple sequenced enable pulses with 14 ns tPD resolution, suiting multi-rail power trees for processors requiring specific startup order (e.g., core before I/O before analog). The 1.8 V core and 3.3 V-tolerant I/O banks interface directly to common DC-DC enable inputs and PG (power-good) signals from regulators like the LTM4675 or TPS54A20. The 25 µA standby current keeps quiescent draw negligible in battery-backed sequencing paths.
Được đề xuất
Bus Bridging Between Legacy MCU and Modern Processor
The 5M160ZM100A5N is ideal for bus bridging between legacy microcontrollers and modern SoCs because its 128 macrocells can implement 8-bit/16-bit to 32-bit width conversion, protocol translation, and wait-state insertion logic in a single non-volatile device. Per the MAX V datasheet, the 118.3 MHz fMAX comfortably handles UART-to-SPI bridges, parallel memory-mapped interfaces, and interrupt aggregation at typical MCU bus speeds. The MultiVolt I/O eliminates external level shifters when bridging between 1.8 V ARM cores and 3.3 V legacy 8051 peripherals, reducing BOM and PCB complexity. The industrial temperature rating suits embedded modules in outdoor telecom and industrial cabinets.
Được đề xuất
Glue Logic for Telecom Baseband Boards
The 5M160ZM100A5N integrates discrete glue logic on telecom baseband boards because its non-volatile flash configuration and 25 µA standby current reduce board-level power consumption and BOM cost compared to implementing the same logic with multiple 74-series gates. Per the MAX V datasheet, the 14 ns tPD supports timing-critical chip-select generation for DDR memory controllers, interrupt prioritization for baseband DSPs, and reset-distribution networks for multi-chip baseband subsystems. The 100-ball Micro FBGA package provides high pin density for compact baseband mezzanine cards where board area is at a premium. JTAG-based in-system programmability simplifies field firmware updates without removing the baseband module.
Được đề xuất
Automotive-Grade I/O Expansion (Non-Safety Domain)
The 5M160ZM100A5N serves in non-safety automotive I/O expansion roles such as body-control modules and infotainment sub-systems because its industrial -40 °C to +85 °C temperature range covers most cabin environments, and its non-volatile flash configuration eliminates boot-time latency during cold-crank events. Per the MAX V datasheet, the 79 user I/Os support LIN/CAN auxiliary bus decoding, LED matrix driving, and HVAC control-panel scanning. The MultiVolt I/O banks allow direct connection to 3.3 V body-control MCUs and 5 V analog sensor front-ends. The device is not AEC-Q100 qualified; for safety-domain applications choose the AEC-Q100-grade MAX V variants or alternative CPLD families explicitly qualified to that standard.
Được đề xuất
Test and Measurement Equipment Front-End Logic
The 5M160ZM100A5N provides deterministic front-end logic for test and measurement equipment because its 14 ns tPD and 118.3 MHz fMAX enable precise timing of multiplexers, range-switching networks, and trigger-conditioning circuits in oscilloscopes and data-acquisition front-ends. Per the MAX V datasheet, the 128 macrocells implement complex trigger state machines that would otherwise require discrete programmable timers. The instant-on configuration supports rapid instrument power-up without user-visible boot delay. The 100-ball Micro FBGA package footprint suits compact handheld instrument designs where PCB real estate is constrained and thermal management favors low-power non-volatile logic.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho 5M160ZM100A5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | 5M160ZM100I5N | 5M240ZM100I5N |
|---|---|---|---|
| Package | 100-ball Micro FBGA (M100) | 100-ball Micro FBGA (M100) - same | 100-ball Micro FBGA (M100) - same |
| Brand | Intel (formerly Altera) | Intel | Intel |
| Macrocells | 128 | 128 (same) | 240 (+88%) |
| Maximum User I/Os | 79 | 79 (same) | 79 (same) |
| Speed Grade | A5 (industrial) | I5 (faster, industrial) | I5 (faster, industrial) |
| User Flash Memory | 8 Kbits | 8 Kbits (same) | 8 Kbits (same) |
| Pin-to-Pin Drop-In | Yes (this MPN) | Yes (same M100 footprint) | Yes (same M100 footprint) |
Bảo phân biệt quan trọng
- Non-volatile flash configuration with instant-on behavior (vs5M160ZM100I5N)
- Direct drop-in upgrade path to 240 macrocells in same package (vs5M240ZM100I5N)
- MultiVolt I/O banks (1.2 V to 3.3 V) eliminate external level shifters (vs5CEBA2F17I7N (Cyclone V FPGA))
Ghi chú thiết kế
The 5M160ZM100A5N requires a stable 1.8 V VCCINT and one or more VCCIO bank supplies between 1.2 V and 3.3 V. Decouple each VCCIO bank with a 0.1 µF ceramic capacitor placed within 3 mm of the package ball, plus a bulk 10 µF tantalum or ceramic capacitor near the supply entry point. Per the MAX V datasheet, VCCINT is internally regulated from the VCC supply on most variants, but the 1.8 V rail must still be decoupled to suppress switching noise. Avoid routing high-speed signals across the VCCINT balls to prevent supply-noise coupling into logic macros.
The 100-ball Micro FBGA (M100) package uses a 0.5 mm ball pitch requiring microvia or fine-pitch PCB technology (4-layer minimum recommended). Use a via-in-pad or dog-bone fanout pattern with 0.2 mm / 0.4 mm capture pad dimensions per the MAX V hardware design guidelines. Per the MAX V datasheet, keep all signal traces at least 0.2 mm away from the edge of the BGA land pads to avoid solder bridging. The exposed die-attach paddle on the package underside must be soldered to the PCB ground plane for thermal dissipation and electrical return.
Do not leave the JTAG TDI, TMS, TCK, or TDO balls floating during normal operation; tie TMS and TDI high through 10 kΩ pull-ups to VCCIO of the configuration bank, per the MAX V datasheet. Floating JTAG inputs can cause spurious configuration attempts. The nCONFIG input is active-low and must return high after a valid reset pulse width; ensure the reset RC time constant is at least 1 µs. Do not apply power to VCCIO before VCCINT - the I/O drivers may back-power the core through ESD protection diodes. Sequence supplies such that VCCINT (or its internal regulator input) rises before VCCIO.
For 118.3 MHz fMAX designs, controlled-impedance routing (50 Ω single-ended) is required on all clock and high-speed I/O traces longer than approximately 10 mm. Per the MAX V datasheet, the I/O driver slew-rate and strength settings should be adjusted in the Quartus II / Quartus Prime pin planner to optimize signal integrity for each bank; default settings are conservative. Use series termination resistors on clock outputs driving multiple loads. Ground bounce can be minimized by distributing VCCIO and GND balls evenly across switching I/O banks.
Thông tin tuân thủ
RoHS compliant and lead-free per Intel product page. Not AEC-Q100 qualified - industrial temperature grade (-40 °C to +85 °C) only. Choose AEC-Q100-qualified MAX V or alternative CPLD families for safety-domain automotive applications.
