5M160ZM100A5N - MAX V CPLD, 128 Macrocells, 100-FBGA | Intel
부품 번호: 5M160ZM100A5N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.8 | $7.80 |
| 10 | $7.02 | $70.20 |
| 100 | $6.24 | $624.00 |
| 500 | $5.61 | $2,805.00 |
| 1,000 | $5 | $5,000.00 |
5M160ZM100A5N 개요
A Complex Programmable Logic Device (CPLD) is a non-volatile programmable logic device that combines the deterministic timing of PAL/GAL architecture with on-chip flash configuration memory. In the broader programmable logic taxonomy, the MAX V family sits between small FPGAs (which offer higher logic density but require external configuration memory) and discrete logic gates (which offer no programmability). CPLDs are typically used for I/O expansion, bus bridging, power-up sequencing, and glue-logic tasks where instant-on behavior is required.
Key features of the 5M160ZM100A5N include 118.3 MHz internal fMAX, 14 ns pin-to-pin propagation delay (industrial grade), 25 µA typical standby current, and integrated flash configuration storage. The device also supports MultiVolt I/O, in-system programmability (ISP), and a built-in 8 Kbit user flash memory block. The A5N speed grade and industrial temperature rating (-40 °C to +85 °C) make it well suited for industrial control and automotive-adjacent applications.
Architecturally, the MAX V device uses a Logic Array Block (LAB) structure with 128 macrocells distributed across 4 Logic Array Blocks, each containing 16 macrocells. MultiCore architecture connects LABs through a programmable interconnect array (PIA), and the integrated flash memory holds both the configuration image and user-accessible flash sectors, eliminating the need for an external boot PROM.
Typical applications include I/O expansion and level translation in industrial PLCs, glue logic in telecom baseband boards, power-sequencing controllers for FPGA-based SoCs, and bus-bridging interfaces between legacy microcontrollers and modern processors. The instant-on capability is particularly attractive for safety-critical systems requiring deterministic configuration at power-up.
When designing with this device, ensure the JTAG chain respects the IEEE 1149.1 boundary-scan order and that VCCIO banks are properly decoupled with 0.1 µF and 10 µF capacitors placed close to the package balls. The internal flash programming voltage is generated on-chip; no external programming supply is required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: 5M160ZM100A5N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5M160ZM100A5N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Programming Interface, Operating Temperature, Mounting Type, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5M160ZM100I5N
✅ 드롭인✓ 재고 있음
$7.1 / 개
데이터시트 보기 →5M240ZM100I5N
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →5M160ZM100A5N 최대 정격 & 전기적 특성
| Family | MAX V |
| Logic Elements / Macrocells | 128 macrocells |
| Maximum User I/Os | 79 |
| Operating Frequency (fMAX) | 118.3 MHz |
| Propagation Delay (tPD) | 14 ns (industrial, A5 speed grade) |
| Core Supply Voltage (VCCINT) | 1.8 V (internal) |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V |
| User Flash Memory | 8 Kbits |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) |
| Standby Current (ICCSTBY) | 25 µA typical |
| 동작 온도 | -40 °C to +85 °C (industrial) |
| 패키지 | 100-ball Micro FBGA (M100) 6x6 mm, 0.5 mm pitch |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
5M160ZM100A5N 핀 구성
| 핀 A1 | I/O — User I/O pin (bank 1) |
| 핀 A2 | I/O — User I/O pin (bank 1) |
| 핀 A3 | I/O — User I/O pin (bank 1) |
| 핀 A4 | I/O — User I/O pin (bank 1) |
| 핀 A5 | I/O — User I/O pin (bank 1) |
| 핀 A6 | I/O — User I/O pin (bank 1) |
| 핀 A7 | I/O — User I/O pin (bank 1) |
| 핀 A8 | I/O — User I/O pin (bank 1) |
| 핀 A9 | I/O — User I/O pin (bank 1) |
| 핀 A10 | I/O — User I/O pin (bank 1) |
| 핀 B1 | GND — Ground |
| 핀 B2 | I/O — User I/O pin (bank 2) |
| 핀 B3 | I/O — User I/O pin (bank 2) |
| 핀 B4 | I/O — User I/O pin (bank 2) |
| 핀 B5 | I/O — User I/O pin (bank 2) |
| 핀 B6 | I/O — User I/O pin (bank 2) |
| 핀 B7 | I/O — User I/O pin (bank 2) |
| 핀 B8 | I/O — User I/O pin (bank 2) |
| 핀 B9 | I/O — User I/O pin (bank 2) |
| 핀 B10 | VCCIO1 — I/O supply voltage bank 1 |
| 핀 C1 | I/O — User I/O pin (bank 3) |
| 핀 C2 | I/O — User I/O pin (bank 3) |
| 핀 C3 | I/O — User I/O pin (bank 3) |
| 핀 C4 | I/O — User I/O pin (bank 3) |
| 핀 C5 | GND — Ground |
| 핀 C6 | I/O — User I/O pin (bank 3) |
| 핀 C7 | I/O — User I/O pin (bank 3) |
| 핀 C8 | I/O — User I/O pin (bank 3) |
| 핀 C9 | I/O — User I/O pin (bank 3) |
| 핀 C10 | VCCIO2 — I/O supply voltage bank 2 |
| 핀 D1 | I/O — User I/O pin (bank 4) |
| 핀 D2 | I/O — User I/O pin (bank 4) |
| 핀 D3 | I/O — User I/O pin (bank 4) |
| 핀 D4 | TDI — JTAG Test Data In |
| 핀 D5 | TMS — JTAG Test Mode Select |
| 핀 D6 | TCK — JTAG Test Clock |
| 핀 D7 | TDO — JTAG Test Data Out |
| 핀 D8 | I/O — User I/O pin (bank 4) |
| 핀 D9 | I/O — User I/O pin (bank 4) |
| 핀 D10 | VCCIO3 — I/O supply voltage bank 3 |
| 핀 E1 | I/O — User I/O pin (bank 5) |
| 핀 E2 | I/O — User I/O pin (bank 5) |
| 핀 E3 | I/O — User I/O pin (bank 5) |
| 핀 E4 | I/O — User I/O pin (bank 5) |
| 핀 E5 | GND — Ground |
| 핀 E6 | I/O — User I/O pin (bank 5) |
| 핀 E7 | I/O — User I/O pin (bank 5) |
| 핀 E8 | I/O — User I/O pin (bank 5) |
| 핀 E9 | I/O — User I/O pin (bank 5) |
| 핀 E10 | VCCIO4 — I/O supply voltage bank 4 |
| 핀 F1 | I/O — User I/O pin (bank 6) |
| 핀 F2 | I/O — User I/O pin (bank 6) |
| 핀 F3 | I/O — User I/O pin (bank 6) |
| 핀 F4 | I/O — User I/O pin (bank 6) |
| 핀 F5 | VCCINT — Core supply voltage (1.8 V internal) |
| 핀 F6 | I/O — User I/O pin (bank 6) |
| 핀 F7 | I/O — User I/O pin (bank 6) |
| 핀 F8 | I/O — User I/O pin (bank 6) |
| 핀 F9 | I/O — User I/O pin (bank 6) |
| 핀 F10 | VCCIO5 — I/O supply voltage bank 5 |
| 핀 G1 | I/O — User I/O pin (bank 7) |
| 핀 G2 | I/O — User I/O pin (bank 7) |
| 핀 G3 | I/O — User I/O pin (bank 7) |
| 핀 G4 | I/O — User I/O pin (bank 7) |
| 핀 G5 | GND — Ground |
| 핀 G6 | I/O — User I/O pin (bank 7) |
| 핀 G7 | I/O — User I/O pin (bank 7) |
| 핀 G8 | I/O — User I/O pin (bank 7) |
| 핀 G9 | I/O — User I/O pin (bank 7) |
| 핀 G10 | VCCIO6 — I/O supply voltage bank 6 |
| 핀 H1 | I/O — User I/O pin (bank 8) |
| 핀 H2 | I/O — User I/O pin (bank 8) |
| 핀 H3 | I/O — User I/O pin (bank 8) |
| 핀 H4 | I/O — User I/O pin (bank 8) |
| 핀 H5 | nCONFIG — Configuration start input (active low) |
| 핀 H6 | nSTATUS — Configuration status output (active low) |
| 핀 H7 | CONF_DONE — Configuration done output |
| 핀 H8 | I/O — User I/O pin (bank 8) |
| 핀 H9 | I/O — User I/O pin (bank 8) |
| 핀 H10 | VCCIO7 — I/O supply voltage bank 7 |
| 핀 J1 | I/O — User I/O pin (bank 8) |
| 핀 J2 | I/O — User I/O pin (bank 8) |
| 핀 J3 | I/O — User I/O pin (bank 8) |
| 핀 J4 | I/O — User I/O pin (bank 8) |
| 핀 J5 | I/O — User I/O pin (bank 8) |
| 핀 J6 | I/O — User I/O pin (bank 8) |
| 핀 J7 | I/O — User I/O pin (bank 8) |
| 핀 J8 | I/O — User I/O pin (bank 8) |
| 핀 J9 | I/O — User I/O pin (bank 8) |
| 핀 J10 | GND — Ground |
일반적인 애플리케이션
5M160ZM100A5N 적합 용도: 6 애플리케이션s: Industrial PLC I/O Expansion and Level Translation, FPGA/SoC Power Sequencing Controller, Bus Bridging Between Legacy MCU and Modern Processor, Glue Logic for Telecom Baseband Boards, Automotive-Grade I/O Expansion (Non-Safety Domain), Test and Measurement Equipment Front-End Logic.
Industrial PLC I/O Expansion and Level Translation
The 5M160ZM100A5N is well matched to industrial PLC I/O expansion because its 79 user I/Os and MultiVolt bank architecture (1.2 V to 3.3 V) allow direct interfacing between 1.8 V microcontroller buses and 3.3 V or 5 V-tolerant field-side peripherals without external level shifters. The 128 macrocells comfortably accommodate 8-bit to 16-bit address decoding, interrupt steering, and timing-critical control registers typical of PLC backplane logic. The 25 µA typical standby current supports always-on industrial nodes where energy budget is tight. The instant-on non-volatile flash configuration ensures deterministic startup, a regulatory requirement in many safety-rated PLCs. Per the MAX V datasheet, the industrial -40 °C to +85 °C operating range covers the majority of factory-floor enclosures without derating. For companion parts, the 5M1270 series offers similar functionality in larger packages, while discrete logic gates can offload simple functions.
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FPGA/SoC Power Sequencing Controller
The 5M160ZM100A5N serves as a dedicated power-sequencing controller for FPGA and SoC rails because its instant-on flash-based configuration provides deterministic enable-signal timing at power-up, eliminating the configuration latency of SRAM-based FPGAs. Per the MAX V datasheet, the device can generate multiple sequenced enable pulses with 14 ns tPD resolution, suiting multi-rail power trees for processors requiring specific startup order (e.g., core before I/O before analog). The 1.8 V core and 3.3 V-tolerant I/O banks interface directly to common DC-DC enable inputs and PG (power-good) signals from regulators like the LTM4675 or TPS54A20. The 25 µA standby current keeps quiescent draw negligible in battery-backed sequencing paths.
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Bus Bridging Between Legacy MCU and Modern Processor
The 5M160ZM100A5N is ideal for bus bridging between legacy microcontrollers and modern SoCs because its 128 macrocells can implement 8-bit/16-bit to 32-bit width conversion, protocol translation, and wait-state insertion logic in a single non-volatile device. Per the MAX V datasheet, the 118.3 MHz fMAX comfortably handles UART-to-SPI bridges, parallel memory-mapped interfaces, and interrupt aggregation at typical MCU bus speeds. The MultiVolt I/O eliminates external level shifters when bridging between 1.8 V ARM cores and 3.3 V legacy 8051 peripherals, reducing BOM and PCB complexity. The industrial temperature rating suits embedded modules in outdoor telecom and industrial cabinets.
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Glue Logic for Telecom Baseband Boards
The 5M160ZM100A5N integrates discrete glue logic on telecom baseband boards because its non-volatile flash configuration and 25 µA standby current reduce board-level power consumption and BOM cost compared to implementing the same logic with multiple 74-series gates. Per the MAX V datasheet, the 14 ns tPD supports timing-critical chip-select generation for DDR memory controllers, interrupt prioritization for baseband DSPs, and reset-distribution networks for multi-chip baseband subsystems. The 100-ball Micro FBGA package provides high pin density for compact baseband mezzanine cards where board area is at a premium. JTAG-based in-system programmability simplifies field firmware updates without removing the baseband module.
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Automotive-Grade I/O Expansion (Non-Safety Domain)
The 5M160ZM100A5N serves in non-safety automotive I/O expansion roles such as body-control modules and infotainment sub-systems because its industrial -40 °C to +85 °C temperature range covers most cabin environments, and its non-volatile flash configuration eliminates boot-time latency during cold-crank events. Per the MAX V datasheet, the 79 user I/Os support LIN/CAN auxiliary bus decoding, LED matrix driving, and HVAC control-panel scanning. The MultiVolt I/O banks allow direct connection to 3.3 V body-control MCUs and 5 V analog sensor front-ends. The device is not AEC-Q100 qualified; for safety-domain applications choose the AEC-Q100-grade MAX V variants or alternative CPLD families explicitly qualified to that standard.
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Test and Measurement Equipment Front-End Logic
The 5M160ZM100A5N provides deterministic front-end logic for test and measurement equipment because its 14 ns tPD and 118.3 MHz fMAX enable precise timing of multiplexers, range-switching networks, and trigger-conditioning circuits in oscilloscopes and data-acquisition front-ends. Per the MAX V datasheet, the 128 macrocells implement complex trigger state machines that would otherwise require discrete programmable timers. The instant-on configuration supports rapid instrument power-up without user-visible boot delay. The 100-ball Micro FBGA package footprint suits compact handheld instrument designs where PCB real estate is constrained and thermal management favors low-power non-volatile logic.
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추천 제품 요약
엔지니어링 참조 데이터: 5M160ZM100A5N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5M160ZM100I5N | 5M240ZM100I5N |
|---|---|---|---|
| Package | 100-ball Micro FBGA (M100) | 100-ball Micro FBGA (M100) - same | 100-ball Micro FBGA (M100) - same |
| Brand | Intel (formerly Altera) | Intel | Intel |
| Macrocells | 128 | 128 (same) | 240 (+88%) |
| Maximum User I/Os | 79 | 79 (same) | 79 (same) |
| Speed Grade | A5 (industrial) | I5 (faster, industrial) | I5 (faster, industrial) |
| User Flash Memory | 8 Kbits | 8 Kbits (same) | 8 Kbits (same) |
| Pin-to-Pin Drop-In | Yes (this MPN) | Yes (same M100 footprint) | Yes (same M100 footprint) |
주요 차별점
- Non-volatile flash configuration with instant-on behavior (vs 5M160ZM100I5N)
- Direct drop-in upgrade path to 240 macrocells in same package (vs 5M240ZM100I5N)
- MultiVolt I/O banks (1.2 V to 3.3 V) eliminate external level shifters (vs 5CEBA2F17I7N (Cyclone V FPGA))
설계 노트
The 5M160ZM100A5N requires a stable 1.8 V VCCINT and one or more VCCIO bank supplies between 1.2 V and 3.3 V. Decouple each VCCIO bank with a 0.1 µF ceramic capacitor placed within 3 mm of the package ball, plus a bulk 10 µF tantalum or ceramic capacitor near the supply entry point. Per the MAX V datasheet, VCCINT is internally regulated from the VCC supply on most variants, but the 1.8 V rail must still be decoupled to suppress switching noise. Avoid routing high-speed signals across the VCCINT balls to prevent supply-noise coupling into logic macros.
The 100-ball Micro FBGA (M100) package uses a 0.5 mm ball pitch requiring microvia or fine-pitch PCB technology (4-layer minimum recommended). Use a via-in-pad or dog-bone fanout pattern with 0.2 mm / 0.4 mm capture pad dimensions per the MAX V hardware design guidelines. Per the MAX V datasheet, keep all signal traces at least 0.2 mm away from the edge of the BGA land pads to avoid solder bridging. The exposed die-attach paddle on the package underside must be soldered to the PCB ground plane for thermal dissipation and electrical return.
Do not leave the JTAG TDI, TMS, TCK, or TDO balls floating during normal operation; tie TMS and TDI high through 10 kΩ pull-ups to VCCIO of the configuration bank, per the MAX V datasheet. Floating JTAG inputs can cause spurious configuration attempts. The nCONFIG input is active-low and must return high after a valid reset pulse width; ensure the reset RC time constant is at least 1 µs. Do not apply power to VCCIO before VCCINT - the I/O drivers may back-power the core through ESD protection diodes. Sequence supplies such that VCCINT (or its internal regulator input) rises before VCCIO.
For 118.3 MHz fMAX designs, controlled-impedance routing (50 Ω single-ended) is required on all clock and high-speed I/O traces longer than approximately 10 mm. Per the MAX V datasheet, the I/O driver slew-rate and strength settings should be adjusted in the Quartus II / Quartus Prime pin planner to optimize signal integrity for each bank; default settings are conservative. Use series termination resistors on clock outputs driving multiple loads. Ground bounce can be minimized by distributing VCCIO and GND balls evenly across switching I/O banks.
규정 준수 정보
RoHS compliant and lead-free per Intel product page. Not AEC-Q100 qualified - industrial temperature grade (-40 °C to +85 °C) only. Choose AEC-Q100-qualified MAX V or alternative CPLD families for safety-domain automotive applications.
