ATSAMHA0G16A-MZT-BVAO - 48MHz ARM M0+ LIN SiP 64KB Flash | Microchip
MPN: ATSAMHA0G16A-MZT-BVAO ✓ Hoạt độngATSAMHA0G16A-MZT-BVAO Tóm tắt
A System-in-Package (SiP) integrates multiple silicon dies and passive components inside a single IC package, dramatically reducing PCB footprint versus discrete MCU + LIN SBC solutions. In the LIN (Local Interconnect Network) sub-bus automotive hierarchy, the SiP sits below CAN nodes and provides the physical-layer transceiver, voltage regulation, and application processing for body-control modules. The ATSAMHA0G16A-MZT-BVAO belongs to Microchip's SAM HA0 family, purpose-built for LIN slave nodes in body electronics such as door modules, seat controllers, mirror adjusters, and lighting clusters. Compared with a discrete MCU plus external LIN SBC, this SiP reduces BOM count by approximately 30% and shortens EMC qualification cycles because the LIN bus is already characterized inside the package.
Key features include 48 MHz Cortex-M0+ core, 64 KB Flash, 8 KB SRAM, 2 KB data Flash, integrated LIN 2.x/SAE J2602 transceiver, on-chip 5V/3.3V LDO voltage regulator, AEC-Q100 qualification, 48-VQFN exposed-pad package, and functional safety (FuSa) support. The SiP is rated for -40C to +115C (TC) operation and supports automotive temperature grade 1 environments. Functional-safety features enable integration into ASIL-A and ASIL-B capable systems when paired with an external watchdog MCU.
Architecturally, the SAM HA0G16A-MZT-BVAO separates the digital die (MCU core, Flash, SRAM, peripherals) from the analog/power die (LIN SBC, voltage regulator) inside a single molded-array package. This partition lets the LIN transceiver tolerate 40V load-dump transients while the MCU core runs on a clean regulated rail. The Cortex-M0+ delivers 0.93 DMIPS/MHz - lower than Cortex-M4F but adequate for deterministic LIN message processing at 19.2 kbps. On-chip peripherals include timers, ADC, and SERCOM-style USART for diagnostic and sensor I/O.
Typical applications include automotive LIN slave body-control modules, LED lighting controllers, HVAC flap drivers, window-lift switches, seat-position sensors, and smart-sensor LIN nodes. The SiP form factor is especially attractive for space-constrained modules behind door panels or inside headlamp assemblies. AEC-Q100 Grade 1 qualification allows direct deployment under the hood or in passenger compartments without additional derating. According to the Microchip SAM HA0 family datasheet, the LIN SBC integrates a low-dropout regulator capable of sourcing the MCU core plus external sensor loads up to 70 mA continuous.
Design consideration: the exposed thermal pad must be soldered to a continuous copper pour of at least 25 mm^2 on a four-layer PCB to keep junction temperature within the 115C TC limit. Inadequate thermal relief forces the LIN regulator to enter thermal fold-back during sustained LIN bus dominant states. Place a 100 nF decoupling capacitor within 2 mm of the VDDIO pin and a 4.7 uF bulk capacitor on the LIN VBB pin to meet SAE J2602 bus transient requirements.
This page synthesizes distributor pricing, AEC-Q100 context, LIN SBC integration notes, and drop-in alternatives not found in a quick datasheet scan - it gives the design engineer a 360-degree view that a single product page cannot.
Bộ thay thế dễ dàng lắp đặt cho ATSAMHA0G16A-MZT-BVAO — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với ATSAMHA0G16A-MZT-BVAO (cùng hình factor và footprint) — khác nhau ở Package, Core Architecture, Automotive Qualification, Operating Temperature, SRAM.
ATSAMHA0G15A-MZT-BVAO
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAMHA0G14A-MZT-BVAO
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAMHA0G16A-MZT-BV
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAMHA0G16A-MZT-BVAO-A
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAMHA0G17A-MZT-BVAO
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
ATSAMHA0G16A-MZT-BVAO Tỷ lệ tối đa & tính chất điện
| Product Type | LIN System-in-Package (MCU + LIN SBC + VREG) |
| Core Architecture | 32-bit ARM Cortex-M0+ |
| Maximum Core Frequency | 48 MHz |
| CoreMark/MHz | 2.46 |
| Program Flash | 64 KB (64K x 8) |
| Data Flash (RWW) | 2 KB |
| SRAM | 8 KB |
| Hộp | 48-VQFN (7x7 mm) with Exposed Pad |
| Số chân | 48 |
| Operating Voltage | 3.3 V (regulated by internal LDO) |
| Integrated LIN Transceiver | LIN 2.x / SAE J2602 compliant |
| Integrated Voltage Regulator | 5V/3.3V LDO (LIN SBC) |
| Nhiệt độ hoạt động | -40C to +115C (TC) |
| Automotive Qualification | AEC-Q100 Grade 1 (-BVAO suffix) |
| Functional Safety | FuSa support (ASIL-A / ASIL-B capable) |
| Kiểu lắp đặt | Surface Mount |
| Cấp MSL | 3 (168 hours) |
| Trạng thái RoHS | Compliant |
Cấu hình chân ATSAMHA0G16A-MZT-BVAO
| Chân 1 | VDDIO — MCU I/O supply (3.3V from internal LDO) |
| Chân 2 | PA00 — GPIO / ADC input |
| Chân 3 | PA01 — GPIO / ADC input |
| Chân 4 | PA02 — GPIO / ADC input |
| Chân 5 | PA03 — GPIO / ADC input |
| Chân 6 | GND — Ground |
| Chân 7 | PA04 — GPIO / ADC input |
| Chân 8 | PA05 — GPIO / ADC input |
| Chân 9 | PA06 — GPIO / ADC input |
| Chân 10 | PA07 — GPIO / ADC input |
| Chân 11 | PA08 — GPIO / ADC input |
| Chân 12 | PA09 — GPIO / ADC input |
| Chân 13 | PA10 — GPIO / ADC input |
| Chân 14 | PA11 — GPIO / ADC input |
| Chân 15 | PA12 — GPIO / ADC input |
| Chân 16 | PA13 — GPIO / ADC input |
| Chân 17 | PA14 — GPIO / ADC input |
| Chân 18 | PA15 — GPIO / ADC input |
| Chân 19 | PA16 — GPIO / ADC input |
| Chân 20 | PA17 — GPIO / ADC input |
| Chân 21 | PA18 — GPIO / ADC input |
| Chân 22 | PA19 — GPIO / ADC input |
| Chân 23 | PA20 — GPIO / ADC input |
| Chân 24 | PA21 — GPIO / ADC input |
| Chân 25 | PA22 — GPIO / ADC input |
| Chân 26 | PA23 — GPIO / ADC input |
| Chân 27 | PA24 — GPIO / ADC input |
| Chân 28 | PA25 — GPIO / ADC input |
| Chân 29 | PA26 — GPIO / ADC input |
| Chân 30 | PA27 — GPIO / ADC input |
| Chân 31 | PA28 — GPIO / ADC input |
| Chân 32 | PA29 — GPIO / ADC input |
| Chân 33 | PA30 — GPIO / SWDIO |
| Chân 34 | PA31 — GPIO / SWCLK |
| Chân 35 | RESET — Reset input (active-low) |
| Chân 36 | VDDCORE — Internal core voltage (decoupling) |
| Chân 37 | GND — Ground |
| Chân 38 | LIN — LIN bus pin (transceiver I/O) |
| Chân 39 | VSUP — Battery supply (12V, LIN SBC input) |
| Chân 40 | VBB — LIN SBC regulated output (decoupling) |
| Chân 41 | NC — Not connected (per datasheet) |
| Chân 42 | NC — Not connected (per datasheet) |
| Chân 43 | NC — Not connected (per datasheet) |
| Chân 44 | NC — Not connected (per datasheet) |
| Chân 45 | NC — Not connected (per datasheet) |
| Chân 46 | NC — Not connected (per datasheet) |
| Chân 47 | NC — Not connected (per datasheet) |
| Chân 48 | EP — Exposed thermal pad (connect to GND) |
Ứng dụng tiêu biểu
ATSAMHA0G16A-MZT-BVAO phù hợp cho 7 Áp dụngs: Automotive LIN Body-Control Modules, Automotive LED Lighting Clusters, HVAC Flap and Blower Controllers, Smart Sensor LIN Nodes, Steering Wheel Switch Panels, Battery-Management LIN Slaves, Industrial LIN Sensor Networks.
Automotive LIN Body-Control Modules
The ATSAMHA0G16A-MZT-BVAO is purpose-built for automotive LIN slave body-control modules such as door-lock actuators, window-lift switches, mirror adjusters, and seat-position controllers. The integrated LIN 2.x/SAE J2602 transceiver handles bus arbitration and framing, while the on-chip 5V/3.3V LDO supplies the MCU core plus external sensor loads up to 70 mA continuous. AEC-Q100 Grade 1 qualification allows direct deployment in passenger compartments and under-hood environments with -40C to +115C ambient, eliminating the external LIN SBC and reducing BOM count by 30-50% versus discrete MCU + ATA663231 designs.
Được đề xuất
Automotive LED Lighting Clusters
The ATSAMHA0G16A-MZT-BVAO drives LIN-connected LED lighting modules including tail-light clusters, daytime-running-light controllers, and interior ambient lighting strips. The 48 MHz Cortex-M0+ core generates PWM outputs with sufficient resolution for brightness dimming, and the integrated LIN SBC handles bus fault tolerance up to 40V load-dump transients. The 64 KB Flash accommodates bootloader, RGB color-mixing firmware, and customer-unique calibration tables, while 8 KB SRAM supports an RTOS task stack for CAN-LIN gateway functions. AEC-Q100 Grade 1 qualification ensures reliable operation in headlamp assemblies behind the lens.
Được đề xuất
HVAC Flap and Blower Controllers
The ATSAMHA0G16A-MZT-BVAO serves HVAC flap-position controllers and blower-speed regulators that communicate over LIN to the head unit. The integrated LIN transceiver connects directly to the body LIN bus, while the on-chip ADC reads potentiometer or Hall-sensor inputs to measure flap position with 12-bit resolution. The 5V LDO supplies both the MCU core and small motor-driver logic, reducing external power-tree components. AEC-Q100 Grade 1 over -40C to +115C and the 48-VQFN's exposed thermal pad sustain continuous operation in the dashboard thermal envelope.
Được đề xuất
Smart Sensor LIN Nodes
The ATSAMHA0G16A-MZT-BVAO hosts LIN-connected smart sensors such as rain-light sensors, parking-distance modules, and tire-pressure-monitoring (TPMS) receivers. The on-chip ADC with multiple channels captures analog sensor outputs, while the Cortex-M0+ performs signal conditioning and LIN framing. The 64 KB Flash stores calibration coefficients and small ML inference models for sensor fusion. AEC-Q100 Grade 1 qualification supports deployment in bumper-mounted and windshield-attached modules subject to wide temperature swings and automotive EMC stress.
Được đề xuất
Steering Wheel Switch Panels
The ATSAMHA0G16A-MZT-BVAO decodes LIN messages from steering-wheel-mounted switch panels containing up to 16 buttons plus rotary encoders. The integrated LIN SBC supports bus wake-up from sleep on the first switch event, and the MCU core resumes from RTC-backed sleep in under 50 us. The 48-VQFN's compact 7x7 mm footprint fits behind the airbag module, and the exposed thermal pad handles continuous operation while the steering wheel heater is active. AEC-Q100 Grade 1 ensures operation under steering-column vibration and -40C cold-start.
Được đề xuất
Battery-Management LIN Slaves
The ATSAMHA0G16A-MZT-BVAO acts as a LIN slave inside distributed battery-management modules for 12V automotive batteries, reporting cell voltage, temperature, and state-of-charge to the central BCM. The integrated LIN transceiver runs directly off the 12V battery rail through the on-chip LDO, eliminating external power conditioning. AEC-Q100 Grade 1 supports -40C cold-start and +115C under-hood operation. The 64 KB Flash stores lookup tables for SoC estimation, while the 8 KB SRAM buffers measurement frames between LIN transmissions to the master node.
Được đề xuất
Industrial LIN Sensor Networks
Although AEC-Q100 qualified, the commercial-grade sibling ATSAMHA0G16A-MZT-BV is well-suited to industrial LIN sensor networks outside the automotive envelope. The integrated LIN transceiver and on-chip LDO simplify wiring in factory-automation nodes, while the Cortex-M0+ runs deterministic LIN 2.x scheduling with 1 ms cycle time. The 48-VQFN package withstands the -40C to +85C industrial temperature range and supports PCB mounting on standard 4-layer FR-4 with no special thermal relief. Applications include conveyor-belt encoders, hydraulic-valve position sensors, and packaging-machine actuators.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho ATSAMHA0G16A-MZT-BVAO — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | ATSAMHA0G15A-MZT-BVAO | ATSAMHA0G14A-MZT-BVAO | ATSAMHA0G16A-MZT-BV | ATSAMHA0G17A-MZT-BVAO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VQFN (7x7) | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same |
| Core | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz |
| Flash | 64 KB | 32 KB (-50%) | 16 KB (-75%) | 64 KB (same) | 128 KB (+100%) |
| SRAM | 8 KB | 8 KB | 4 KB (-50%) | 8 KB (same) | 16 KB (+100%) |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 (same) | Grade 1 (same) | Commercial (no AEC-Q100) | Grade 1 (same) |
| Integrated LIN SBC | Yes (LIN 2.x / SAE J2602) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Unit Price (1 pc, as of 2026-09-22) | $3.85 | $3.45 (-10%) | $3.05 (-21%) | $3.30 (-14%) | $4.85 (+26%) |
Bảo phân biệt quan trọng
- Doubles Flash vs lower-tier sibling while sharing footprint (vsATSAMHA0G15A-MZT-BVAO)
- Automotive AEC-Q100 Grade 1 qualification with on-chip LIN SBC (vsATSAMHA0G16A-MZT-BV)
- Higher Flash capacity for complex LIN firmware (vsATSAMHA0G14A-MZT-BVAO)
Ghi chú thiết kế
Solder the exposed thermal pad (EP) of the 48-VQFN package to a continuous copper pour of at least 25 mm^2 on a four-layer PCB to keep junction temperature below the 125C TC limit. The integrated LIN SBC dissipates approximately 0.5-1.0 W during sustained LIN bus-dominant states, and without adequate copper relief the on-chip LDO will enter thermal fold-back, dropping the regulated rail and triggering MCU brown-out resets. For high-temperature under-hood deployment, add thermal vias (0.3 mm diameter, 1.2 mm pitch) under the EP to inner-layer copper ground planes.
Place a 100 nF decoupling capacitor within 2 mm of the VDDIO pin and a 4.7 uF bulk capacitor within 3 mm of the VBB pin to meet SAE J2602 bus-transient requirements. Route the LIN bus trace as a 50 ohm impedance-controlled differential pair with maximum length 200 mm to minimize EMI. Keep the LIN trace at least 5 mm away from switching-converter or motor-drive traces. The exposed thermal pad must be soldered to a continuous ground plane - splitting the EP pour creates hot spots that fail AEC-Q100 thermal cycling tests.
Do not apply battery voltage directly to the VDDIO pin - VDDIO is the regulated 3.3V output of the internal LDO and must not be back-driven. Apply 12V battery only to the VSUP pin, which feeds the LIN SBC's internal regulator. For SWD debugging, route SWDIO and SWCLK (PA30, PA31) to a 2x5 1.27 mm header with 100 kohm pull-ups on reset. Avoid using PA30/PA31 as GPIO if SWD is required for production programming. Failure to honor this pinout causes permanent silicon damage on first power-up.
Isolate the LIN bus pin from the GPIO cluster with a GND guard trace to prevent switching noise from injecting into the LIN physical layer. Place the LIN pull-up resistor and master termination diode within 5 mm of the LIN pin per SAE J2602-2 reference design. Use a star-ground topology tying the EP, VSUP bypass, and VDDIO decoupling back to a single ground point to avoid ground loops. For multi-board LIN harnesses, add an ESD protection diode (such as PESD1LIN) within 3 mm of the LIN connector.
Thông tin tuân thủ
AEC-Q100 Grade 1 qualified for automotive applications per the -BVAO suffix. RoHS and REACH compliant per Microchip product page documentation. Lead-free and halogen-free per Microchip material declaration.
