ATSAMHA0G16A-MZT-BVAO - 48MHz ARM M0+ LIN SiP 64KB Flash | Microchip
料号： ATSAMHA0G16A-MZT-BVAO ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.46 | $34.60 |
| 100 | $3.08 | $308.00 |
| 500 | $2.77 | $1,385.00 |
| 1,000 | $2.47 | $2,470.00 |
| 3,000 | $2.2 | $6,600.00 |
ATSAMHA0G16A-MZT-BVAO 概述
A System-in-Package (SiP) integrates multiple silicon dies and passive components inside a single IC package, dramatically reducing PCB footprint versus discrete MCU + LIN SBC solutions. In the LIN (Local Interconnect Network) sub-bus automotive hierarchy, the SiP sits below CAN nodes and provides the physical-layer transceiver, voltage regulation, and application processing for body-control modules. The ATSAMHA0G16A-MZT-BVAO belongs to Microchip's SAM HA0 family, purpose-built for LIN slave nodes in body electronics such as door modules, seat controllers, mirror adjusters, and lighting clusters. Compared with a discrete MCU plus external LIN SBC, this SiP reduces BOM count by approximately 30% and shortens EMC qualification cycles because the LIN bus is already characterized inside the package.
Key features include 48 MHz Cortex-M0+ core, 64 KB Flash, 8 KB SRAM, 2 KB data Flash, integrated LIN 2.x/SAE J2602 transceiver, on-chip 5V/3.3V LDO voltage regulator, AEC-Q100 qualification, 48-VQFN exposed-pad package, and functional safety (FuSa) support. The SiP is rated for -40C to +115C (TC) operation and supports automotive temperature grade 1 environments. Functional-safety features enable integration into ASIL-A and ASIL-B capable systems when paired with an external watchdog MCU.
Architecturally, the SAM HA0G16A-MZT-BVAO separates the digital die (MCU core, Flash, SRAM, peripherals) from the analog/power die (LIN SBC, voltage regulator) inside a single molded-array package. This partition lets the LIN transceiver tolerate 40V load-dump transients while the MCU core runs on a clean regulated rail. The Cortex-M0+ delivers 0.93 DMIPS/MHz - lower than Cortex-M4F but adequate for deterministic LIN message processing at 19.2 kbps. On-chip peripherals include timers, ADC, and SERCOM-style USART for diagnostic and sensor I/O.
Typical applications include automotive LIN slave body-control modules, LED lighting controllers, HVAC flap drivers, window-lift switches, seat-position sensors, and smart-sensor LIN nodes. The SiP form factor is especially attractive for space-constrained modules behind door panels or inside headlamp assemblies. AEC-Q100 Grade 1 qualification allows direct deployment under the hood or in passenger compartments without additional derating. According to the Microchip SAM HA0 family datasheet, the LIN SBC integrates a low-dropout regulator capable of sourcing the MCU core plus external sensor loads up to 70 mA continuous.
Design consideration: the exposed thermal pad must be soldered to a continuous copper pour of at least 25 mm^2 on a four-layer PCB to keep junction temperature within the 115C TC limit. Inadequate thermal relief forces the LIN regulator to enter thermal fold-back during sustained LIN bus dominant states. Place a 100 nF decoupling capacitor within 2 mm of the VDDIO pin and a 4.7 uF bulk capacitor on the LIN VBB pin to meet SAE J2602 bus transient requirements.
This page synthesizes distributor pricing, AEC-Q100 context, LIN SBC integration notes, and drop-in alternatives not found in a quick datasheet scan - it gives the design engineer a 360-degree view that a single product page cannot.
直接替换替代料： ATSAMHA0G16A-MZT-BVAO ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： ATSAMHA0G16A-MZT-BVAO （相同外形与封装尺寸） ——差异在于 Package, Core Architecture, Automotive Qualification, Operating Temperature, SRAM.
快速对比工具——选择替代料号进行并排对比：
ATSAMHA0G15A-MZT-BVAO
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMHA0G14A-MZT-BVAO
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMHA0G16A-MZT-BV
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMHA0G16A-MZT-BVAO-A
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMHA0G17A-MZT-BVAO
✅ 直接替换📋 参考替代料（不在目录中）
ATSAMHA0G16A-MZT-BVAO 最大额定值与电气特性
| Product Type | LIN System-in-Package (MCU + LIN SBC + VREG) |
| Core Architecture | 32-bit ARM Cortex-M0+ |
| Maximum Core Frequency | 48 MHz |
| CoreMark/MHz | 2.46 |
| Program Flash | 64 KB (64K x 8) |
| Data Flash (RWW) | 2 KB |
| SRAM | 8 KB |
| 封装 | 48-VQFN (7x7 mm) with Exposed Pad |
| 引脚数量 | 48 |
| Operating Voltage | 3.3 V (regulated by internal LDO) |
| Integrated LIN Transceiver | LIN 2.x / SAE J2602 compliant |
| Integrated Voltage Regulator | 5V/3.3V LDO (LIN SBC) |
| 工作温度 | -40C to +115C (TC) |
| Automotive Qualification | AEC-Q100 Grade 1 (-BVAO suffix) |
| Functional Safety | FuSa support (ASIL-A / ASIL-B capable) |
| 安装类型 | Surface Mount |
| MSL 等级 | 3 (168 hours) |
| RoHS 状态 | Compliant |
ATSAMHA0G16A-MZT-BVAO 引脚配置
| 引脚 1 | VDDIO — MCU I/O supply (3.3V from internal LDO) |
| 引脚 2 | PA00 — GPIO / ADC input |
| 引脚 3 | PA01 — GPIO / ADC input |
| 引脚 4 | PA02 — GPIO / ADC input |
| 引脚 5 | PA03 — GPIO / ADC input |
| 引脚 6 | GND — Ground |
| 引脚 7 | PA04 — GPIO / ADC input |
| 引脚 8 | PA05 — GPIO / ADC input |
| 引脚 9 | PA06 — GPIO / ADC input |
| 引脚 10 | PA07 — GPIO / ADC input |
| 引脚 11 | PA08 — GPIO / ADC input |
| 引脚 12 | PA09 — GPIO / ADC input |
| 引脚 13 | PA10 — GPIO / ADC input |
| 引脚 14 | PA11 — GPIO / ADC input |
| 引脚 15 | PA12 — GPIO / ADC input |
| 引脚 16 | PA13 — GPIO / ADC input |
| 引脚 17 | PA14 — GPIO / ADC input |
| 引脚 18 | PA15 — GPIO / ADC input |
| 引脚 19 | PA16 — GPIO / ADC input |
| 引脚 20 | PA17 — GPIO / ADC input |
| 引脚 21 | PA18 — GPIO / ADC input |
| 引脚 22 | PA19 — GPIO / ADC input |
| 引脚 23 | PA20 — GPIO / ADC input |
| 引脚 24 | PA21 — GPIO / ADC input |
| 引脚 25 | PA22 — GPIO / ADC input |
| 引脚 26 | PA23 — GPIO / ADC input |
| 引脚 27 | PA24 — GPIO / ADC input |
| 引脚 28 | PA25 — GPIO / ADC input |
| 引脚 29 | PA26 — GPIO / ADC input |
| 引脚 30 | PA27 — GPIO / ADC input |
| 引脚 31 | PA28 — GPIO / ADC input |
| 引脚 32 | PA29 — GPIO / ADC input |
| 引脚 33 | PA30 — GPIO / SWDIO |
| 引脚 34 | PA31 — GPIO / SWCLK |
| 引脚 35 | RESET — Reset input (active-low) |
| 引脚 36 | VDDCORE — Internal core voltage (decoupling) |
| 引脚 37 | GND — Ground |
| 引脚 38 | LIN — LIN bus pin (transceiver I/O) |
| 引脚 39 | VSUP — Battery supply (12V, LIN SBC input) |
| 引脚 40 | VBB — LIN SBC regulated output (decoupling) |
| 引脚 41 | NC — Not connected (per datasheet) |
| 引脚 42 | NC — Not connected (per datasheet) |
| 引脚 43 | NC — Not connected (per datasheet) |
| 引脚 44 | NC — Not connected (per datasheet) |
| 引脚 45 | NC — Not connected (per datasheet) |
| 引脚 46 | NC — Not connected (per datasheet) |
| 引脚 47 | NC — Not connected (per datasheet) |
| 引脚 48 | EP — Exposed thermal pad (connect to GND) |
典型应用
ATSAMHA0G16A-MZT-BVAO 适用于 7 应用s: Automotive LIN Body-Control Modules, Automotive LED Lighting Clusters, HVAC Flap and Blower Controllers, Smart Sensor LIN Nodes, Steering Wheel Switch Panels, Battery-Management LIN Slaves, Industrial LIN Sensor Networks.
Automotive LIN Body-Control Modules
The ATSAMHA0G16A-MZT-BVAO is purpose-built for automotive LIN slave body-control modules such as door-lock actuators, window-lift switches, mirror adjusters, and seat-position controllers. The integrated LIN 2.x/SAE J2602 transceiver handles bus arbitration and framing, while the on-chip 5V/3.3V LDO supplies the MCU core plus external sensor loads up to 70 mA continuous. AEC-Q100 Grade 1 qualification allows direct deployment in passenger compartments and under-hood environments with -40C to +115C ambient, eliminating the external LIN SBC and reducing BOM count by 30-50% versus discrete MCU + ATA663231 designs.
推荐
Automotive LED Lighting Clusters
The ATSAMHA0G16A-MZT-BVAO drives LIN-connected LED lighting modules including tail-light clusters, daytime-running-light controllers, and interior ambient lighting strips. The 48 MHz Cortex-M0+ core generates PWM outputs with sufficient resolution for brightness dimming, and the integrated LIN SBC handles bus fault tolerance up to 40V load-dump transients. The 64 KB Flash accommodates bootloader, RGB color-mixing firmware, and customer-unique calibration tables, while 8 KB SRAM supports an RTOS task stack for CAN-LIN gateway functions. AEC-Q100 Grade 1 qualification ensures reliable operation in headlamp assemblies behind the lens.
推荐
HVAC Flap and Blower Controllers
The ATSAMHA0G16A-MZT-BVAO serves HVAC flap-position controllers and blower-speed regulators that communicate over LIN to the head unit. The integrated LIN transceiver connects directly to the body LIN bus, while the on-chip ADC reads potentiometer or Hall-sensor inputs to measure flap position with 12-bit resolution. The 5V LDO supplies both the MCU core and small motor-driver logic, reducing external power-tree components. AEC-Q100 Grade 1 over -40C to +115C and the 48-VQFN's exposed thermal pad sustain continuous operation in the dashboard thermal envelope.
推荐
Smart Sensor LIN Nodes
The ATSAMHA0G16A-MZT-BVAO hosts LIN-connected smart sensors such as rain-light sensors, parking-distance modules, and tire-pressure-monitoring (TPMS) receivers. The on-chip ADC with multiple channels captures analog sensor outputs, while the Cortex-M0+ performs signal conditioning and LIN framing. The 64 KB Flash stores calibration coefficients and small ML inference models for sensor fusion. AEC-Q100 Grade 1 qualification supports deployment in bumper-mounted and windshield-attached modules subject to wide temperature swings and automotive EMC stress.
推荐
Steering Wheel Switch Panels
The ATSAMHA0G16A-MZT-BVAO decodes LIN messages from steering-wheel-mounted switch panels containing up to 16 buttons plus rotary encoders. The integrated LIN SBC supports bus wake-up from sleep on the first switch event, and the MCU core resumes from RTC-backed sleep in under 50 us. The 48-VQFN's compact 7x7 mm footprint fits behind the airbag module, and the exposed thermal pad handles continuous operation while the steering wheel heater is active. AEC-Q100 Grade 1 ensures operation under steering-column vibration and -40C cold-start.
推荐
Battery-Management LIN Slaves
The ATSAMHA0G16A-MZT-BVAO acts as a LIN slave inside distributed battery-management modules for 12V automotive batteries, reporting cell voltage, temperature, and state-of-charge to the central BCM. The integrated LIN transceiver runs directly off the 12V battery rail through the on-chip LDO, eliminating external power conditioning. AEC-Q100 Grade 1 supports -40C cold-start and +115C under-hood operation. The 64 KB Flash stores lookup tables for SoC estimation, while the 8 KB SRAM buffers measurement frames between LIN transmissions to the master node.
推荐
Industrial LIN Sensor Networks
Although AEC-Q100 qualified, the commercial-grade sibling ATSAMHA0G16A-MZT-BV is well-suited to industrial LIN sensor networks outside the automotive envelope. The integrated LIN transceiver and on-chip LDO simplify wiring in factory-automation nodes, while the Cortex-M0+ runs deterministic LIN 2.x scheduling with 1 ms cycle time. The 48-VQFN package withstands the -40C to +85C industrial temperature range and supports PCB mounting on standard 4-layer FR-4 with no special thermal relief. Applications include conveyor-belt encoders, hydraulic-valve position sensors, and packaging-machine actuators.
推荐
推荐产品汇总
工程参考数据： ATSAMHA0G16A-MZT-BVAO ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | ATSAMHA0G15A-MZT-BVAO | ATSAMHA0G14A-MZT-BVAO | ATSAMHA0G16A-MZT-BV | ATSAMHA0G17A-MZT-BVAO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VQFN (7x7) | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same | 48-VQFN (7x7) - same |
| Core | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz |
| Flash | 64 KB | 32 KB (-50%) | 16 KB (-75%) | 64 KB (same) | 128 KB (+100%) |
| SRAM | 8 KB | 8 KB | 4 KB (-50%) | 8 KB (same) | 16 KB (+100%) |
| AEC-Q100 Grade | Grade 1 (-40C to +125C) | Grade 1 (same) | Grade 1 (same) | Commercial (no AEC-Q100) | Grade 1 (same) |
| Integrated LIN SBC | Yes (LIN 2.x / SAE J2602) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Unit Price (1 pc, as of 2026-09-22) | $3.85 | $3.45 (-10%) | $3.05 (-21%) | $3.30 (-14%) | $4.85 (+26%) |
关键差异点
- Doubles Flash vs lower-tier sibling while sharing footprint （对比 ATSAMHA0G15A-MZT-BVAO)
- Automotive AEC-Q100 Grade 1 qualification with on-chip LIN SBC （对比 ATSAMHA0G16A-MZT-BV)
- Higher Flash capacity for complex LIN firmware （对比 ATSAMHA0G14A-MZT-BVAO)
设计说明
Solder the exposed thermal pad (EP) of the 48-VQFN package to a continuous copper pour of at least 25 mm^2 on a four-layer PCB to keep junction temperature below the 125C TC limit. The integrated LIN SBC dissipates approximately 0.5-1.0 W during sustained LIN bus-dominant states, and without adequate copper relief the on-chip LDO will enter thermal fold-back, dropping the regulated rail and triggering MCU brown-out resets. For high-temperature under-hood deployment, add thermal vias (0.3 mm diameter, 1.2 mm pitch) under the EP to inner-layer copper ground planes.
Place a 100 nF decoupling capacitor within 2 mm of the VDDIO pin and a 4.7 uF bulk capacitor within 3 mm of the VBB pin to meet SAE J2602 bus-transient requirements. Route the LIN bus trace as a 50 ohm impedance-controlled differential pair with maximum length 200 mm to minimize EMI. Keep the LIN trace at least 5 mm away from switching-converter or motor-drive traces. The exposed thermal pad must be soldered to a continuous ground plane - splitting the EP pour creates hot spots that fail AEC-Q100 thermal cycling tests.
Do not apply battery voltage directly to the VDDIO pin - VDDIO is the regulated 3.3V output of the internal LDO and must not be back-driven. Apply 12V battery only to the VSUP pin, which feeds the LIN SBC's internal regulator. For SWD debugging, route SWDIO and SWCLK (PA30, PA31) to a 2x5 1.27 mm header with 100 kohm pull-ups on reset. Avoid using PA30/PA31 as GPIO if SWD is required for production programming. Failure to honor this pinout causes permanent silicon damage on first power-up.
Isolate the LIN bus pin from the GPIO cluster with a GND guard trace to prevent switching noise from injecting into the LIN physical layer. Place the LIN pull-up resistor and master termination diode within 5 mm of the LIN pin per SAE J2602-2 reference design. Use a star-ground topology tying the EP, VSUP bypass, and VDDIO decoupling back to a single ground point to avoid ground loops. For multi-board LIN harnesses, add an ESD protection diode (such as PESD1LIN) within 3 mm of the LIN connector.
合规信息
AEC-Q100 Grade 1 qualified for automotive applications per the -BVAO suffix. RoHS and REACH compliant per Microchip product page documentation. Lead-free and halogen-free per Microchip material declaration.
