EP1AGX35DF780C6N - Arria GX FPGA, 33.5K LEs, 3.125 Gbps | Altera
MPN: EP1AGX35DF780C6N ⚠ Lần mua cuốiEP1AGX35DF780C6N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable routing, and dedicated hard IP such as transceivers, memory controllers, and PLLs. FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: like an ASIC they achieve high parallelism and deterministic timing, but unlike an ASIC the logic is defined at runtime through a hardware description language (HDL) and configuration bitstream. Within the broader taxonomy FPGAs belong to programmable logic devices (PLDs) and represent the highest-density member of that family.
Key features of the EP1AGX35DF780C6N include up to 8 full-duplex CDR-based transceivers supporting data rates from 600 Mbps to 3.125 Gbps across standards such as PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and XAUI. The device provides 4 PLLs (2 fast PLLs for transceivers plus 2 enhanced PLLs for general use), up to 341 user I/O pins, and dedicated 8b/10b encoding/decoding hardware on every transceiver channel. A C6 speed grade indicates the standard performance corner, while the extended temperature range ('N' suffix absent here) targets commercial 0C to 85C operation.
On the architecture side, the Arria GX device fabric embeds TriMatrix memory blocks (MLAB, M512, M4K, M-RAM) totaling roughly 1.35 Mbits, supporting true dual-port operation and mixed-width data paths. Configuration is supported through passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional encryption using AES bitstream protection. The transceiver hard IP integrates pre-emphasis, equalization, and a calibrated termination scheme that simplifies board-level signal integrity work for multi-gigabit serial links.
Typical applications include PCI Express Gen1 endpoint and root-complex cards, Gigabit Ethernet / 10 Gigabit Ethernet XAUI line cards, Serial RapidIO bridges for wireless baseband DSP clusters, broadcast video routers, and high-speed serial backplanes in industrial imaging and test equipment. The 780-FBGA package combined with 3.125 Gbps transceivers makes it well suited to mid-complexity protocol bridging designs where designers want FPGA flexibility without paying for full transceiver-rich Stratix-class silicon.
When designing with the EP1AGX35DF780C6N, pay close attention to transceiver power filtering, reference-clock jitter, and BGA fanout - the 1.0 mm pitch demands 4 or more PCB layers with microvia technology for cost-effective breakout. Quartus II is the canonical design toolchain; legacy projects may still target the older Quartus II 9.x or 10.x releases because newer Quartus versions have dropped support for this family.
Bộ thay thế dễ dàng lắp đặt cho EP1AGX35DF780C6N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1AGX35DF780C6N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, RoHS Status, Logic Elements, Logic Array Blocks (LABs).
EP1AGX35CF780C6N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1AGX35CF780I6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1AGX50CF780C6N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1AGX50CF780I6N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1AGX20CF780C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1AGX35DF780C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1AGX35DF780C6N Tỷ lệ tối đa & tính chất điện
| Family | Arria GX |
| Logic Elements (LEs) | 33,520 |
| Adaptive Logic Modules (ALMs) | 16,725 |
| Embedded Memory | 1,348,416 bits (1.35 Mbit) |
| Logic Array Blocks (LABs) | 1,676 |
| Maximum User I/O | 341 |
| Transceivers | Up to 8 channels |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| PLLs | 4 total (2 fast + 2 enhanced) |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Speed Grade | C6 (standard performance) |
| Hộp | 780-ball FC-FBGA (DF) |
| Package Dimensions | 29 x 29 mm, 1.0 mm pitch |
| Nhiệt độ hoạt động | Commercial 0C to 85C (TJ) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Lead Free | Yes |
| Configuration Modes | PS, FPP, JTAG, AES encryption |
Hướng dẫn cấu hình chân EP1AGX35DF780C6N 29 x 29 mm, 1.0 mm pitch
Cấu hình chân cho EP1AGX35DF780C6N (29 x 29 mm, 1.0 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1AGX35DF780C6N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1AGX35DF780C6N phù hợp cho 6 Áp dụngs: PCI Express Gen1 Endpoint Cards, Gigabit Ethernet / XAUI Line Cards, Serial RapidIO Wireless Baseband Bridges, Broadcast Video Routers and Switchers, High-Speed Serial Backplane Bridging, Industrial Test and Measurement Equipment.
PCI Express Gen1 Endpoint Cards
The EP1AGX35DF780C6N's 8 hardened 3.125 Gbps transceivers natively support PCI Express Gen1 (2.5 Gbps) endpoints with the integrated hard IP core for x1/x4/x8 link widths. The 1,348,416 bits of embedded memory comfortably buffer DMA descriptors and payload FIFOs, while 33,520 LEs host the PCIe application layer including MSI-X, completion timeout, and link-state logic. Designers benefit from the FC-FBGA package's 1.0 mm pitch which is compatible with standard 4-layer PCBs and inexpensive microvia stackup. Compared with a soft-IP PCIe solution on a Stratix-class device, this part reduces LE consumption by 40-60% and simplifies timing closure on multi-gigabit interfaces.
Được đề xuất
Gigabit Ethernet / XAUI Line Cards
The Arria GX transceiver hard IP supports 1000BASE-X SGMII and 10 Gigabit Ethernet XAUI (4 x 3.125 Gbps lanes) directly, eliminating the need for external PHY devices. The EP1AGX35DF780C6N's 8 transceiver channels allow a single chip to implement a quad-port Gigabit Ethernet switch or a single XAUI port plus housekeeping interfaces. The 4 PLLs (2 fast + 2 enhanced) generate the multiple reference clocks required for XAUI lane alignment. With 341 user I/O the device easily drives external MAC/PHY glue logic, packet classification engines, and management plane interfaces on the same die.
Được đề xuất
Serial RapidIO Wireless Baseband Bridges
Serial RapidIO (SRIO) at 1.25, 2.5, and 3.125 Gbps per lane is widely deployed in wireless base stations to interconnect DSP clusters with FPGAs acting as bridges between SRIO links and backplane fabrics. The EP1AGX35DF780C6N's 8 transceivers deliver up to 25 Gbps aggregate bandwidth, enough for 8x SRIO x1 lanes or 2x x4 links to dual DSP cards. The TriMatrix memory supports 1,348,416 bits of buffering for ingress packets, and the fast PLLs provide the low-jitter reference clocks demanded by SRIO link training. Commercial temperature grade suits indoor base-station deployments.
Được đề xuất
Broadcast Video Routers and Switchers
Broadcast studios need to switch uncompressed SDI video streams at 270 Mbps, 1.485 Gbps (HD-SDI), or 2.97 Gbps (3G-SDI) - all of which fit within the EP1AGX35DF780C6N's 3.125 Gbps transceiver envelope. Each of the 8 channels can clock out an SDI stream independently while embedded memory holds audio and ANC data buffers. The 33,520 LEs host audio de-embedding, frame synchronizers, and routing matrix logic, while 341 user I/O pins drive downstream HDMI / DisplayPort encoders or GPIO to studio control panels. The 780-FBGA package dissipates heat through the package backside, suitable for rack-mounted cooled chassis.
Được đề xuất
High-Speed Serial Backplane Bridging
Industrial imaging and test systems often backhaul multiple sensor lanes over a high-speed serial backplane operating at 1.5-3.125 Gbps. The EP1AGX35DF780C6N aggregates up to 8 sensor channels and re-drives them across a backplane or fiber link, while 33,520 LEs implement sensor pre-processing, timestamp insertion, and CRC generation. The 1.0 mm-pitch FC-FBGA package enables standard 4-layer PCB stackups with microvia fanout, keeping backplane card costs low. Embedded TriMatrix memory stores line buffers and lookup tables for sensor calibration.
Được đề xuất
Industrial Test and Measurement Equipment
Automated Test Equipment (ATE) for RF, mixed-signal, and high-speed digital devices needs parallel multi-gigabit serial interfaces and real-time DSP for protocol-aware measurements. The EP1AGX35DF780C6N provides 8 transceivers up to 3.125 Gbps for connecting to DUTs via SATA, PCIe, XAUI, or proprietary links, while 33,520 LEs host pattern generators, error counters, and protocol analyzers. The 1,348,416 bits of embedded memory act as waveform / pattern buffers, and the 341 user I/O drive external DAC/ADC analog front-ends. Commercial temperature grade suits benchtop instrumentation in climate-controlled labs.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1AGX35DF780C6N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1AGX35CF780C6N | EP1AGX35CF780I6N | EP1AGX50CF780C6N | EP1AGX50CF780I6N | EP1AGX20CF780C6N | EP1AGX35DF780C6 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-ball FC-FBGA (DF) | 780-ball FC-FBGA (CF) - same footprint | 780-ball FC-FBGA (CF) - same footprint | 780-ball FC-FBGA (CF) - same footprint | 780-ball FC-FBGA (CF) - same footprint | 780-ball FC-FBGA (CF) - same footprint | 780-ball FC-FBGA (DF) - same footprint |
| Logic Elements | 33,520 | 33,520 (same) | 33,520 (same) | 50,160 (+49.7%) | 50,160 (+49.7%) | 20,140 (-39.9%) | 33,520 (same) |
| Embedded Memory (bits) | 1,348,416 | 1,348,416 (same) | 1,348,416 (same) | 2,475,072 (+83.6%) | 2,475,072 (+83.6%) | 1,230,720 (-8.7%) | 1,348,416 (same) |
| User I/O | 341 | 341 (same) | 341 (same) | 341 (same) | 341 (same) | 341 (same) | 341 (same) |
| Transceivers | 8 @ up to 3.125 Gbps | 8 @ up to 3.125 Gbps (same) | 8 @ up to 3.125 Gbps (same) | 8 @ up to 3.125 Gbps (same) | 8 @ up to 3.125 Gbps (same) | 8 @ up to 3.125 Gbps (same) | 8 @ up to 3.125 Gbps (same) |
| Speed Grade | C6 | C6 (same) | I6 (faster corner) | C6 (same) | I6 (faster corner) | C6 (same) | C6 (same) |
| Operating Temperature | Commercial 0C to 85C | Industrial -40C to 100C | Industrial -40C to 100C | Industrial -40C to 100C | Industrial -40C to 100C | Industrial -40C to 100C | Commercial 0C to 85C |
Bảo phân biệt quan trọng
- Pin-compatible density and temperature options within Arria GX family (vsEP1AGX35CF780C6N vs EP1AGX20CF780C6N)
- Highest LEs at the commercial C6 speed grade in 780-FBGA (vsEP1AGX35DF780C6N vs EP1AGX35CF780I6N)
- Pure commercial temperature grade with no 'N' trailing designator (vsEP1AGX35DF780C6 vs EP1AGX35DF780C6N)
Ghi chú thiết kế
Estimated: BGA breakout at 1.0 mm ball pitch on the EP1AGX35DF780C6N requires at least 4 PCB layers with 0.2 mm via-pad diameter microvias-in-pad. The 780-ball array needs approximately 12 mm of perimeter space for signal fanout on outer layers before via stitching becomes possible. Use 1 oz copper on outer layers and 0.5 oz on inner layers for controlled-impedance traces around the BGA. Add a continuous GND pour under the package die-up area to provide a low-impedance reference plane for the transceivers' return currents.
According to the Arria GX device handbook, transceiver reference clock jitter must be below 1 ps RMS (12 kHz to 20 MHz) for 3.125 Gbps operation. Use a dedicated low-jitter clock generator with a clean power supply; isolate the clock generator from the FPGA core VCC using a ferrite bead and a separate LDO. Match differential clock traces to 100 ohm differential impedance with length matching to within 5 mils. Place a 0.1 uF AC-coupling capacitor within 100 mils of each transceiver pin pair.
Estimated: The EP1AGX35DF780C6N can dissipate up to approximately 8 W with all 8 transceivers active at 3.125 Gbps and high logic utilization. The FC-FBGA package relies on the PCB thermal land and the top-side spreader; a minimum 6-layer board with thermal vias (0.3 mm pitch) under the package is recommended for unrestricted operation. Without forced airflow, derate transceiver throughput or reduce LE utilization to stay below junction 100C at 70C ambient.
Estimated: Quartus II 13.1 is the last version with reliable support for the Arria GX family. Newer Quartus Prime releases (15.0 and later) drop Arria GX device support, locking legacy designs into an obsolete toolchain. Plan migration to Arria V or Arria 10 using Quartus Prime's 'Project Migration' wizard; expect 80-90% porting effort and verify transceiver IP core changes (Altera's MegaWizard is replaced by IP Catalog in newer releases).
Thông tin tuân thủ
Lead-free 780-ball FC-FBGA per FindIC package data. Halogen-free status not explicitly stated in verified data - set to 'unknown'. RoHS and REACH compliance per Altera/Intel product environmental certification. Not AEC-Q100 qualified - this is a commercial-grade FPGA, not an automotive part.
