EP1C6F25617N - Cyclone FPGA 6K LEs 185 I/O FBGA | Altera
MPN: EP1C6F25617N ✗ Cuối đờiEP1C6F25617N Tóm tắt
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic functionality is defined after manufacture by loading a user-supplied configuration bitstream into on-chip SRAM. FPGAs sit in the programmable-logic hierarchy between small CPLDs (limited gates, non-volatile) and ASICs (high NRE cost, fixed function). The Cyclone family is positioned as a low-cost, high-volume FPGA, optimized for glue logic, bus bridging, and modest DSP workloads rather than the highest logic density or transceiver performance.
Key features of the EP1C6F25617N include 5,980 logic elements with embedded multiplier support via Quartus II synthesis, 92 Kbits of embedded RAM organized as M4K blocks (4 Kbit + 512 parity bits each), and two general-purpose PLLs with up to four output taps per PLL for clock synthesis and skew management. The device supports LVTTL, LVCMOS, SSTL, and HSTL I/O standards and provides dedicated DDR SDRAM interfaces at up to 133 MHz. Configuration is supported through JTAG, Passive Serial (PS), and Active Serial (AS) modes using low-cost Altera configuration devices.
Typical applications span industrial control and factory automation glue logic, low-cost video processing pipelines, point-to-point serial protocol bridging (UART, SPI, I2C, parallel bus), consumer electronics display controllers, and education/development platforms where cost and Quartus II toolchain familiarity dominate the decision. The 185 single-ended (or 92 differential-pair) user I/O pins provide substantial board-level connectivity for sensor aggregation and peripheral expansion.
When designing with the EP1C6F25617N, observe the recommended decoupling scheme (0.1 µF at every VCC pin plus bulk 47 µF tantalum) and follow Altera's FBGA-256 land pattern with 1.00 mm ball pitch. Decoupling should use short, wide traces from each VCC/VCCIO pair to the nearest ground via. Since configuration is volatile SRAM-based, the FPGA must be reconfigured at every power-up via JTAG or an external configuration PROM such as EPCS4 or EPCS16.
Bộ thay thế dễ dàng lắp đặt cho EP1C6F25617N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1C6F25617N (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package, Process Technology, Speed Grade, Family.
EP1C6F256I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C8N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2C6F256C8N
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
XC3S500E-FG256
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP1C6F25617N Tỷ lệ tối đa & tính chất điện
| Family | Cyclone (Cyclone I) |
| Logic Elements (LE) | 5,980 |
| Total RAM Bits | 92,160 |
| M4K RAM Blocks | 13 |
| Embedded Multipliers (18x18) | 20 |
| PLLs | 2 |
| Maximum User I/O | 185 |
| User I/O Banks | 8 |
| Hộp | 256-ball FBGA (FineLine BGA), 1.00 mm pitch |
| Process Technology | 0.13 µm SRAM CMOS |
| Nhiệt độ hoạt động | -40 °C to +85 °C (Industrial) |
| Speed Grade | 7 |
| Supply Voltage (Core) | 1.5 V |
| Configuration Method | JTAG / Passive Serial / Active Serial |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Cấp MSL | 3 (168 hours) |
Hướng dẫn cấu hình chân EP1C6F25617N 256-ball fbga (fineline bga), 1.00 mm pitch
Cấu hình chân cho EP1C6F25617N (256-ball fbga (fineline bga), 1.00 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1C6F25617N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1C6F25617N phù hợp cho 6 Áp dụngs: Industrial Glue Logic and Bus Bridging, Low-Cost Video Processing Pipelines, Consumer Display Controller Boards, Educational FPGA Development Platforms, Point-to-Point Serial Protocol Bridging, Legacy Medical Imaging Equipment Sustainment.
Industrial Glue Logic and Bus Bridging
The EP1C6F25617N fits industrial glue-logic applications because its 5,980 logic elements, 13 M4K RAM blocks, and 185 user I/O provide ample capacity for parallel bus conversion, async clock-domain crossing FIFOs, and protocol glue such as UART-to-SPI or I2C-to-parallel bridges. The industrial -40 °C to +85 °C operating range and 1.5 V core with 3.3 V-tolerant I/O are compatible with legacy industrial PLC backplanes. Placed on a PLC backplane between a 16-bit parallel ADC and an ARM host processor, the FPGA converts ADC data to LVDS at up to 100 MHz without external bus-driver logic. Compared to a CPLD, the FPGA adds 92 Kbits of on-chip FIFO memory, eliminating external SRAM in typical aggregation pipelines.
Được đề xuất
Low-Cost Video Processing Pipelines
The EP1C6F25617N suits low-cost video processing because its 185 user I/O and 20 embedded 18x18 multipliers handle composite-to-LVDS bridging and simple de-interlacing at standard-definition rates. The device's M4K RAM blocks can be configured as line buffers (typically 720x8 = 5760 bits per line, easily fitting within 13 M4K blocks) for scan conversion. Used on an entry-level security camera board, the FPGA converts analog composite to digital ITU-R BT.656 at 27 MHz pixel clock, leaving headroom for OSD overlay. The 5,980 LEs are sufficient for a simple median filter or motion detector, but high-definition pipelines require migration to Cyclone IV.
Được đề xuất
Consumer Display Controller Boards
The EP1C6F25617N fits consumer display controllers because its 2 PLLs provide up to 4 output taps each, supporting pixel clock generation from 25 MHz (VGA) to 148.5 MHz (1080p reduced blanking) while also driving the LVDS serializer reference clock. The 8 I/O banks enable mixed 3.3 V TTL keypad/IR input alongside 1.8 V LVDS output to the LCD panel. Placed on a small-form-factor digital signage board, the FPGA converts HDMI-TMDS decoded input to dual-channel LVDS at 1080p60 using on-chip PLLs and FIFO-based frame-rate conversion. Compared to a fixed-function LCD controller ASIC, the FPGA enables late-stage panel-timing customization.
Được đề xuất
Educational FPGA Development Platforms
The EP1C6F25617N suits educational development boards because its 5,980 LEs provide enough capacity for textbook examples (CPU cores, video controllers, signal processing demos) while remaining affordable for university labs. The 256-ball FBGA with 1.00 mm pitch is a good compromise between board-routing complexity and I/O count, and the Quartus II Web Edition toolchain remains free. Used on an FPGA training board, students implement a RISC-V RV32I core, a VGA text-mode controller, and an I2S audio pipeline from scratch using Verilog HDL. The 92 Kbits of block RAM support cache and frame-buffer exercises without external memory, simplifying lab setup.
Được đề xuất
Point-to-Point Serial Protocol Bridging
The EP1C6F25617N fits serial-protocol bridging applications because its PLLs and flexible I/O support multi-protocol interfacing (UART, SPI, I2C, RS-232, RS-485) on the same device without external transceivers for the slower standards. The 5,980 LEs and 92 Kbits of block RAM enable small FIFOs for rate-matching between asynchronous sources. Placed in a sensor-hub gateway, the FPGA aggregates up to 16 SPI sensors at 10 MHz and re-emits the combined stream over a single high-speed SPI or LVDS link to the host processor. Compared to a microcontroller, the FPGA provides deterministic latency for time-sensitive sensor aggregation.
Được đề xuất
Legacy Medical Imaging Equipment Sustainment
The EP1C6F25617N is a drop-in solution for sustaining field-deployed medical imaging systems whose original FPGA is failing and where a complete board redesign would require costly FDA re-qualification. Its 5,980 LEs, 92 Kbits of block RAM, and 185 I/O support legacy B-mode ultrasound front-end pre-beamforming and basic grayscale processing exactly as the original design. Placed on a legacy ultrasound analog front-end board, the FPGA replicates the original bitstream with no software changes, restoring the device to factory specification. The industrial -40 to +85 °C operating range matches medical equipment environmental requirements. Migrating to Cyclone IV requires a full re-qualification.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1C6F25617N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1C6F256I7N | EP1C6F256C8N | EP2C6F256C8N | XC3S500E-FG256 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Xilinx |
| Package | FBGA-256 (1.00 mm pitch) | FBGA-256 (1.00 mm pitch) - same | FBGA-256 (1.00 mm pitch) - same | FBGA-256 (1.00 mm pitch) - same | FBGA-256 (1.00 mm pitch) - same |
| Logic Elements | 5,980 LEs | 5,980 LEs (same die) | 5,980 LEs (same die) | 11,058 LEs (+85%) | 500K system gates (comparable) |
| Embedded RAM | 92,160 bits | 92,160 bits (same) | 92,160 bits (same) | 240,240 bits (+160%) | 73,728 bits |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) - same | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | 7 | 7 | 8 (faster) | 8 (faster) | -4 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.2 V (different power tree required) | 1.2 V (different power tree required) |
| PLLs | 2 | 2 | 2 | 2 | 4 DLLs (equivalent function) |
| Multipliers (18x18) | 20 | 20 | 20 | 30 (+50%) | 20 (18x18) |
Bảo phân biệt quan trọng
- Industrial temperature grade with verified operating range (vsEP1C6F256C8N)
- Larger logic and RAM density with same FBGA-256 footprint (vsEP1C6F256I7N)
- All-Cyclone-I options for supply-constrained legacy designs (vsXC3S500E-FG256)
Ghi chú thiết kế
The EP1C6F25617N requires three independent rails: VCCINT (1.5 V core), VCCIO (per-bank, 1.5 V/1.8 V/2.5 V/3.3 V) for each of the 8 I/O banks, and a PLL analog supply (VCC_PLL1/2 = 1.5 V). Each VCC_PLL must be decoupled with a 0.1 µF and 0.001 µF pair per Altera's Cyclone Device Handbook. Estimated: total ICCINT at 50 MHz with 80% utilization is approximately 250 mA. A 1 A-capable LDO or switching regulator on VCCINT is recommended. Sequence VCCIO before VCCINT, or assert them simultaneously, to avoid I/O latch-up.
Use the 256-ball FineLine BGA with 1.00 mm ball pitch. Per Altera's FBGA-256 land pattern, the PCB pad diameter should be 0.50 mm with a 0.60 mm solder-mask opening. Use a 4-6 layer stackup with continuous GND planes under the FPGA and at least one VCC plane adjacent to GND for decoupling. Place 0.1 µF X5R ceramic decoupling capacitors within 3 mm of every VCCIO/VCCINT ball pair, and one bulk 47 µF tantalum per supply domain within 25 mm. Route all differential pairs (LVDS) with 100 Ω differential impedance and length matching within 0.5 mm.
Configuration is volatile SRAM-based; the EP1C6F25617N must be reconfigured at every power-up via JTAG, Passive Serial (PS) with an EPCS4/EPCS16, or Active Serial (AS). A missing or corrupted configuration bitstream leaves the device in tri-state with all I/O floating, which can back-power downstream devices through their I/O ESD diodes. Add a CONFIG_DONE pull-up on the PCB so the system host can detect a failed boot. The 'N' suffix indicates lead-free (Pb-free) FBGA package; peak reflow temperature is 245 °C with 60 seconds above 217 °C per JEDEC J-STD-020.
Thông tin tuân thủ
The 'N' suffix indicates lead-free (Pb-free) FBGA package per Altera legacy naming convention. RoHS, REACH, halogen-free, and conflict-minerals compliance not specified in the verified web data and marked [DATA_NEEDED] in specs. AEC-Q100 not applicable for FPGA logic devices (industrial temp grade only).
