EP1C6F256C8N - Cyclone FPGA 6K LE 256-BGA | Intel
MPN: EP1C6F256C8N ⚠ Lần mua cuốiEP1C6F256C8N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), embedded memory, routing channels, and programmable I/O cells that engineers can re-program in the field after manufacture. Within the broader semiconductor hierarchy, FPGAs sit alongside microcontrollers, DSPs, and ASICs as programmable logic devices, and Cyclone-family parts occupy Intel's low-cost, high-volume tier of that hierarchy. They are widely used to replace discrete glue logic, accelerate parallel data paths, and bridge mismatched interfaces without committing to an ASIC NRE.
Key features of the EP1C6F256C8N include 5,980 LEs, 92,160 bits of embedded RAM (~11.25 KB), 185 user I/Os, two PLLs, and support for LVTTL, LVCMOS, SSTL, and LVDS I/O standards. The Cyclone architecture uses 4-input look-up tables (4-LUTs) per LE and dedicated carry-chain routing for arithmetic, providing predictable timing closure for state machines and DSP-style datapaths up to the device's logic-capacity ceiling.
The device is fabricated on a 1.5 V core, 0.13 µm process, and supports configuration via passive serial (PS), active serial (AS), and JTAG modes. The 256-ball FBGA package has a 17 mm × 17 mm body with a 1.0 mm ball pitch, suitable for multi-layer FR4 PCBs. Each user I/O is organized into banks with per-bank VCCIO rails that can be mixed between 1.5 V, 1.8 V, 2.5 V, and 3.3 V, allowing direct interfacing to memories and processors of different voltage generations on the same board.
Typical applications for this Cyclone device include industrial control and factory automation backplanes, video and image processing pre-processing pipelines, communications protocol bridging (UART, SPI, I2C, parallel bus glue logic), and consumer-electronics display controllers. Designers also use Cyclone FPGAs as low-cost I/O expanders for embedded processors, custom peripheral controllers, and rapid ASIC prototyping.
When designing with the EP1C6F256C8N, observe the I/O-bank VCCIO rules: each bank has its own voltage reference, and mixing 3.3 V LVTTL with 1.5 V SSTL inputs in the same bank is not allowed. Decouple every VCCINT and VCCIO pin with 0.1 µF X7R ceramic capacitors placed as close to the balls as possible, and route the JTAG TCK/TMS/TDO/TDI signals with 4.7 kΩ pull-ups on TCK/TMS to ensure reliable configuration.
This page synthesizes distributor pricing, same-family drop-in speed-grade alternatives, and practical design notes not found in the original Cyclone datasheet, giving procurement and design engineers a consolidated reference for the EP1C6F256C8N.
Bộ thay thế dễ dàng lắp đặt cho EP1C6F256C8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1C6F256C8N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Operating Temperature, Process Technology, RoHS Status.
EP1C6F256C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256I7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C8
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C7NAB
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1C6F256C8N Tỷ lệ tối đa & tính chất điện
| Series | Cyclone |
| Family | Cyclone I |
| Logic Elements (LEs) | 5,980 |
| Embedded Memory (bits) | 92,160 |
| User I/O Pins | 185 |
| Number of PLLs | 2 |
| Core Voltage (VCCINT) | 1.5 V |
| Nhiệt độ hoạt động | 0 °C to +85 °C (Commercial) |
| Speed Grade | 8 |
| Hộp | 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| Process Node | 0.13 µm SRAM |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, LVDS |
| Trạng thái RoHS | Compliant |
| Cấp MSL | 3 |
Hướng dẫn cấu hình chân EP1C6F256C8N 256-bga (fbga-256), 17 × 17 mm, 1.0 mm pitch
Cấu hình chân cho EP1C6F256C8N (256-bga (fbga-256), 17 × 17 mm, 1.0 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1C6F256C8N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1C6F256C8N phù hợp cho 6 Áp dụngs: Industrial Control & Factory Automation Backplanes, Video & Image Processing Pre-Processing Pipelines, Communications Protocol Bridging & Glue Logic, Custom Peripheral Controllers for Embedded Processors, Consumer Display & Touch-Screen Controllers, Rapid ASIC Prototyping & Design Validation.
Industrial Control & Factory Automation Backplanes
The EP1C6F256C8N fits industrial control backplanes because its 5,980 LEs deliver enough capacity to implement multiple protocol bridges (RS-485, RS-232, SPI, I2C, CAN) on a single device, while 185 user I/Os provide fan-out for backplane connectors and field wiring. The 256-FBGA's 1.0 mm ball pitch is reflow-compatible with standard 4-layer FR4 PCBs used in DIN-rail controllers. Cyclone PLLs generate deterministic clock domains for synchronized motor-control loops, and the 92 Kb embedded RAM serves as line buffers for high-speed serial streams in factory-floor networks.
Được đề xuất
Video & Image Processing Pre-Processing Pipelines
The EP1C6F256C8N is used for camera-link pre-processing because its 5,980 LEs and 92 Kb embedded RAM can implement line buffers, color-space converters, and simple spatial filters at video rates. The LVDS-capable I/Os of the Cyclone I support direct connection to LVDS camera-link pairs without external transceivers. Designers typically run the FPGA at 65-100 MHz to process 8- or 16-bit-wide pixel buses, with one PLL multiplying a 27 MHz reference to derive the pixel clock and memory clock. The 256-FBGA package exposes enough I/Os to drive both a video ADC input and an LCD output simultaneously.
Được đề xuất
Communications Protocol Bridging & Glue Logic
The EP1C6F256C8N serves as a protocol bridge between mismatched busses (PCI to local bus, UART to SPI, Ethernet MAC to parallel FIFO) because the Cyclone architecture provides 4-LUT-based logic elements with dedicated carry chains for fast glue-logic state machines. With 185 user I/Os and per-bank VCCIO flexibility, the device interfaces directly to 3.3 V LVTTL, 2.5 V SSTL, and 1.8 V LVCMOS peripherals on the same board. Two PLLs can deskew source-synchronous clocks and generate independent baud-rate clocks for multiple serial channels.
Được đề xuất
Custom Peripheral Controllers for Embedded Processors
The EP1C6F256C8N is used as a low-cost peripheral controller attached to a host MCU or microprocessor because its 5,980 LEs can host multiple custom peripherals (PWM generators, quadrature encoders, custom bus masters) while the 256-FBGA exposes 185 I/Os for off-board signaling. Designers route processor address/data buses through the FPGA's LVTTL I/O banks, using one PLL to align the local bus clock with the host's clock domain. Embedded RAM serves as FIFO buffers between the host and high-speed external peripherals such as ADCs.
Được đề xuất
Consumer Display & Touch-Screen Controllers
The EP1C6F256C8N drives custom LCD or OLED panels because the Cyclone I provides enough logic for timing-controller state machines, color-depth conversion (e.g., 18-bit to 24-bit RGB), and touch-screen digitizer interfaces. Its 185 user I/Os and per-bank VCCIO rails connect directly to 3.3 V TTL LCDs and 1.8 V OLED drivers without external level shifters. Designers use one PLL to multiply a low-frequency crystal to the panel's pixel clock, while the embedded RAM holds frame-buffer lines for double-buffered display updates.
Được đề xuất
Rapid ASIC Prototyping & Design Validation
The EP1C6F256C8N is used as a prototype vehicle for ASIC blocks before committing to mask costs because its 5,980 LEs can map representative slices of an ASIC RTL for in-system validation. The 256-FBGA exposes JTAG, AS, and PS configuration ports for rapid bitstream iteration during bring-up. Engineers running ASIC prototypes on Cyclone I typically partition the ASIC into multiple FPGAs, using the embedded 92 Kb RAM to share data between logic regions. The commercial temperature range suits lab validation, while the industrial drop-in (EP1C6F256I7N) supports field trials.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1C6F256C8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1C6F256C7N | EP1C6F256I7N | EP1C6F256C8 | EP1C6F256C7NAB | EP1C6F256C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-BGA (FBGA-256) | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same | 256-BGA (FBGA-256) - same |
| Logic Elements | 5,980 | 5,980 | 5,980 | 5,980 | 5,980 | 5,980 |
| Embedded Memory (bits) | 92,160 | 92,160 | 92,160 | 92,160 | 92,160 | 92,160 |
| User I/Os | 185 | 185 | 185 | 185 | 185 | 185 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Speed Grade | 8 | 7 | 7 | 8 | 7 | 6 |
Bảo phân biệt quan trọng
- Lowest unit cost in Cyclone I speed-grade line for the 6 K LE class (vsEP1C6F256C7N)
- Commercial temperature grade optimized for cost-sensitive indoor equipment (vsEP1C6F256I7N)
- Lead-free (Pb-free) assembly with RoHS and REACH compliance (vsEP1C6F256C8)
Ghi chú thiết kế
Estimated: at 100 MHz with 60% logic utilization and 3.3 V LVTTL I/O at moderate toggle rate, the EP1C6F256C8N consumes roughly 0.4 W to 0.9 W. Designers should budget at least 1.5 W worst-case dissipation and provide a small copper flood under the FBGA thermal pad. Decouple every VCCINT pin with 0.1 µF X7R ceramic capacitors placed as close to the balls as possible, and add a bulk 47 µF tantalum or polymer capacitor near the FPGA to suppress core-rail droop during simultaneous-switching events.
The 256-FBGA has a 1.0 mm ball pitch, which requires 0.5 mm-pitch via-in-pad or dog-bone fan-outs on a 4-layer FR4 stack-up. Use microvia or laser-drilled stacked-via technology if signal escape routing is tight. Match length (±150 mil) on JTAG TCK/TMS/TDO/TDI signals and add 4.7 kΩ pull-ups on TCK and TMS to ensure reliable configuration. Route differential LVDS pairs with 100 Ω differential impedance and length matching within 50 mil to maintain data-eye margins.
Do not mix 3.3 V LVTTL and 1.5 V SSTL inputs in the same I/O bank: each I/O bank has a single VCCIO rail, and mixed-voltage inputs violate absolute-maximum ratings. Always tie unused user I/Os to a defined logic level (drive to ground or to VCCIO of the bank) rather than leaving them floating, because floating inputs can draw shoot-through current in the I/O cell and cause spurious current spikes. When using Active Serial (AS) configuration, verify that the serial flash (EPCS4/EPCS16) VCC matches the FPGA VCCIO[3] bank voltage before powering up.
Thông tin tuân thủ
RoHS compliance confirmed by 'N' suffix in ordering code. REACH compliance declared by manufacturer. AEC-Q100 is not applicable for a commercial-grade FPGA; the industrial 'I7N' variant is not AEC-Q100 qualified either. Last-time-buy (LTB) status: confirm with Intel PCN before committing to long-life-cycle designs.
