EP20K60EFC324-2 - APEX-20KE 60K FPGA 324-BGA | Altera / Intel
MPN: EP20K60EFC324-2 ✗ Cuối đờiEP20K60EFC324-2 Tóm tắt
An FPGA is a programmable logic device (PLD) that combines the flexibility of software-configurable logic with the performance of dedicated silicon. It sits at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. APEX-20KE introduced MultiCore architecture integrating look-up tables, product-term logic, and embedded memory on a single die, enabling the industry's first true system-on-a-programmable-chip (SOPC) integration at the time of launch.
Key features include 196 user I/Os, 256 LABs/CLBs, 32 Kb of distributed RAM, hot-socketing support, MultiVolt I/O for interfacing across mixed-voltage rails, and Altera's Quartus design flow compatibility. The -2 speed grade places it in the mid-band of APEX-20KE, balancing timing margin against cost.
The device is built on a 0.18 um CMOS process with multi-layer routing and embedded array blocks (EABs) used for memory, DSP-style operations, and wide fan-in functions. The high gate count and embedded block memory make it suitable for bus bridging, glue logic consolidation, and protocol offload rather than high-end DSP or GPU workloads.
Typical applications include industrial control and factory automation backplanes, telecom line-card glue logic, military/aerospace control subsystems, legacy PCI/PCI-X bridges, and embedded control systems where moderate logic density and 196 I/Os are required. The 324-FBGA package supports high-density board layouts.
When designing with EP20K60EFC324-2, account for its legacy 1.8 V core supply and ensure the host PCB supports JTAG configuration via the dedicated configuration pins. The part is now in mature / last-time-buy territory - confirm lifecycle status before committing to new designs.
This page synthesizes distributor pricing from Heisener, Rochester Electronics and Octopart, drop-in alternatives within the APEX-20KE family, and practical design notes not consolidated in the original datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP20K60EFC324-2 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP20K60EFC324-2 (cùng hình factor và footprint) — khác nhau ở Operating Temperature, Package / Case, Series, Family, Process Technology.
EP20K60EFC324-2X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K60EFC324-1X
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K60EFC324-1
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K60EFC324-1
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP20K60EFC324-2 Tỷ lệ tối đa & tính chất điện
| Series | APEX-20KE |
| Product Type | FPGA (Field Programmable Gate Array) |
| Number of Logic Elements / Cells | 2,560 |
| Number of LABs / CLBs | 2,560 |
| Number of Gates | 162,000 |
| Total RAM Bits | 32,768 |
| Number of User I/Os | 196 |
| Core Voltage - Supply | 1.71 V to 1.89 V |
| Internal Frequency (max) | 160 MHz |
| Propagation Delay | 1.72 ns |
| Logic Family | CMOS |
| Nhiệt độ hoạt động | 0 C to 85 C |
| Kiểu lắp đặt | Surface Mount |
| Hộp / Vỏ | 324-BGA |
| Supplier Device Package | 324-FBGA (19x19) |
| Speed Grade | -2 |
Cấu hình chân EP20K60EFC324-2
| Chân A1 | I/O — User I/O - bank assignment per datasheet |
| Chân A2 | I/O — User I/O |
| Chân A3 | I/O — User I/O |
| Chân B1 | I/O — User I/O |
| Chân B2 | I/O — User I/O |
| Chân B3 | VCCINT — Core supply 1.8 V |
| Chân C1 | GND — Ground |
| Chân C2 | VCCIO — I/O supply (bank) |
| Chân C3 | I/O — User I/O |
| Chân D1 | I/O — User I/O |
| Chân D2 | TDI — JTAG Test Data In |
| Chân D3 | TCK — JTAG Test Clock |
| Chân E1 | TMS — JTAG Test Mode Select |
| Chân E2 | TDO — JTAG Test Data Out |
| Chân E3 | nCONFIG — Configuration control (active low) |
| Chân F1 | DCLK — Configuration clock |
| Chân F2 | DATA0 — Configuration data input |
| Chân F3 | nSTATUS — Configuration status (active low) |
| Chân G1 | CONF_DONE — Configuration done indicator |
| Chân G2 | I/O — User I/O |
| Chân G3 | I/O — User I/O |
| Chân H1 | I/O — User I/O |
| Chân H2 | VCCINT — Core supply 1.8 V |
| Chân H3 | GND — Ground |
| Chân J1 | I/O — User I/O |
| Chân J2 | I/O — User I/O |
| Chân J3 | I/O — User I/O |
| Chân K1 | GND — Ground |
| Chân K2 | VCCIO — I/O supply (bank) |
| Chân K3 | I/O — User I/O |
| Chân L1 | I/O — User I/O |
| Chân L2 | I/O — User I/O |
| Chân L3 | I/O — User I/O |
Ứng dụng tiêu biểu
EP20K60EFC324-2 phù hợp cho 6 Áp dụngs: Industrial Control and Factory Automation Backplanes, Telecom Line-Card Glue Logic, Legacy PCI / PCI-X Bridge and I/O Expansion, Aerospace and Defense Subsystem Controllers, Embedded Control and Protocol Offload, Test and Measurement Instrumentation Front-End.
Industrial Control and Factory Automation Backplanes
The EP20K60EFC324-2's 196 user I/Os and 2,560 logic elements make it a strong fit for industrial backplane glue logic, where it consolidates discrete 74-series logic and small PLDs into a single programmable device. Its 162,000 system gates and 32 Kb of embedded RAM are sufficient to handle PLC scan scheduling, motor-control sequencing, and protocol framing for Modbus, Profibus, or CANopen segments. The commercial 0-85 C temperature rating is adequate for enclosed control cabinets. The 324-FBGA footprint supports high-density routing required when aggregating multiple field-bus interfaces on one board. Trade-off: APEX-20KE is NRND, so plan a migration to Cyclone IV E or MAX 10 for new programs while continuing to use this part for installed-base spares.
Được đề xuất
Telecom Line-Card Glue Logic
Telecom line cards have historically relied on APEX-20KE for protocol bridging, TDM bus aggregation, and timing-slice manipulation. The EP20K60EFC324-2 supplies 32 Kb of block RAM to absorb small FIFO/payload buffers and 256 LABs/CLBs for state-machine heavy HDLC or PPP framing. The 1.8 V core plus MultiVolt I/O allows direct interfacing to 2.5 V and 3.3 V line-card ASICs without level shifters. The 160 MHz internal frequency comfortably supports E1/T1 and lower-rate Ethernet aggregation paths. Designers must add the JTAG configuration header and adhere to the recommended PLL analog supply decoupling for jitter-sensitive TDM clocks. Note that new designs should target Altera Cyclone IV GX or newer families for lifecycle support.
Được đề xuất
Legacy PCI / PCI-X Bridge and I/O Expansion
The EP20K60EFC324-2 is widely deployed in legacy PCI and PCI-X bridge designs where it implements bus arbitration, target logic, and I/O expansion behind a PCI-to-Local-Bus controller. With 2,560 logic elements it can host a 32-bit/33 MHz target state machine plus scatter-gather DMA descriptor handling, and its 32 Kb of distributed RAM supports small transaction FIFOs. The 196 I/Os accommodate the 32-bit data bus plus full control/address plus secondary local-bus expansion. Engineers can drop in EP20K60EFC324-1 or -1X for tighter timing on 66 MHz PCI-X. Migration to modern PCIe requires a Cyclone IV GX or Stratix family redesign - not a drop-in swap.
Được đề xuất
Aerospace and Defense Subsystem Controllers
Long-life aerospace and defense programs frequently retain APEX-20KE designs because the original components are still supported by authorized aftermarket distributors like Rochester Electronics. The EP20K60EFC324-2 provides deterministic logic for subsystem controllers, MIL-STD-1553 or ARINC 429 interface wrappers, and built-in test (BIT) sequencers. Its 324-FBGA package suits high-density rad-tolerant board layouts, and the embedded block RAM implements command/response buffers without external SRAM. For programs requiring extended screening, EP20K60EFC324-2X is the pin-compatible extended variant. Lifecycle risk is managed via authorized stock and long-term purchase agreements.
Được đề xuất
Embedded Control and Protocol Offload
Embedded systems use the EP20K60EFC324-2 to offload custom protocols (I2C/SPI expansion, UART aggregation, sensor front-end pre-processing) from the main MCU, freeing CPU cycles for application code. Its 162,000 gates and 32 Kb block RAM support multi-channel protocol state machines plus data-rate buffering. The 1.8 V core integrates cleanly with modern low-power MCU rails, and the 196 user I/Os allow direct connection to many sensor buses. Designers typically pair the FPGA with a small flash for configuration storage and use passive JTAG for in-system updates. For new designs consider MAX 10 as a more modern, non-volatile alternative.
Được đề xuất
Test and Measurement Instrumentation Front-End
Test and measurement chassis historically leveraged the EP20K60EFC324-2 as a flexible front-end for instrumentation switching matrices, pattern generation, and timing control. Its 2,560 logic elements support scan-list sequencers and trigger logic, while 32 Kb of RAM holds capture buffers and pattern templates. The 196 I/Os allow direct fan-out to multi-channel ADC front-ends and relay drivers. The 160 MHz internal frequency is adequate for moderate-rate pattern generation; faster designs should use EP20K60EFC324-1 or -1X. Newer instruments should target Cyclone IV E or Cyclone V for longer-term support and lower power.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP20K60EFC324-2 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP20K60EFC324-2X | EP20K60EFC324-1X | EP20K60EFC324-1 | EP20K60EFC324 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) | 324-FBGA (19x19) | 324-FBGA (19x19) | 324-FBGA (19x19) |
| Speed Grade | -2 | -2X (extended) | -1X (faster, extended) | -1 (faster) | default |
| Number of Logic Elements | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 |
| Total RAM Bits | 32,768 | 32,768 | 32,768 | 32,768 | 32,768 |
| Number of User I/Os | 196 | 196 | 196 | 196 | 196 |
| Core Voltage | 1.71-1.89 V | 1.71-1.89 V | 1.71-1.89 V | 1.71-1.89 V | 1.71-1.89 V |
| Operating Temperature | 0 C to 85 C | Extended variant | Extended variant | 0 C to 85 C | 0 C to 85 C |
Bảo phân biệt quan trọng
- Mid-band -2 speed grade offers the best cost/timing balance for typical backplane and glue-logic designs (vsEP20K60EFC324-1)
- Standard commercial 0-85 C rating covers the majority of indoor industrial and telecom environments (vsEP20K60EFC324-2X)
- 196 I/Os and 32 Kb block RAM in a 324-FBGA provide high logic density without moving to larger packages (vsEP20K30EFC324-2X)
Ghi chú thiết kế
The EP20K60EFC324-2 requires a clean 1.71-1.89 V (1.8 V nominal) VCCINT rail plus per-bank VCCIO supplies for MultiVolt I/O. Decouple each VCCINT ball with a 0.1 uF ceramic plus 10 uF bulk, and place the bulk capacitor within 5 mm of the package. The PLL analog supply (VCCA_PLL) must be filtered with a ferrite bead and decoupled per the APEX-20KE reference design; sharing VCCA_PLL with digital VCCINT will introduce jitter on clock networks. Power sequencing: bring up VCCINT first, then VCCIO, to avoid I/O latch-up.
The 324-FBGA 19x19 mm package requires a microvia or via-in-pad PCB stack-up to fan out the inner balls. Use 0.5 mm or 0.8 mm ball pitch-compatible land patterns per the APEX-20KE handbook. Ground and VCCINT balls should be stitched with vias directly to inner planes to minimize spreading inductance. Keep JTAG traces (TDI, TMS, TCK, TDO) short and length-matched; route nCONFIG and nSTATUS away from high-frequency switching nets to avoid false configuration events.
Do not assume EP20K60EFC324-2 is drop-in for any newer Altera/Intel FPGA - the configuration scheme is APEX-20KE specific (PS bitstream, not Cyclone/Stratix). Always verify the Quartus version supports the APEX-20KE device family before designing. Unused I/O pins must be set per the Quartus pin-fitter output; leaving them floating can cause shoot-through current on output buffers. Confirm distributor stock and authorized source (Rochester Electronics) before placing volume orders - the part is NRND and gray-market supply is common.
Thông tin tuân thủ
Compliance data not present in the verified web sources. Request CoC from the distributor (Rochester Electronics, Heisener) for RoHS/REACH status. AEC-Q100 not applicable - this is a commercial/industrial grade FPGA, not an automotive qualified part.
