EP20K60EFC324-2 - APEX-20KE 60K FPGA 324-BGA | Altera / Intel
부품 번호: EP20K60EFC324-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $72.1 | $72.10 |
| 10 | $65 | $650.00 |
| 100 | $56.5 | $5,650.00 |
| 500 | $48.2 | $24,100.00 |
| 1,000 | $41.75 | $41,750.00 |
EP20K60EFC324-2 개요
An FPGA is a programmable logic device (PLD) that combines the flexibility of software-configurable logic with the performance of dedicated silicon. It sits at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. APEX-20KE introduced MultiCore architecture integrating look-up tables, product-term logic, and embedded memory on a single die, enabling the industry's first true system-on-a-programmable-chip (SOPC) integration at the time of launch.
Key features include 196 user I/Os, 256 LABs/CLBs, 32 Kb of distributed RAM, hot-socketing support, MultiVolt I/O for interfacing across mixed-voltage rails, and Altera's Quartus design flow compatibility. The -2 speed grade places it in the mid-band of APEX-20KE, balancing timing margin against cost.
The device is built on a 0.18 um CMOS process with multi-layer routing and embedded array blocks (EABs) used for memory, DSP-style operations, and wide fan-in functions. The high gate count and embedded block memory make it suitable for bus bridging, glue logic consolidation, and protocol offload rather than high-end DSP or GPU workloads.
Typical applications include industrial control and factory automation backplanes, telecom line-card glue logic, military/aerospace control subsystems, legacy PCI/PCI-X bridges, and embedded control systems where moderate logic density and 196 I/Os are required. The 324-FBGA package supports high-density board layouts.
When designing with EP20K60EFC324-2, account for its legacy 1.8 V core supply and ensure the host PCB supports JTAG configuration via the dedicated configuration pins. The part is now in mature / last-time-buy territory - confirm lifecycle status before committing to new designs.
This page synthesizes distributor pricing from Heisener, Rochester Electronics and Octopart, drop-in alternatives within the APEX-20KE family, and practical design notes not consolidated in the original datasheet.
드롭인 대체품: EP20K60EFC324-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K60EFC324-2 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package / Case, Series, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K60EFC324-2X
✅ 드롭인✓ 재고 있음
$195.5 / 개
데이터시트 보기 →EP20K60EFC324-1X
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP20K60EFC324-1
✅ 드롭인✓ 재고 있음
$76.5 / 개
데이터시트 보기 →EP20K60EFC324-1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$76.5 / 개
데이터시트 보기 →EP20K60EFC324-2 최대 정격 & 전기적 특성
| Series | APEX-20KE |
| Product Type | FPGA (Field Programmable Gate Array) |
| Number of Logic Elements / Cells | 2,560 |
| Number of LABs / CLBs | 2,560 |
| Number of Gates | 162,000 |
| Total RAM Bits | 32,768 |
| Number of User I/Os | 196 |
| Core Voltage - Supply | 1.71 V to 1.89 V |
| Internal Frequency (max) | 160 MHz |
| Propagation Delay | 1.72 ns |
| Logic Family | CMOS |
| 동작 온도 | 0 C to 85 C |
| 실장 유형 | Surface Mount |
| 패키지 / 케이스 | 324-BGA |
| Supplier Device Package | 324-FBGA (19x19) |
| Speed Grade | -2 |
EP20K60EFC324-2 핀 구성
| 핀 A1 | I/O — User I/O - bank assignment per datasheet |
| 핀 A2 | I/O — User I/O |
| 핀 A3 | I/O — User I/O |
| 핀 B1 | I/O — User I/O |
| 핀 B2 | I/O — User I/O |
| 핀 B3 | VCCINT — Core supply 1.8 V |
| 핀 C1 | GND — Ground |
| 핀 C2 | VCCIO — I/O supply (bank) |
| 핀 C3 | I/O — User I/O |
| 핀 D1 | I/O — User I/O |
| 핀 D2 | TDI — JTAG Test Data In |
| 핀 D3 | TCK — JTAG Test Clock |
| 핀 E1 | TMS — JTAG Test Mode Select |
| 핀 E2 | TDO — JTAG Test Data Out |
| 핀 E3 | nCONFIG — Configuration control (active low) |
| 핀 F1 | DCLK — Configuration clock |
| 핀 F2 | DATA0 — Configuration data input |
| 핀 F3 | nSTATUS — Configuration status (active low) |
| 핀 G1 | CONF_DONE — Configuration done indicator |
| 핀 G2 | I/O — User I/O |
| 핀 G3 | I/O — User I/O |
| 핀 H1 | I/O — User I/O |
| 핀 H2 | VCCINT — Core supply 1.8 V |
| 핀 H3 | GND — Ground |
| 핀 J1 | I/O — User I/O |
| 핀 J2 | I/O — User I/O |
| 핀 J3 | I/O — User I/O |
| 핀 K1 | GND — Ground |
| 핀 K2 | VCCIO — I/O supply (bank) |
| 핀 K3 | I/O — User I/O |
| 핀 L1 | I/O — User I/O |
| 핀 L2 | I/O — User I/O |
| 핀 L3 | I/O — User I/O |
일반적인 애플리케이션
EP20K60EFC324-2 적합 용도: 6 애플리케이션s: Industrial Control and Factory Automation Backplanes, Telecom Line-Card Glue Logic, Legacy PCI / PCI-X Bridge and I/O Expansion, Aerospace and Defense Subsystem Controllers, Embedded Control and Protocol Offload, Test and Measurement Instrumentation Front-End.
Industrial Control and Factory Automation Backplanes
The EP20K60EFC324-2's 196 user I/Os and 2,560 logic elements make it a strong fit for industrial backplane glue logic, where it consolidates discrete 74-series logic and small PLDs into a single programmable device. Its 162,000 system gates and 32 Kb of embedded RAM are sufficient to handle PLC scan scheduling, motor-control sequencing, and protocol framing for Modbus, Profibus, or CANopen segments. The commercial 0-85 C temperature rating is adequate for enclosed control cabinets. The 324-FBGA footprint supports high-density routing required when aggregating multiple field-bus interfaces on one board. Trade-off: APEX-20KE is NRND, so plan a migration to Cyclone IV E or MAX 10 for new programs while continuing to use this part for installed-base spares.
추천
Telecom Line-Card Glue Logic
Telecom line cards have historically relied on APEX-20KE for protocol bridging, TDM bus aggregation, and timing-slice manipulation. The EP20K60EFC324-2 supplies 32 Kb of block RAM to absorb small FIFO/payload buffers and 256 LABs/CLBs for state-machine heavy HDLC or PPP framing. The 1.8 V core plus MultiVolt I/O allows direct interfacing to 2.5 V and 3.3 V line-card ASICs without level shifters. The 160 MHz internal frequency comfortably supports E1/T1 and lower-rate Ethernet aggregation paths. Designers must add the JTAG configuration header and adhere to the recommended PLL analog supply decoupling for jitter-sensitive TDM clocks. Note that new designs should target Altera Cyclone IV GX or newer families for lifecycle support.
추천
Legacy PCI / PCI-X Bridge and I/O Expansion
The EP20K60EFC324-2 is widely deployed in legacy PCI and PCI-X bridge designs where it implements bus arbitration, target logic, and I/O expansion behind a PCI-to-Local-Bus controller. With 2,560 logic elements it can host a 32-bit/33 MHz target state machine plus scatter-gather DMA descriptor handling, and its 32 Kb of distributed RAM supports small transaction FIFOs. The 196 I/Os accommodate the 32-bit data bus plus full control/address plus secondary local-bus expansion. Engineers can drop in EP20K60EFC324-1 or -1X for tighter timing on 66 MHz PCI-X. Migration to modern PCIe requires a Cyclone IV GX or Stratix family redesign - not a drop-in swap.
추천
Aerospace and Defense Subsystem Controllers
Long-life aerospace and defense programs frequently retain APEX-20KE designs because the original components are still supported by authorized aftermarket distributors like Rochester Electronics. The EP20K60EFC324-2 provides deterministic logic for subsystem controllers, MIL-STD-1553 or ARINC 429 interface wrappers, and built-in test (BIT) sequencers. Its 324-FBGA package suits high-density rad-tolerant board layouts, and the embedded block RAM implements command/response buffers without external SRAM. For programs requiring extended screening, EP20K60EFC324-2X is the pin-compatible extended variant. Lifecycle risk is managed via authorized stock and long-term purchase agreements.
추천
Embedded Control and Protocol Offload
Embedded systems use the EP20K60EFC324-2 to offload custom protocols (I2C/SPI expansion, UART aggregation, sensor front-end pre-processing) from the main MCU, freeing CPU cycles for application code. Its 162,000 gates and 32 Kb block RAM support multi-channel protocol state machines plus data-rate buffering. The 1.8 V core integrates cleanly with modern low-power MCU rails, and the 196 user I/Os allow direct connection to many sensor buses. Designers typically pair the FPGA with a small flash for configuration storage and use passive JTAG for in-system updates. For new designs consider MAX 10 as a more modern, non-volatile alternative.
추천
Test and Measurement Instrumentation Front-End
Test and measurement chassis historically leveraged the EP20K60EFC324-2 as a flexible front-end for instrumentation switching matrices, pattern generation, and timing control. Its 2,560 logic elements support scan-list sequencers and trigger logic, while 32 Kb of RAM holds capture buffers and pattern templates. The 196 I/Os allow direct fan-out to multi-channel ADC front-ends and relay drivers. The 160 MHz internal frequency is adequate for moderate-rate pattern generation; faster designs should use EP20K60EFC324-1 or -1X. Newer instruments should target Cyclone IV E or Cyclone V for longer-term support and lower power.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K60EFC324-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K60EFC324-2X | EP20K60EFC324-1X | EP20K60EFC324-1 | EP20K60EFC324 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) | 324-FBGA (19x19) | 324-FBGA (19x19) | 324-FBGA (19x19) |
| Speed Grade | -2 | -2X (extended) | -1X (faster, extended) | -1 (faster) | default |
| Number of Logic Elements | 2,560 | 2,560 | 2,560 | 2,560 | 2,560 |
| Total RAM Bits | 32,768 | 32,768 | 32,768 | 32,768 | 32,768 |
| Number of User I/Os | 196 | 196 | 196 | 196 | 196 |
| Core Voltage | 1.71-1.89 V | 1.71-1.89 V | 1.71-1.89 V | 1.71-1.89 V | 1.71-1.89 V |
| Operating Temperature | 0 C to 85 C | Extended variant | Extended variant | 0 C to 85 C | 0 C to 85 C |
주요 차별점
- Mid-band -2 speed grade offers the best cost/timing balance for typical backplane and glue-logic designs (vs EP20K60EFC324-1)
- Standard commercial 0-85 C rating covers the majority of indoor industrial and telecom environments (vs EP20K60EFC324-2X)
- 196 I/Os and 32 Kb block RAM in a 324-FBGA provide high logic density without moving to larger packages (vs EP20K30EFC324-2X)
설계 노트
The EP20K60EFC324-2 requires a clean 1.71-1.89 V (1.8 V nominal) VCCINT rail plus per-bank VCCIO supplies for MultiVolt I/O. Decouple each VCCINT ball with a 0.1 uF ceramic plus 10 uF bulk, and place the bulk capacitor within 5 mm of the package. The PLL analog supply (VCCA_PLL) must be filtered with a ferrite bead and decoupled per the APEX-20KE reference design; sharing VCCA_PLL with digital VCCINT will introduce jitter on clock networks. Power sequencing: bring up VCCINT first, then VCCIO, to avoid I/O latch-up.
The 324-FBGA 19x19 mm package requires a microvia or via-in-pad PCB stack-up to fan out the inner balls. Use 0.5 mm or 0.8 mm ball pitch-compatible land patterns per the APEX-20KE handbook. Ground and VCCINT balls should be stitched with vias directly to inner planes to minimize spreading inductance. Keep JTAG traces (TDI, TMS, TCK, TDO) short and length-matched; route nCONFIG and nSTATUS away from high-frequency switching nets to avoid false configuration events.
Do not assume EP20K60EFC324-2 is drop-in for any newer Altera/Intel FPGA - the configuration scheme is APEX-20KE specific (PS bitstream, not Cyclone/Stratix). Always verify the Quartus version supports the APEX-20KE device family before designing. Unused I/O pins must be set per the Quartus pin-fitter output; leaving them floating can cause shoot-through current on output buffers. Confirm distributor stock and authorized source (Rochester Electronics) before placing volume orders - the part is NRND and gray-market supply is common.
규정 준수 정보
Compliance data not present in the verified web sources. Request CoC from the distributor (Rochester Electronics, Heisener) for RoHS/REACH status. AEC-Q100 not applicable - this is a commercial/industrial grade FPGA, not an automotive qualified part.
