EP2A40F672C7N - APEX II FPGA 1.5M Gates 672-BGA | Intel
MPN: EP2A40F672C7N ✗ Cuối đờiEP2A40F672C7N Tóm tắt
What is a high-density FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and dedicated hardware blocks such as block RAM, DSP slices, PLLs, and high-speed transceivers. APEX II sits in the high-density tier of the taxonomy: FPGA -> programmable logic device (PLD) -> programmable logic IC -> integrated circuit. APEX II was engineered for systems that combine glue logic, datapath arithmetic, on-chip memory, and high-speed serial I/O on a single silicon die, replacing multiple discrete ASICs and reducing BOM cost and board area.
Key features of the EP2A40F672C7N include 38,400 logic elements, 1.5 M system gates, 492 user I/Os, 1.55 ns propagation delay, 562 MHz internal performance, MultiVolt I/O support for interfacing with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic families, and a 0.15-µm copper CMOS process. The 'C7' speed grade denotes the commercial temperature range 0 °C to 85 °C with a specific timing closure. The 'N' suffix indicates a lead-free, RoHS-compliant FC-FBGA package. The device supports in-system configuration via passive serial, passive parallel, and JTAG modes, allowing rapid prototyping and field upgrades.
Typical applications for the EP2A40F672C7N include 1 Gbps+ networking line cards, custom datapath accelerators, telecommunications backplanes, broadband aggregation, DSP co-processing, and legacy ASIC replacement in telecommunications and storage infrastructure. The large gate count and abundant I/O make it well suited to designs that previously required multiple smaller FPGAs. The MultiVolt I/O simplifies interfacing with legacy 5 V ASICs, memory, and bus transceivers.
When designing with the EP2A40F672C7N, ensure the 672-ball FC-FBGA land pattern is matched exactly - this is a 27 x 27 mm, 1.0 mm pitch FineLine BGA that requires PCB microvia stackups and controlled-impedance routing. Decoupling must follow the manufacturer reference design, and unused I/O banks should be configured as outputs driving '0' or tied to defined logic levels. This page synthesizes distributor pricing, pin-compatible APEX II family drop-ins, and practical design notes not found in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP2A40F672C7N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2A40F672C7N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Operating Temperature, Logic Elements.
EP2A40F672C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A40F672C7ES
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A40F672C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A40F672C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A25F672C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP20K600CF672C7N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A40F672C7N Tỷ lệ tối đa & tính chất điện
| Family | APEX II |
| Logic Elements / Cells | 38,400 |
| System Gates | 1.5 M |
| Maximum User I/Os | 492 |
| Propagation Delay (tpd) | 1.55 ns |
| Internal Performance | 562 MHz |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Logic Family | CMOS |
| Hộp | 672-ball FC-FBGA (FineLine BGA), S-PBGA-B672, 27 x 27 mm, 1.0 mm pitch |
| Kiểu lắp đặt | Surface Mount |
| Nhiệt độ hoạt động | 0 °C to 85 °C (commercial, 'C' grade) |
| Speed Grade | 7 |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG |
Cấu hình chân EP2A40F672C7N
| Chân A1 | I/O BANK 1 — User I/O, MultiVolt (1.5 V - 5.0 V); see datasheet ball map for exact signal |
| Chân A2 | I/O BANK 1 — User I/O, MultiVolt (1.5 V - 5.0 V) |
| Chân AB26 | GND — Ground reference |
| Chân AB25 | VCCINT — 1.5 V core supply |
| Chân AB1 | TCK — JTAG Test Clock |
| Chân AB2 | TMS — JTAG Test Mode Select |
| Chân B1 | TDI — JTAG Test Data In |
| Chân B2 | TDO — JTAG Test Data Out |
| Chân C1 | MSEL0 — Configuration mode select bit 0 |
| Chân C2 | MSEL1 — Configuration mode select bit 1 |
| Chân D1 | nCONFIG — Configuration start (active low) |
| Chân D2 | nSTATUS — Configuration status (active low) |
| Chân NC | NC — Not connected (per datasheet) |
| Chân TH1 | Thermal pad — Die thermal pad - solder to PCB thermal vias (per reference design) |
Ứng dụng tiêu biểu
EP2A40F672C7N phù hợp cho 6 Áp dụngs: 1 Gbps+ Networking Line Card, Telecommunications Backplane Aggregation, DSP Co-Processor / Datapath Accelerator, Legacy ASIC Replacement, Industrial Storage Controller (RAID / SATA / FC), Broadband Aggregation / DSLAM Line Card.
1 Gbps+ Networking Line Card
The EP2A40F672C7N's 1.5 M system gates and 492 user I/Os make it well suited for 1 Gbps+ networking line cards where multiple SERDES channels, traffic managers, and lookup engines must coexist on a single FPGA. Per the APEX II datasheet, MultiVolt I/O banks support direct connection to 3.3 V and 5 V PHY devices, removing level shifters and reducing BOM cost. The 562 MHz internal performance provides margin for packet-processing pipelines at wire speed, while the 1.55 ns propagation delay supports tight timing closure on critical bus paths. In a typical line-card design, the EP2A40F672C7N sits between PHY/MAC devices and the switch fabric ASIC.
Được đề xuất
Telecommunications Backplane Aggregation
Telecommunications backplane aggregation systems need high gate counts and abundant I/O to consolidate multiple tributary interfaces (E1/T1, DS3, OC-3/12) onto a single fabric. The EP2A40F672C7N delivers 1.5 M system gates sufficient to implement framer, mapper, and pointer-processing functions in one device, reducing board area and the inter-chip latency that arises when splitting logic across two FPGAs. The MultiVolt I/O support (1.5 V to 5.0 V) enables direct interface to legacy telecom ASICs and framers. Designers should plan thermal management carefully - the 672-ball FC-FBGA dissipates notable power under full I/O switching.
Được đề xuất
DSP Co-Processor / Datapath Accelerator
DSP co-processing designs - such as custom FIR filters, FFT engines, and baseband processing - benefit from the EP2A40F672C7N's high logic density and dedicated routing resources. Per the APEX II datasheet, the device offers efficient hardware multipliers in its logic element structure and a routing fabric tuned for datapath arithmetic. At 562 MHz internal performance, multi-tap FIR filters can be realized with comfortable timing margin. The 492 user I/Os accommodate parallel data paths to host DSPs and ADCs/DACs. The 672-ball FC-FBGA package, while complex to assemble, provides the signal integrity required for high-speed parallel buses.
Được đề xuất
Legacy ASIC Replacement
When an end-of-life ASIC must be replaced with a programmable equivalent, the EP2A40F672C7N is often selected because it provides gate-count and I/O-count headroom to absorb the legacy logic plus a margin of growth. The MultiVolt I/O (1.5 V to 5.0 V) preserves the ASIC's original bus levels, eliminating PCB rework. Designers can implement the original ASIC's register-transfer logic in Verilog or VHDL and synthesize into the APEX II using the Quartus II toolchain. The lead-free 'N' suffix variant supports EU-market products. Note: APEX II is in NRND status, so designers should plan a second-source migration to Cyclone IV/V for long-term supply.
Được đề xuất
Industrial Storage Controller (RAID / SATA / FC)
Storage controllers - RAID engines, SATA multipliers, and Fibre Channel arbitrated loop controllers - require abundant parallel I/O and deterministic timing. The EP2A40F672C7N provides 492 user I/Os sufficient to interface multiple SATA PHYs or FC transceivers simultaneously, with 1.55 ns propagation delay supporting tight command-pipeline timing. The 1.5 V core reduces power dissipation versus older 2.5 V FPGAs, helping thermal budgets in dense storage chassis. The 27 x 27 mm FC-FBGA integrates well into standard storage controller card form factors. Designers must follow the manufacturer's reference layout for the FC-FBGA thermal pad.
Được đề xuất
Broadband Aggregation / DSLAM Line Card
DSLAM and broadband aggregation line cards aggregate hundreds of subscriber lines and require high gate counts to implement channel processing, interleaving, and framing. The EP2A40F672C7N's 1.5 M system gates accommodate per-channel DSP plus aggregation fabric in a single device, reducing board complexity. The MultiVolt I/O (1.5 V to 5.0 V) interfaces cleanly with line-driver ASICs at 3.3 V and 5.0 V. The 672-ball FC-FBGA supports controlled-impedance routing required for high-speed upstream aggregation buses. Designers should plan for thermal dissipation - full gate utilization on a 27 x 27 mm FC-FBGA typically requires thermal vias and airflow.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2A40F672C7N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2A40F672C7 | EP2A40F672C7ES | EP2A40F672C6N | EP2A40F672C6 | EP2A25F672C7N | EP20K600CF672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FC-FBGA (S-PBGA-B672), 27 x 27 mm, 1.0 mm pitch | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.0 M | 1.0 M (APEX 20KE family) |
| Logic Cells / Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 24,160 | 24,320 |
| Maximum User I/Os | 492 | 492 | 492 | 492 | 492 | 492 | 488 |
| Propagation Delay (tpd) | 1.55 ns | 1.55 ns | 1.55 ns | 1.25 ns (faster grade) | 1.25 ns (faster grade) | 1.55 ns | 1.2 ns (APEX 20KE) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.8 V (APEX 20KE) |
| Speed Grade | 7 | 7 | 7 | 6 (faster) | 6 (faster) | 7 | 7 |
| Operating Temperature | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) | 0 to 85 °C (commercial) |
| Lead-Free / RoHS | Yes (N suffix) | No (lead-bearing) | Yes | Yes | No | Yes | Yes |
Bảo phân biệt quan trọng
- Highest logic density in APEX II 672-BGA family (vsEP2A25F672C7N)
- Lead-free / RoHS compliant (vsEP2A40F672C7)
- MultiVolt I/O supporting 5 V interface (vsEP20K600CF672C7N (APEX 20KE))
Ghi chú thiết kế
Estimated: at full I/O switching on a 27 x 27 mm FC-FBGA, the EP2A40F672C7N dissipates 3-5 W typical. The 672-ball FC-FBGA requires a thermal pad on the underside soldered to a PCB thermal via array (8-16 vias minimum). At 85 °C ambient commercial operation, junction temperature can approach 100 °C under worst-case utilization - follow the APEX II device handbook thermal management chapter and provide at least 4-layer PCB with internal ground/power planes.
The 672-ball FC-FBGA requires a 1.0 mm pitch land pattern with laser-drilled or mechanically drilled microvias in the BGA escape region. Per the APEX II device handbook, designers should use a 4-6 layer stackup with continuous ground planes beneath the device for controlled-impedance routing and return-path integrity. Decoupling: 0.1 µF ceramic + 10 µF bulk per VCCIO bank, plus 470 µF low-ESR bulk on VCCINT. Series termination on high-speed outputs (33 Ω to 50 Ω) is recommended per reference design.
Three common pitfalls on the EP2A40F672C7N: (1) Do not leave I/O pins floating - configure as outputs driving '0' or tie to defined logic level to avoid crowbar current. (2) MSELn pins must be set correctly for the chosen configuration mode - the '7' speed grade and MultiVolt I/O bank voltages must both match the application. (3) The N suffix denotes lead-free; substituting EP2A40F672C7 (lead-bearing) requires reflow profile adjustment above 220 °C peak. Failure to follow the APEX II configuration handbook leads to JTAG chain errors or incomplete configuration.
For MultiVolt I/O banks on the EP2A40F672C7N, group same-voltage I/O together and place bank VCCIO pins adjacent to their respective I/O signals. Per the device handbook, keep VCCIO and VCCINT power planes isolated with ferrite beads or short traces. High-speed differential pairs (LVDS, LVPECL) must maintain 100 Ω differential impedance with matched lengths within 150 mil. Place configuration EPROM (EPC2/EPC4) within 2 inches of nCONFIG/nSTATUS for reliable passive-serial configuration.
Signal integrity on the EP2A40F672C7N FC-FBGA is dominated by the FC-BGA escape routing and the power-plane cavity resonance around 200-400 MHz. Per APEX II signal-integrity guidelines, stitch the ground planes with 50-100 mil stitching vias around the BGA perimeter to suppress cavity modes. Use IBIS models (available from Intel/Altera legacy support) for SI simulation of 66 MHz and 100 MHz parallel buses. Series-damping resistors (10-22 Ω) on high-drive outputs reduce SSO ground bounce.
Thông tin tuân thủ
RoHS compliant per 'N' suffix. AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free and conflict-minerals status not explicitly stated in the verified web data - set to unknown.
