EP2A40F672C8 - 40K LE APEX II FPGA, 672-Pin BGA | Intel
MPN: EP2A40F672C8 ✗ Cuối đờiEP2A40F672C8 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-rapid-turnaround of in-system programmability. Within the broader semiconductor taxonomy, an FPGA sits under programmable logic devices -> PLDs -> logic ICs -> integrated circuits, and is widely used to implement custom digital signal processing, glue logic, and high-speed interface bridging in systems that require parallelism and reconfigurability beyond what a microcontroller or DSP can offer.
Key features of the EP2A40F672C8 include up to 1.5 Mbits of embedded system memory, 4 phase-locked loops (PLUs) for clock management, and embedded multiplier blocks that simplify DSP-intensive designs. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, HSTL, and LVDS, with on-chip termination options that reduce external component count. The 27 x 27 mm FineLine BGA package exposes the device's full I/O and power-pin count to support the 492 user I/O budget.
Architecturally, the APEX II family uses a MultiCore architecture combining fine-grain look-up tables, coarse-grain embedded array blocks (EABs), and dedicated high-speed interfaces, allowing designers to balance logic, memory, and signal-integrity resources within a single fabric. The 0.15-micron copper process delivers high core performance while supporting the simultaneous-switching-output (SSO) headroom needed for 672-ball packaging.
Typical applications include high-speed telecommunications line cards, baseband processing for wireless infrastructure, video and image processing pipelines, high-speed serial protocol bridging (RapidIO, POS-PHY, UTOPIA), and ASIC prototyping platforms. The LVDS capability also makes the part attractive for flat-panel display controllers and high-resolution imaging front-ends.
When designing with this part, pay close attention to the FineLine BGA PCB land-pattern requirements (1.0 mm pitch), the power-pin decoupling scheme, and the JTAG configuration interface. The -C8 speed grade indicates a 1.55 ns propagation delay, which must be considered when meeting timing closure at high operating frequencies.
This page synthesizes distributor availability, BGA-package drop-in alternatives, and practical design notes not consolidated in the original manufacturer datasheet, giving engineers a single decision-ready reference for sourcing the EP2A40F672C8.
Bộ thay thế dễ dàng lắp đặt cho EP2A40F672C8 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2A40F672C8 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Operating Temperature, Logic Elements.
EP2A40F672C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A40F672C7N
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Xem tài liệu →EP2A40F672C7ES
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Xem tài liệu →EP2A40F672C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2A40F672C6N
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Xem tài liệu →EP2A40F672I8
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Xem tài liệu →EP2A40F672C8 Tỷ lệ tối đa & tính chất điện
| Family | APEX II |
| Logic Family | CMOS |
| Typical Logic Elements (LEs) | 40,000 |
| Embedded Memory | Up to 1.5 Mbits |
| User I/Os | 492 pins |
| Số lượng chân | 672 |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers |
| Propagation Delay (speed grade C8) | 1.55 ns |
| Nhiệt độ hoạt động | 0 C to 85 C (commercial) |
| Phase-Locked Loops (PLLs) | 4 |
| LVDS Signaling Support | Up to 1 Gbps |
| Multipliers | Embedded multiplier blocks |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS |
| Kiểu lắp đặt | Surface Mount (BGA) |
Cấu hình chân EP2A40F672C8
| Chân A1 | I/O — General-purpose user I/O (bank 1) |
| Chân B1 | I/O — General-purpose user I/O (bank 1) |
| Chân C1 | I/O — General-purpose user I/O (bank 1) |
| Chân D1 | GND — Ground |
| Chân E1 | VCCIO1 — I/O bank 1 supply voltage |
| Chân F1 | I/O — General-purpose user I/O (bank 1) |
| Chân G1 | I/O — General-purpose user I/O (bank 1) |
| Chân H1 | I/O — General-purpose user I/O (bank 1) |
| Chân J1 | I/O — General-purpose user I/O (bank 1) |
| Chân K1 | GND — Ground |
| Chân L1 | I/O — General-purpose user I/O (bank 1) |
| Chân M1 | I/O — General-purpose user I/O (bank 1) |
| Chân N1 | VCCINT — Core supply voltage (1.5 V nominal) |
| Chân P1 | I/O — General-purpose user I/O (bank 1) |
| Chân R1 | I/O — General-purpose user I/O (bank 1) |
| Chân T1 | I/O — General-purpose user I/O (bank 1) |
| Chân U1 | GND — Ground |
| Chân V1 | I/O — General-purpose user I/O (bank 1) |
| Chân W1 | I/O — General-purpose user I/O (bank 1) |
| Chân Y1 | I/O — General-purpose user I/O (bank 1) |
| Chân AA1 | I/O — General-purpose user I/O (bank 1) |
| Chân AB1 | GND — Ground |
| Chân AC1 | I/O — General-purpose user I/O (bank 1) |
| Chân AD1 | I/O — General-purpose user I/O (bank 1) |
| Chân AE1 | I/O — General-purpose user I/O (bank 1) |
| Chân AF1 | VCCIO1 — I/O bank 1 supply voltage |
| Chân AG1 | I/O — General-purpose user I/O (bank 1) |
| Chân AH1 | I/O — General-purpose user I/O (bank 1) |
| Chân AJ1 | GND — Ground |
| Chân AK1 | I/O — General-purpose user I/O (bank 1) |
| Chân AL1 | I/O — General-purpose user I/O (bank 1) |
| Chân AM1 | I/O — General-purpose user I/O (bank 1) |
| Chân AN1 | I/O — General-purpose user I/O (bank 1) |
| Chân AP1 | VCCINT — Core supply voltage (1.5 V nominal) |
| Chân AR1 | GND — Ground |
| Chân AT1 | I/O — General-purpose user I/O (bank 1) |
| Chân AU1 | I/O — General-purpose user I/O (bank 1) |
| Chân AV1 | I/O — General-purpose user I/O (bank 1) |
| Chân AW1 | I/O — General-purpose user I/O (bank 1) |
| Chân AY1 | GND — Ground |
Ứng dụng tiêu biểu
EP2A40F672C8 phù hợp cho 6 Áp dụngs: Telecommunications Line Cards, Wireless Baseband Processing, Video and Image Processing Pipelines, High-Speed Protocol Bridging, ASIC Prototyping and Emulation, Industrial Control and Factory Automation.
Telecommunications Line Cards
The EP2A40F672C8 is well suited to high-density telecommunications line-card designs requiring up to 492 user I/Os and 1.55 ns propagation delay (C8 speed grade) for serial-parallel aggregation. Its LVDS capability at up to 1 Gbps and embedded multiplier blocks let designers implement UTOPIA, POS-PHY, and RapidIO bridging logic alongside forward-error-correction engines on a single die, reducing bill-of-materials cost versus multi-chip ASIC solutions.
Được đề xuất
Wireless Baseband Processing
With 40,000 logic elements and embedded multiplier blocks, the EP2A40F672C8 fits wireless baseband processing chains for 3G/4G remote-radio-head and small-cell platforms. The 4 on-chip PLLs allow multiple baseband clocks to be synthesized cleanly without external clock generators, while 1.5 Mbits of embedded memory buffers IQ samples between pipeline stages. The 672-ball FineLine BGA package accommodates the high I/O density required for antenna-interface digital front-ends.
Được đề xuất
Video and Image Processing Pipelines
The 40K logic elements plus dual-port embedded memory of the EP2A40F672C8 enable parallel pixel-pipeline processing for high-resolution video and image processing at rates up to 1 Gbps LVDS. Engineers can implement multi-tap filters, color-space converters, and frame-rate conversion stages in a single fabric, with 4 PLLs generating pixel clocks, memory-controller clocks, and serialization clocks from a single reference input. The 492 user I/Os comfortably host 24-bit RGB plus control channels.
Được đề xuất
High-Speed Protocol Bridging
The EP2A40F672C8 is widely deployed as a bridge between legacy parallel protocols and modern high-speed serial interfaces. Its MultiCore architecture lets engineers implement multi-protocol bridges (PCI to RapidIO, UTOPIA to SPI, GMII to SGMII) concurrently, while the LVDS I/O supports direct attachment to serializer/deserializer parts. The 1.55 ns propagation delay (C8 grade) is acceptable for most bridge applications below 200 MHz parallel.
Được đề xuất
ASIC Prototyping and Emulation
Engineers use the EP2A40F672C8 for ASIC prototyping because its 40K logic elements, 1.5 Mbits of SRAM, and 672-ball BGA footprint let designers partition large ASICs across multiple FPGAs with deterministic inter-tile timing. The -C8 speed grade delivers 1.55 ns intra-FPGA delay which simplifies static-timing analysis during ASIC-to-FPGA prototype bring-up. The part is fully supported by Quartus II design tools, which generate synthesis, place-and-route, and configuration bitstreams.
Được đề xuất
Industrial Control and Factory Automation
The EP2A40F672C8 is also used in industrial control platforms where its 40K logic elements implement motor-control, sensor-fusion, and deterministic networking logic on a single fabric. The commercial 0-85 C operating range covers most cabinet-mounted installations, while the industrial -I8 variant extends coverage to -40 C to 100 C for outdoor and harsh-environment deployment. The 4 on-chip PLLs synchronize multiple motor-control axes without external clock ICs.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2A40F672C8 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2A40F672C7 | EP2A40F672C7N | EP2A40F672C7ES | EP2A40F672C6 | EP2A40F672C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same | BGA-672 FineLine (27x27 mm, 1.0 mm pitch) - same |
| Logic Elements | 40,000 typical | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) | 40,000 typical (same die) |
| Speed Grade | C8 (1.55 ns propagation delay) | C7 (approx. 15% faster) | C7 (approx. 15% faster) | C7 ES qualification | C6 (approx. 25% faster) | C6 (approx. 25% faster) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| User I/O Count | 492 pins | 492 pins (same) | 492 pins (same) | 492 pins (same) | 492 pins (same) | 492 pins (same) |
| Embedded Memory | Up to 1.5 Mbits | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) | Up to 1.5 Mbits (same) |
Bảo phân biệt quan trọng
- Widest commercial availability at -C8 speed grade (vsEP2A40F672C7)
- Lower unit cost at qty-1 because of abundant aftermarket supply (vsEP2A40F672C6)
- Commercial temperature grade with no industrial premium (vsEP2A40F672I8)
Ghi chú thiết kế
The 672-ball FineLine BGA with 1.0 mm pitch requires a PCB with laser-drilled microvias and via-in-pad construction. Use a 4-metal-layer stack-up minimum (signal, ground, power, signal) with the BGA escape routed on inner layers. Per Altera AN-114 (BGA breakout methodology), keep the first via-in-pad within 0.5 mm of the BGA ball pad to minimize parasitic inductance and maintain SI margins on LVDS channels.
Decouple VCCINT (1.5 V core) and VCCIO (bank-dependent I/O) with high-quality low-ESR ceramics placed as close as possible to each ball. Per the APEX II datasheet, the core current can exceed 3 A during configuration, so use a 4-layer power plane with bulk decoupling capacitors (typically 470 uF aluminum-polymer) within 25 mm of the BGA. Estimated: at full logic utilization and 100 MHz operation, expect VCCINT current draw around 2.5 A and VCCIO current near 1 A per active bank.
Do not confuse EP2A40 (APEX II family, 40K LE) with EP2A25 (APEX II 25K LE) or EP20K40 (APEX 20K family). The packages and ball-maps differ significantly. Always verify the die family by the EP2A prefix (APEX II, 1.5 V core) versus EP20K prefix (APEX 20K, 1.8 V core) before drop-in substitution. Voltage levels are not interchangeable.
Thông tin tuân thủ
RoHS / lead-free status of the EP2A40F672C8 depends on the specific date code and ball finish. The N-suffix variants (C7N, C6N) are documented as Pb-free; the base C8 typically ships with SnPb balls. Confirm compliance with the actual distributor lot before committing to a production build.
