Intel

EP2AGX260FF35C5N - 244K LE Arria II GX FPGA | Intel | 1152-FBGA

Name: EP2AGX260FF35C5N - 244K LE Arria II GX FPGA | Intel | 1152-FBGA
Brand: Intel
SKU: EP2AGX260FF35C5N

MPN: EP2AGX260FF35C5N ✓ Hoạt động

0.9 V core (typical) Vdss 1152-FBGA (Flip-Chip BGA), 35x35 mm Package C5 Speed 12,038,144 Memory

Yêu cầu báo giá

MOQ: 1 |

Xem tài liệu kỹ thuật (PDF) Xem các bộ thay thế

Số lượng

EP2AGX260FF35C5N Tóm tắt

The Intel EP2AGX260FF35C5N is a high-density Arria II GX Field Programmable Gate Array (FPGA) delivering 244,188 logic elements, 12,038,144 bits of embedded memory, and 736 (18x18) hardware multipliers in a 1152-ball flip-chip BGA package. It integrates 612 user I/Os, 48 SERDES channels, and 8 phase-locked loops (PLLs) supporting transceiver rates up to 3.75 Gbps, enabling high-throughput serial connectivity for digital signal processing, video bridging, and high-speed data aggregation systems. The C5 speed grade and -40C to +85C operating temperature range target industrial-grade applications requiring deterministic timing closure.

What is an FPGA? A Field Programmable Gate Array is a semiconductor device containing programmable logic blocks, interconnect fabric, and I/O elements that engineers can configure after manufacture to implement custom digital circuits. FPGAs occupy a unique position in the silicon hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs), lower-latency than microprocessors for parallel workloads, and increasingly competitive with Graphics Processing Units (GPUs) for streaming compute tasks. The Arria II GX family specifically adds hardened multi-gigabit transceivers, positioning it for protocols such as PCIe Gen1, Serial RapidIO, Gbps Ethernet, and CPRI/OBSAI in wireless backhaul.

Key features include 10260 Logic Array Blocks (LABs), 4 fractional PLLs plus 4 general-purpose PLLs, dedicated DDR2/DDR3 memory controllers with hard PHY, and on-chip tri-speed Ethernet MACs. The 1152-pin FCBGA package uses Intel's flip-chip interconnect technology to deliver superior electrical performance and thermal dissipation for high-utilization designs.

The EP2AGX260FF35C5N uses a 40nm process node, balancing static power consumption with 8-input adaptive logic modules (ALMs) that deliver up to 1.7x the performance of previous-generation 6-input LUT architectures. The integrated transceiver block achieves jitter performance below 2 ps RMS, making the device suitable for synchronous Ethernet and SONET/SDH interfaces.

Typical applications include wireless baseband processing, military radar signal processing, medical imaging systems, high-definition video broadcast equipment, and ASIC prototyping platforms. The 48 transceiver channels support multiple CPRI links to remote radio heads in 4G LTE base stations, while the embedded memory bandwidth suits FFT engines for OFDM modulation/demodulation.

When designing with the EP2AGX260FF35C5N, designers must use Intel Quartus II (or the newer Quartus Prime) design software for synthesis, place-and-route, and timing analysis. The 1152-ball FCBGA package requires high-density PCB fabrication (typically 8-12 layers with microvia stack-ups) and assembly with BGA-grade SMT processes. Power estimation should account for the dynamic power of 48 high-speed transceivers running at full rate.

Bộ thay thế dễ dàng lắp đặt cho EP2AGX260FF35C5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2AGX260FF35C5N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Transceivers, Mounting Type.

EP2AGX190FF35C5G

Intel

Package: 1152-ball FC-FBGA (FF35)

Speed Grade: C5 (commercial, mid-performance)

Transceivers: 8 channels