EP2AGX260FF35C5N - 244K LE Arria II GX FPGA | Intel | 1152-FBGA
Teilenummer: EP2AGX260FF35C5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1780 | $17.800,00 |
| 100 | $1695 | $169.500,00 |
| 500 | $1620 | $810.000,00 |
| 1.000 | $1545 | $1.545.000,00 |
EP2AGX260FF35C5N Übersicht
What is an FPGA? A Field Programmable Gate Array is a semiconductor device containing programmable logic blocks, interconnect fabric, and I/O elements that engineers can configure after manufacture to implement custom digital circuits. FPGAs occupy a unique position in the silicon hierarchy: more flexible than Application-Specific Integrated Circuits (ASICs), lower-latency than microprocessors for parallel workloads, and increasingly competitive with Graphics Processing Units (GPUs) for streaming compute tasks. The Arria II GX family specifically adds hardened multi-gigabit transceivers, positioning it for protocols such as PCIe Gen1, Serial RapidIO, Gbps Ethernet, and CPRI/OBSAI in wireless backhaul.
Key features include 10260 Logic Array Blocks (LABs), 4 fractional PLLs plus 4 general-purpose PLLs, dedicated DDR2/DDR3 memory controllers with hard PHY, and on-chip tri-speed Ethernet MACs. The 1152-pin FCBGA package uses Intel's flip-chip interconnect technology to deliver superior electrical performance and thermal dissipation for high-utilization designs.
The EP2AGX260FF35C5N uses a 40nm process node, balancing static power consumption with 8-input adaptive logic modules (ALMs) that deliver up to 1.7x the performance of previous-generation 6-input LUT architectures. The integrated transceiver block achieves jitter performance below 2 ps RMS, making the device suitable for synchronous Ethernet and SONET/SDH interfaces.
Typical applications include wireless baseband processing, military radar signal processing, medical imaging systems, high-definition video broadcast equipment, and ASIC prototyping platforms. The 48 transceiver channels support multiple CPRI links to remote radio heads in 4G LTE base stations, while the embedded memory bandwidth suits FFT engines for OFDM modulation/demodulation.
When designing with the EP2AGX260FF35C5N, designers must use Intel Quartus II (or the newer Quartus Prime) design software for synthesis, place-and-route, and timing analysis. The 1152-ball FCBGA package requires high-density PCB fabrication (typically 8-12 layers with microvia stack-ups) and assembly with BGA-grade SMT processes. Power estimation should account for the dynamic power of 48 high-speed transceivers running at full rate.
Drop-in-Alternativen für EP2AGX260FF35C5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2AGX260FF35C5N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Transceivers, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2AGX260FF35C4N
✅ Drop-In✓ Auf Lager
$3125 / Stück
Datenblatt ansehen →EP2AGX260FF35C5G
✅ Drop-In✓ Auf Lager
$1395 / Stück
Datenblatt ansehen →EP2AGX260FF35C5
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2000 / Stück
Datenblatt ansehen →EP2AGX260FF35C4G
✅ Drop-In✓ Auf Lager
$1420 / Stück
Datenblatt ansehen →EP2AGX260FF35I5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1325 / Stück
Datenblatt ansehen →EP2AGX190FF35C5G
✅ Drop-In✓ Auf Lager
$1245 / Stück
Datenblatt ansehen →EP2AGX260FF35C5N Grenzwerte & elektrische Eigenschaften
| Device Type | FPGA - Field Programmable Gate Array |
| Family | Arria II GX |
| Logic Elements | 244,188 |
| Embedded Memory (bits) | 12,038,144 |
| Logic Array Blocks (LABs) | 10,260 |
| 18x18 Hardware Multipliers | 736 |
| User I/O Count | 612 |
| Transceiver Channels | 48 |
| Maximum Transceiver Data Rate | 3.75 Gbps |
| PLLs | 8 (4 fractional, 4 general-purpose) |
| Process Node | 40 nm |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Gehäuse | 1152-FBGA (Flip-Chip BGA), 35x35 mm |
| Montageart | Surface Mount |
| RoHS-Status | Lead Free (Compliant per data sheet) |
| Versorgungsspannung | 0.9 V core (typical) |
| Speed Grade | C5 |
EP2AGX260FF35C5N 1152-fbga (flip-chip bga), 35x35 mm Pinbelegungsleitfaden
Pinbelegung für EP2AGX260FF35C5N (1152-fbga (flip-chip bga), 35x35 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2AGX260FF35C5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2AGX260FF35C5N ist geeignet für 6 Anwendungs: Wireless Baseband Processing, High-Definition Video Broadcast, Military Radar Signal Processing, Medical Imaging Systems, ASIC Prototyping Platform, Industrial Test and Measurement.
Wireless Baseband Processing
The EP2AGX260FF35C5N's 48 CPRI/OBSAI-capable transceivers and 736 18x18 multipliers make it ideal for 4G LTE baseband processing. The transceivers support up to 3.75 Gbps per channel, enabling multiple remote radio head links over a single FPGA. The 12 Mbit embedded memory provides low-latency buffer access for OFDM symbol processing and turbo decoder scheduling. Compared with general-purpose DSPs, the FPGA delivers deterministic timing and parallel FFT/iFFT computation at lower latency. Place the device adjacent to the radio front-end with matched-length differential pairs to each transceiver channel; expect approximately 4-6 W transceiver power at full rate.
Empfohlen
High-Definition Video Broadcast
The EP2AGX260FF35C5N drives multi-channel HD-SDI and 3G-SDI video routing in broadcast studios. Its 612 user I/Os handle parallel video buses while the embedded memory supports frame buffers and deinterlacing filters. The 48 transceivers enable SMPTE 424M (3 Gbps SDI) and emerging 6G/12G-SDI standards. Industrial temperature grade ensures 24/7 rack operation. Designers can implement chroma-keying and motion-adaptive noise reduction directly in FPGA fabric, bypassing expensive dedicated video processors.
Empfohlen
Military Radar Signal Processing
The EP2AGX260FF35C5N suits phased-array radar pulse compression and Doppler processing. Its 244K logic elements implement multi-channel FFT engines for SAR (Synthetic Aperture Radar) imaging, while 12 Mbit embedded memory holds range-Doppler maps. The -40C to +85C industrial temperature range operates in ground-mobile and shipboard environments. The 48 transceivers connect to ADCs sampling at 1+ Gsps. Compared with ASIC solutions, the FPGA enables post-deployment algorithm updates critical for evolving radar waveforms.
Empfohlen
Medical Imaging Systems
In ultrasound and CT imaging equipment, the EP2AGX260FF35C5N performs beamforming, image reconstruction, and real-time filtering. Its 736 multipliers execute FIR filter banks for receive beamforming across 64-128 channels simultaneously. The 12 Mbit embedded memory acts as a high-speed line buffer for image data streaming. The 48 transceivers aggregate high-speed ADC data from front-end ASICs. Designers can implement proprietary image-enhancement IP that differentiates their medical devices from commodity OEM solutions.
Empfohlen
ASIC Prototyping Platform
Engineers use the EP2AGX260FF35C5N as a vehicle for prototyping ASIC RTL before tape-out. With 244K logic elements, the device accommodates mid-complexity SoC designs. The 48 transceivers emulate multi-protocol I/O (PCIe, USB 3.0, SATA) at full rate. Designers partition large ASICs across multiple FPGAs using time-domain multiplexing. Quartus II provides ASIC-style synthesis with industry-standard SDC timing constraints and gate-level verification.
Empfohlen
Industrial Test and Measurement
The EP2AGX260FF35C5N powers high-speed protocol analyzers and automated test equipment (ATE). Its 48 transceivers monitor PCIe, Ethernet, SATA, and Fibre Channel links simultaneously. The 12 Mbit embedded memory captures trigger events and protocol traces for post-processing. Industrial temperature range supports factory-floor deployment. Compared with oscilloscope-only solutions, the FPGA correlates protocol events across multiple physical layers in real time.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2AGX260FF35C5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2AGX260FF35C4N | EP2AGX260FF35C5G | EP2AGX260FF35C5 | EP2AGX260FF35I5N | EP2AGX190FF35C5G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (FF35, 35x35 mm) | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same | 1152-FBGA - same |
| Logic Elements | 244,188 | 244,188 | 244,188 | 244,188 | 244,188 | 190,000 (-22%) |
| Speed Grade | C5 | C4 (slower) | C5 (same) | C5 (same) | I5 (industrial temp) | C5 (same) |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +100C (extended) | -40C to +85C | |
| RoHS / Lead-Free | Lead-free | Lead-free | Pb-free (explicit) | Standard (may contain Pb) | Lead-free | Pb-free |
Wichtigste Unterscheidungsmerkmale
- Highest-density same-package drop-in alternative within Arria II GX family (vs. EP2AGX190FF35C5G)
- C5 speed grade balances timing margin and dynamic power (vs. EP2AGX260FF35C4N)
- Industrial temperature grade at standard lead-free pricing (vs. EP2AGX260FF35I5N)
Designhinweise
The EP2AGX260FF35C5N in a 1152-FBGA package dissipates 8-15 W typical depending on transceiver utilization and logic toggling rate. Designers must attach the exposed die paddle to a thermal via array under the BGA with at least 4 thermal vias per cm2 connecting to inner copper planes. Without a heat spreader, junction temperature can exceed 100C in still air at 85C ambient when all 48 transceivers operate at 3.75 Gbps. Use thermal simulation in Quartus II PowerPlay early in the design cycle.
The 1152-FBGA 35x35 mm package requires 8-12 layer PCB stack-up with HDI microvia construction. BGA pitch is approximately 1.0 mm; signal escape routing needs microvias from the BGA pads to inner layers. Transceiver channels demand 100-ohm differential pairs with intra-pair skew under 5 ps. Use Megtron-6 or equivalent low-loss dielectric (Df < 0.005 at 1 GHz) for transceiver lanes exceeding 5 inches. Reference the Altera Arria II GX board design guidelines for layer stack-up and decoupling recommendations.
Configuration mode pin (MSEL) settings must match the chosen configuration scheme (Fast Passive Parallel, Active Serial, JTAG) - mismatched MSEL states prevent the FPGA from configuring at power-up. The I/O bank voltages (VCCIO) must be supplied before or simultaneously with VCCINT; power sequencing violations can cause permanent device damage. Do not exceed the maximum transceiver pre-emphasis settings without verifying signal integrity at the receiver - over-equalization increases jitter.
Compliance-Informationen
RoHS and lead-free status per Intel Arria II GX datasheet. Industrial temperature grade (-40C to +85C). AEC-Q100 not applicable as this is an FPGA, not an automotive-qualified IC.
