EP2AGX45DF25I5N - Arria II GX FPGA, 45K LE, 572-FCBGA | Intel
MPN: EP2AGX45DF25I5N ✓ Hoạt độngEP2AGX45DF25I5N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. Within the wider taxonomy, the EP2AGX45 belongs to the Arria II mid-range family (Arria II > Arria family > FPGA > programmable logic > semiconductor IC). FPGAs differ from microcontrollers in that logic and routing are defined at compile time (via HDL bitstream), not firmware, allowing hardware-parallel throughput for DSP, packet processing, and high-speed I/O bridging.
Key features include 8 full-duplex 3.75 Gbps transceivers with embedded PCS/PMA, 1.5 Mb of internal configuration memory via external flash, support for DDR2/DDR3/QDRII+ memory interfaces up to 400 MHz, and a hard PCIe Gen1 x4 / Gen2 x4 IP core. Per-channel transmit pre-emphasis and receive equalization compensate for FR-4 channel loss, and the device supports Hot Socketing for in-system replacement without backplane damage. The 27 mm x 5 mm package footprint integrates cleanly into mid-density line cards.
Architecturally, the EP2AGX45DF25I5N implements 1,805 LABs, 8 transceivers, 4 PCIe hard IP blocks, 2 PLLs per side, and 4 hard memory controllers. Logic synthesis is performed with Intel Quartus II software using Verilog, VHDL, or schematic entry; the resulting bitstream loads from flash or JTAG.
Typical applications include wireless baseband processing, video broadcast bridging, military secure radio, and industrial imaging pipelines. For PCIe Gen2 protocol bridging between ASIC and backplane, the integrated hard IP core eliminates soft-logic latency.
Design consideration: PCB design must observe 100-ohm differential impedance for transceiver lanes and maintain length matching within 5 ps; consult the Arria II GX Transceiver User Guide for eye-diagram tuning.
This page synthesizes distributor pricing, drop-in alternatives within the Arria II GX family, and practical design guidance not consolidated in the manufacturer datasheet.
Bộ thay thế dễ dàng lắp đặt cho EP2AGX45DF25I5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2AGX45DF25I5N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.
EP2AGX45DF25I5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2AGX45DF25I5G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2AGX45DF25I3G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2AGX45DF25C6N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2AGX45DF25C5N
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Xem tài liệu →EP2AGX45DF25C4N
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Xem tài liệu →EP2AGX45DF25I5N Tỷ lệ tối đa & tính chất điện
| Family | Arria II GX |
| Logic Elements | 42,959 |
| Adaptive Logic Modules | 17,015 |
| LABs | 1,805 |
| Embedded Memory | 3,517,440 bits |
| User I/Os | 252 |
| Transceivers | 8 channels at up to 3.75 Gbps |
| PCIe Hard IP | 4 blocks, Gen1 x4 / Gen2 x4 |
| Process Node | 40 nm |
| Core Voltage | 0.9 V |
| Hộp | 572-ball FCBGA, 25 mm x 25 mm |
| Nhiệt độ hoạt động | -40C to +100C (Industrial) |
| Speed Grade | I5 (industrial, mid-speed) |
| Kiểu lắp đặt | Surface Mount |
| Cấp MSL | 3 (168 hours) |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân EP2AGX45DF25I5N 572-ball fcbga, 25 mm x 25 mm
Cấu hình chân cho EP2AGX45DF25I5N (572-ball fcbga, 25 mm x 25 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2AGX45DF25I5N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2AGX45DF25I5N phù hợp cho 6 Áp dụngs: Wireless Baseband Processing, Video Broadcast Bridge, Military Secure Radio, Industrial Imaging Pipeline, PCIe Protocol Bridge, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX45DF25I5N fits wireless baseband processing because its 42,959 logic elements deliver parallel DSP throughput for LTE PHY layer functions such as FFT/iFFT, channel coding (Turbo/Viterbi), and crest factor reduction. The 8 integrated 3.75 Gbps transceivers interface directly to CPRI links between baseband and remote radio heads, eliminating external SERDES ICs and reducing BOM cost. According to the Arria II GX datasheet, the industrial temperature range (-40C to +100C) supports outdoor radio unit deployments. The 3.5 Mbit embedded memory buffers symbol samples between DSP blocks without external SRAM access stalls, sustaining real-time baseband throughput at 20 MHz LTE bandwidths.
Được đề xuất
Video Broadcast Bridge
The EP2AGX45DF25I5N serves as a video broadcast bridge by converting between SDI (SMPTE 259M/292M/424M), DVB-ASI, and IP-based transport streams. The 8 transceivers handle HD-SDI at 1.485 Gbps or 3G-SDI at 2.97 Gbps per channel, while the 252 user I/Os aggregate parallel BT.656/TFT data buses. Per the Arria II GX datasheet, the integrated PCIe Gen2 x4 hard IP enables direct insertion into broadcast servers without soft-logic latency. The 1,805 LABs implement multi-format crosspoint switches at line-rate, and industrial temperature range supports 24/7 broadcast equipment racks.
Được đề xuất
Military Secure Radio
The EP2AGX45DF25I5N is well suited to military secure radio platforms because the Arria II GX family supports extended temperature screening and the integrated transceivers handle tactical waveforms such as LINK-16, HAVE QUICK, and SINCGARS digitization. The 42,959 logic elements implement cryptographic engines (AES-256, Type-1) and frequency-hopping algorithms in hardware with minimal latency. Per the Arria II GX datasheet, the device's SEU mitigation features (CRAM error detection) support aerospace and defense reliability requirements. The 572-ball FCBGA package provides the ruggedized thermal mass required for vehicle-mounted and airborne secure radio platforms operating across the -40C to +100C industrial range.
Được đề xuất
Industrial Imaging Pipeline
The EP2AGX45DF25I5N accelerates industrial imaging pipelines through parallel processing of high-speed camera sensor data (CoaXPress, Camera Link, GigE Vision). The 8 transceivers aggregate multi-gigabit sensor streams at 3.75 Gbps per lane, while the 1,805 LABs implement real-time image preprocessing such as color space conversion, Bayer demosaicing, and defect correction. Per the Arria II GX datasheet, the integrated DDR2/DDR3 memory controllers buffer raw image frames at line rate. The industrial temperature grade supports factory-floor machine vision installations with ambient swings, and the 572-ball FCBGA package dissipates the 6-8W typical imaging workload.
Được đề xuất
PCIe Protocol Bridge
The EP2AGX45DF25I5N bridges between PCIe Gen2 and legacy protocols (PCI, VME, GbE, custom ASICs) using the integrated 4 hard PCIe IP blocks, which eliminate the soft-logic latency that plagues FPGA-based PCIe implementations. Per the Arria II GX datasheet, each hard IP block supports Gen2 x4 lane configurations, and the device complies with PCIe 2.0 Base and Card Electromechanical specifications. The 42,959 logic elements implement the legacy protocol endpoint logic, while 252 user I/Os handle parallel bus interfaces. Industrial temperature range supports storage controllers and telecom line cards operating in outdoor enclosures.
Được đề xuất
Test and Measurement Instrumentation
The EP2AGX45DF25I5N drives test and measurement instrumentation such as protocol analyzers, logic analyzers, and bit-error-rate testers because its 8 transceivers operate from 1.5 Gbps up to 3.75 Gbps with per-channel pre-emphasis and equalization for signal integrity tuning. Per the Arria II GX datasheet, the 1,805 LABs implement pattern generation, error counting, and protocol decoding in parallel hardware. The 3.5 Mbit embedded memory stores captured waveform segments at full sample rate. Industrial temperature range supports benchtop and portable test equipment, while the 572-ball FCBGA footprint provides the thermal headroom for continuous full-speed transceiver operation.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2AGX45DF25I5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2AGX45DF25I5 | EP2AGX45DF25I5G | EP2AGX45DF25I3G | EP2AGX45DF25C6N | EP2AGX45DF25C5N |
|---|---|---|---|---|---|---|
| Package | 572-ball FCBGA (DF25) | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same | 572-ball FCBGA (DF25) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | I5 (industrial, mid) | I5 | I5 | I3 (faster) | C6 (commercial, faster) | C5 (commercial, slower) |
| Temperature Range | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Transceivers | 8 ch at 3.75 Gbps | 8 ch at 3.75 Gbps | 8 ch at 3.75 Gbps | 8 ch at 3.75 Gbps | 8 ch at 3.75 Gbps | 8 ch at 3.75 Gbps |
| PCIe Hard IP | 4 blocks (Gen1/Gen2) | 4 blocks | 4 blocks | 4 blocks | 4 blocks | 4 blocks |
| RoHS Compliance | Compliant (Pb-free) | Pb-bga (pre-RoHS variant) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) |
Bảo phân biệt quan trọng
- Integrated 8-channel 3.75 Gbps transceivers with PCIe hard IP (vsEP2AGX45DF25C6N)
- Industrial temperature screening with identical silicon (vsEP2AGX45DF25I5)
- Mid-range Arria II GX family with 8 transceivers and 252 I/Os (vsCyclone V GX 5CGXFC5)
Ghi chú thiết kế
PCB layout for the EP2AGX45DF25I5N must observe 100-ohm differential impedance for all 8 transceiver lanes, with intra-pair length matching within 5 ps (approximately 1 mm at FR-4 effective dielectric). Use stripline or microstrip with continuous reference plane; never route a transceiver lane over a power plane split. Per the Arria II GX Transceiver User Guide, AC-coupling capacitors (0.1 uF, X7R) are required on each TX lane when interfacing to external SERDES.
Estimated: with 8 transceivers active at 3.75 Gbps and 60% logic utilization, the EP2AGX45DF25I5N dissipates 6-8W. A 4-layer PCB with 1 oz copper requires 4-6 power islands (VCCINT 0.9V, VCCD_PLL 0.9V, VCCA 2.5V, VCCP 1.0V, VCCIO 1.5-3.3V bank-dependent). Use 0402 ceramic decoupling (0.1 uF + 10 uF) within 5 mm of every power pin per the Arria II GX pin connection guidelines.
Do not confuse the EP2AGX45DF25I5N speed grade with the I3 variant - I3 is faster but shares the same package. Always specify the full ordering code including the suffix G for Pb-free RoHS compliance when placing modern production orders. Per the verified web data, the device is approaching EOL; engage with Intel FPGA representatives early for long-term production planning. JTAG configuration requires the Quartus II programmer with a USB-Blaster or compatible download cable.
Thông tin tuân thủ
RoHS compliant per Altera/Intel product page (G-suffix variants). Pb-bga variants (non-G suffix) pre-date RoHS. AEC-Q100 not applicable - this is a logic IC, not a power/analog automotive IC.
