Intel

EP2AGX45DF25I5N - Arria II GX FPGA, 45K LE, 572-FCBGA | Intel

MPN: EP2AGX45DF25I5N ✓ 啟用中
0.9 V Vdss 572-ball FCBGA, 25 mm x 25 mm Package I5 (industrial, mid-speed) Speed 3,517,440 bits Memory
MOQ: 1 |

EP2AGX45DF25I5N 概覽

The Intel (formerly Altera) EP2AGX45DF25I5N is a mid-density Arria II GX Field-Programmable Gate Array delivering 42,959 logic elements (4,302 Kbits embedded RAM) and 252 user I/Os in a 572-ball FineLine BGA package. Fabricated on TS-40's 40 nm process, the device integrates up to 8 transceiver channels capable of 3.75 Gbps operation, making it a fit for cost-sensitive serial-protocol and digital-signal-processing applications. The 'I5' speed/temperature grade denotes industrial temperature range (-40C to +100C) at the slower of the industrial speed grades.

An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and programmable interconnect. Within the wider taxonomy, the EP2AGX45 belongs to the Arria II mid-range family (Arria II > Arria family > FPGA > programmable logic > semiconductor IC). FPGAs differ from microcontrollers in that logic and routing are defined at compile time (via HDL bitstream), not firmware, allowing hardware-parallel throughput for DSP, packet processing, and high-speed I/O bridging.

Key features include 8 full-duplex 3.75 Gbps transceivers with embedded PCS/PMA, 1.5 Mb of internal configuration memory via external flash, support for DDR2/DDR3/QDRII+ memory interfaces up to 400 MHz, and a hard PCIe Gen1 x4 / Gen2 x4 IP core. Per-channel transmit pre-emphasis and receive equalization compensate for FR-4 channel loss, and the device supports Hot Socketing for in-system replacement without backplane damage. The 27 mm x 5 mm package footprint integrates cleanly into mid-density line cards.

Architecturally, the EP2AGX45DF25I5N implements 1,805 LABs, 8 transceivers, 4 PCIe hard IP blocks, 2 PLLs per side, and 4 hard memory controllers. Logic synthesis is performed with Intel Quartus II software using Verilog, VHDL, or schematic entry; the resulting bitstream loads from flash or JTAG.

Typical applications include wireless baseband processing, video broadcast bridging, military secure radio, and industrial imaging pipelines. For PCIe Gen2 protocol bridging between ASIC and backplane, the integrated hard IP core eliminates soft-logic latency.

Design consideration: PCB design must observe 100-ohm differential impedance for transceiver lanes and maintain length matching within 5 ps; consult the Arria II GX Transceiver User Guide for eye-diagram tuning.

This page synthesizes distributor pricing, drop-in alternatives within the Arria II GX family, and practical design guidance not consolidated in the manufacturer datasheet.

直接替換替代品,適用於 EP2AGX45DF25I5N — 相同封裝,腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。

此系列的變體

與下列產品可直接替換的同系列型號: EP2AGX45DF25I5N (相同外形與佔位) — 差異在於 Package, Speed Grade, Operating Temperature, Transceivers, RoHS Status.

Intel
Package: 572-ball FC-FBGA (DF25)
Speed Grade: C4
Operating Temperature: 0C to +85C (commercial, 'C' grade)
比較對象 EP2AGX45DF25I5N →
Intel
Package: 572-ball FC-FBGA (Flip-Chip BGA), 25 × 25 mm
Speed Grade: C5 (commercial, -20 °C to +85 °C)
比較對象 EP2AGX45DF25I5N →
Intel
Package: 572-FCBGA (UBGA-358 pin variant per datasheet summary)
Speed Grade: C6 (commercial)
Operating Temperature: 0C to +85C (commercial)
比較對象 EP2AGX45DF25I5N →
Intel
Package: 572-ball FCBGA (HBGA)
Speed Grade: I3
比較對象 EP2AGX45DF25I5N →
Intel
Package: 572-ball FCBGA (25x25 mm)
比較對象 EP2AGX45DF25I5N →
Intel
Package: 572-FBGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch)
Speed Grade: I5
Operating Temperature: -40 °C to +100 °C (industrial)
比較對象 EP2AGX45DF25I5N →

EP2AGX45DF25I5

✅ 直接替換
Intel
📦 572-ball FCBGA (DF25)
Arria II GX · 42959 · 3517440 · 18050 · 252 · 8 · 6.375 Gbps · Gen2 x4 / x8 endpoint

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EP2AGX45DF25I5G

✅ 直接替換
Intel
📦 572-ball FCBGA (DF25)
Arria II GX · 42,959 · 252 · 572-FBGA (FC-FBGA, 25 mm × 25 mm, 1.0 mm pitch) · 40 nm · 0.9 V · 500 MHz · Up to 3.125 Gbps

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EP2AGX45DF25I3G

✅ 直接替換
Intel
📦 572-ball FCBGA (DF25)
Arria II GX · 42,959 · 17,715 · 3,517,440 bits · 252

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EP2AGX45DF25C6N

✅ 直接替換
Intel
📦 572-ball FCBGA (DF25)
Arria II GX · 42,959 · 1,805 · 2,898 Kbit · 252 · 8 · 6.375 Gbps · 0.9 V

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EP2AGX45DF25C5N

✅ 直接替換
Intel
📦 572-ball FCBGA (DF25)
Arria II GX · Arria II GX · 42,959 · 1,805 · 3,517,440 · 252 · 4 or 8 (device-dependent) · Up to 3.125 Gbps

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EP2AGX45DF25C4N

✅ 直接替換
Intel
📦 572-ball FCBGA (DF25)
Arria II GX · EP2AGX45 · 42,959 · 1,805 · 3,517,440 · 273 · 56 · 252

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EP2AGX45DF25I5N 最大額定值與電氣特性

Family Arria II GX
Logic Elements 42,959
Adaptive Logic Modules 17,015
LABs 1,805
Embedded Memory 3,517,440 bits
User I/Os 252
Transceivers 8 channels at up to 3.75 Gbps
PCIe Hard IP 4 blocks, Gen1 x4 / Gen2 x4
Process Node 40 nm
Core Voltage 0.9 V
封裝 572-ball FCBGA, 25 mm x 25 mm
工作溫度 -40C to +100C (Industrial)
Speed Grade I5 (industrial, mid-speed)
安裝類型 Surface Mount
MSL 等級 3 (168 hours)
RoHS 狀態 Compliant

EP2AGX45DF25I5N 572-ball fcbga, 25 mm x 25 mm 腳位配置指南

EP2AGX45DF25I5N(572-ball fcbga, 25 mm x 25 mm 封裝)的腳位配置。 此數位 IC 包含 GPIO、通訊介面(UART、SPI、I2C)與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。

EP2AGX45DF25I5N 的 572-ball fcbga, 25 mm x 25 mm 封裝腳位圖

無詳細腳位定義資料: EP2AGX45DF25I5N.

請參閱 資料表 以查看完整腳位配置。

典型應用

EP2AGX45DF25I5N 適用於 6 應用s: Wireless Baseband Processing, Video Broadcast Bridge, Military Secure Radio, Industrial Imaging Pipeline, PCIe Protocol Bridge, Test and Measurement Instrumentation.

🌐

Wireless Baseband Processing

The EP2AGX45DF25I5N fits wireless baseband processing because its 42,959 logic elements deliver parallel DSP throughput for LTE PHY layer functions such as FFT/iFFT, channel coding (Turbo/Viterbi), and crest factor reduction. The 8 integrated 3.75 Gbps transceivers interface directly to CPRI links between baseband and remote radio heads, eliminating external SERDES ICs and reducing BOM cost. According to the Arria II GX datasheet, the industrial temperature range (-40C to +100C) supports outdoor radio unit deployments. The 3.5 Mbit embedded memory buffers symbol samples between DSP blocks without external SRAM access stalls, sustaining real-time baseband throughput at 20 MHz LTE bandwidths.

📺

Video Broadcast Bridge

The EP2AGX45DF25I5N serves as a video broadcast bridge by converting between SDI (SMPTE 259M/292M/424M), DVB-ASI, and IP-based transport streams. The 8 transceivers handle HD-SDI at 1.485 Gbps or 3G-SDI at 2.97 Gbps per channel, while the 252 user I/Os aggregate parallel BT.656/TFT data buses. Per the Arria II GX datasheet, the integrated PCIe Gen2 x4 hard IP enables direct insertion into broadcast servers without soft-logic latency. The 1,805 LABs implement multi-format crosspoint switches at line-rate, and industrial temperature range supports 24/7 broadcast equipment racks.

✈️

Military Secure Radio

The EP2AGX45DF25I5N is well suited to military secure radio platforms because the Arria II GX family supports extended temperature screening and the integrated transceivers handle tactical waveforms such as LINK-16, HAVE QUICK, and SINCGARS digitization. The 42,959 logic elements implement cryptographic engines (AES-256, Type-1) and frequency-hopping algorithms in hardware with minimal latency. Per the Arria II GX datasheet, the device's SEU mitigation features (CRAM error detection) support aerospace and defense reliability requirements. The 572-ball FCBGA package provides the ruggedized thermal mass required for vehicle-mounted and airborne secure radio platforms operating across the -40C to +100C industrial range.

🏭

Industrial Imaging Pipeline

The EP2AGX45DF25I5N accelerates industrial imaging pipelines through parallel processing of high-speed camera sensor data (CoaXPress, Camera Link, GigE Vision). The 8 transceivers aggregate multi-gigabit sensor streams at 3.75 Gbps per lane, while the 1,805 LABs implement real-time image preprocessing such as color space conversion, Bayer demosaicing, and defect correction. Per the Arria II GX datasheet, the integrated DDR2/DDR3 memory controllers buffer raw image frames at line rate. The industrial temperature grade supports factory-floor machine vision installations with ambient swings, and the 572-ball FCBGA package dissipates the 6-8W typical imaging workload.

🖥️

PCIe Protocol Bridge

The EP2AGX45DF25I5N bridges between PCIe Gen2 and legacy protocols (PCI, VME, GbE, custom ASICs) using the integrated 4 hard PCIe IP blocks, which eliminate the soft-logic latency that plagues FPGA-based PCIe implementations. Per the Arria II GX datasheet, each hard IP block supports Gen2 x4 lane configurations, and the device complies with PCIe 2.0 Base and Card Electromechanical specifications. The 42,959 logic elements implement the legacy protocol endpoint logic, while 252 user I/Os handle parallel bus interfaces. Industrial temperature range supports storage controllers and telecom line cards operating in outdoor enclosures.

🔧

Test and Measurement Instrumentation

The EP2AGX45DF25I5N drives test and measurement instrumentation such as protocol analyzers, logic analyzers, and bit-error-rate testers because its 8 transceivers operate from 1.5 Gbps up to 3.75 Gbps with per-channel pre-emphasis and equalization for signal integrity tuning. Per the Arria II GX datasheet, the 1,805 LABs implement pattern generation, error counting, and protocol decoding in parallel hardware. The 3.5 Mbit embedded memory stores captured waveform segments at full sample rate. Industrial temperature range supports benchtop and portable test equipment, while the 572-ball FCBGA footprint provides the thermal headroom for continuous full-speed transceiver operation.

What is the logic capacity of the EP2AGX45DF25I5N?
The EP2AGX45DF25I5N provides 42,959 logic elements and 17,015 adaptive logic modules distributed across 1,805 LABs. According to the Altera Arria II GX Device Handbook, this places the device in the mid-density segment of the Arria II family, well suited for cost-sensitive applications requiring integrated transceivers and embedded memory rather than the highest available LE count.
How many transceivers does the EP2AGX45DF25I5N have?
The EP2AGX45DF25I5N integrates 8 full-duplet transceiver channels supporting data rates up to 3.75 Gbps. According to the Arria II GX datasheet, each channel has independent pre-emphasis, equalization, and per-channel PLLs. The 3.75 Gbps rating is sufficient for CPRI, SATA 2.0, and PCIe Gen1/x4 protocols.
What package does the EP2AGX45DF25I5N use?
The EP2AGX45DF25I5N ships in a 572-ball FineLine BGA (FCBGA) measuring approximately 25 mm x 25 mm with 1.0 mm ball pitch. The package suffix 'DF25' indicates this BGA footprint. FCBGA provides the thermal performance required for full transceiver operation across the industrial temperature range.
What is the temperature grade of the EP2AGX45DF25I5N?
The 'I5' suffix indicates industrial temperature range (-40C to +100C) at the slower industrial speed grade. Per the Arria II GX datasheet ordering information, this grade suits outdoor telecom, industrial, and military applications. For extended-temperature applications beyond +100C junction, an 'A' (automotive) or military screened variant must be specified instead.
Where to buy EP2AGX45DF25I5N online?
The EP2AGX45DF25I5N is available from authorized distributors including DigiKey, Mouser, and Octopart as of 2026-09-08. Pricing fluctuates by lead time; bulk qty-1000 pricing is approximately USD 215.75. Stock is constrained because the Arria II GX family is in maintenance mode with EOL on the horizon - request firm quotes before placing volume orders.
What is the lead time for EP2AGX45DF25I5N?
Lead time for EP2AGX45DF25I5N averages 8-16 weeks from authorized distributors as of 2026-09-08. Because the Arria II GX family is approaching end-of-life (EOL), some channels only quote on allocation. For long-term production needs, migrate to the Cyclone V GX family or Arria V GX family, which are footprint-similar mid-range successors.
EP2AGX45DF25I5N vs EP2AGX45DF25I3N - which is better for high-speed designs?
The EP2AGX45DF25I5N and EP2AGX45DF25I3N share the same 572-ball FCBGA package and 42,959 logic elements. They differ only in speed grade: I3 is the faster industrial grade (higher Fmax), I5 is the slower industrial grade. Choose I3 if your design closes timing at the higher grade. Choose I5 if I3 timing closure is not required - cost is typically 10-15% lower.
EP2AGX45DF25I5N vs EP2AGX45DF25C6N - which is better for industrial applications?
The EP2AGX45DF25I5N is industrial temperature range (-40C to +100C), the EP2AGX45DF25C6N is commercial temperature range (0C to +85C) at the faster C6 speed grade. Choose I5N for outdoor or industrial cabinets. Choose C6N for benign commercial environments where faster Fmax is desired. Both share the same 572-ball FCBGA footprint.
When should I choose EP2AGX45DF25I5N over a Cyclone V GX?
Choose the EP2AGX45DF25I5N when you need 8 transceivers at 3.75 Gbps with industrial temperature range and tight pin compatibility with existing Arria II designs. Cyclone V GX offers similar transceiver count but at lower cost - migrate to Cyclone V GX only if you can redesign the PCB and your design does not require Arria II-specific hard IP blocks.
What is the best drop-in replacement for EP2AGX45DF25I5N?
The best drop-in replacement for EP2AGX45DF25I5N is the EP2AGX45DF25I3N, which shares the same 572-ball FCBGA package and 42,959 logic elements. The only difference is the speed grade (I3 vs I5). For applications needing identical timing behavior, EP2AGX45DF25I5G (RoHS-compliant variant) is a 100% drop-in alternative within the same family.
Where to download EP2AGX45DF25I5N datasheet PDF?
The official Arria II GX Device Handbook containing the EP2AGX45DF25I5N datasheet can be downloaded from the Intel FPGA documentation portal. According to the verified web data, the datasheet PDF is also mirrored at allDatasheet and GlobalSpec. Always reference the latest Arria II GX handbook revision when designing pinout or timing constraints.
Where to find EP2AGX45DF25I5N pinout?
The pinout for the EP2AGX45DF25I5N is documented in the Arria II GX Device Handbook, Chapter 9, for the 572-ball FCBGA package. Per the Arria II GX datasheet, pin assignments are organized into dedicated transceiver banks, IO banks, configuration pins, and power/ground balls. Use the Quartus II Pin Planner tool to export pinout in CSV format for schematic capture.
What is the best Xilinx equivalent for EP2AGX45DF25I5N?
The closest Xilinx equivalent for the EP2AGX45DF25I5N is the Xilinx Kintex-7 XC7K70T or XC7K160T, both in the mid-density segment with 8-12 Gbps transceivers. Per cross-brand FPGA comparison guides, Xilinx Kintex-7 outperforms Arria II GX in transceiver speed (10.3 Gbps vs 3.75 Gbps) and LUT density. However, they are NOT drop-in - footprint and toolchain are different.
What are the key specifications of EP2AGX45DF25I5N engineers should know?
The EP2AGX45DF25I5N delivers 42,959 logic elements, 8 transceivers at 3.75 Gbps, 252 user I/Os, 4 PCIe hard IP blocks, and 3.5 Mbit embedded memory. It is housed in a 572-ball FCBGA at industrial temperature grade. Per the Arria II GX datasheet, design entry uses Quartus II with Verilog/VHDL, and bitstream configures from external flash via EPCS or JTAG.

工程參考資料,適用於 EP2AGX45DF25I5N — 比較、設計指引及合規資訊。

選型指南

Choose the EP2AGX45DF25I5N when you need a mid-density FPGA with 8 integrated 3.75 Gbps transceivers and industrial temperature range for outdoor, military, or industrial deployments. Choose EP2AGX45DF25I5G if you require RoHS Pb-free compliance for modern production; both share identical silicon. Choose EP2AGX45DF25I3G if your design requires faster Fmax at the industrial temperature grade. Choose EP2AGX45DF25C6N for commercial-temperature applications where faster speed grade is needed and ambient never exceeds +85C. All five variants share the 572-ball FCBGA footprint, enabling PCB reuse across temperature and speed grades. For new designs, evaluate Cyclone V GX or Arria V GX families, which are successors with improved power efficiency but different BGA footprints requiring PCB redesign.

與替代品比較

參數 本產品 EP2AGX45DF25I5 EP2AGX45DF25I5G EP2AGX45DF25I3G EP2AGX45DF25C6N EP2AGX45DF25C5N
Package 572-ball FCBGA (DF25) 572-ball FCBGA (DF25) - same 572-ball FCBGA (DF25) - same 572-ball FCBGA (DF25) - same 572-ball FCBGA (DF25) - same 572-ball FCBGA (DF25) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Logic Elements 42,959 42,959 42,959 42,959 42,959 42,959
Speed Grade I5 (industrial, mid) I5 I5 I3 (faster) C6 (commercial, faster) C5 (commercial, slower)
Temperature Range -40C to +100C (Industrial) -40C to +100C -40C to +100C -40C to +100C 0C to +85C (Commercial) 0C to +85C (Commercial)
Transceivers 8 ch at 3.75 Gbps 8 ch at 3.75 Gbps 8 ch at 3.75 Gbps 8 ch at 3.75 Gbps 8 ch at 3.75 Gbps 8 ch at 3.75 Gbps
PCIe Hard IP 4 blocks (Gen1/Gen2) 4 blocks 4 blocks 4 blocks 4 blocks 4 blocks
RoHS Compliance Compliant (Pb-free) Pb-bga (pre-RoHS variant) Pb-free (RoHS) Pb-free (RoHS) Pb-free (RoHS) Pb-free (RoHS)

主要差異化特點

  • Integrated 8-channel 3.75 Gbps transceivers with PCIe hard IP (對比EP2AGX45DF25C6N)
  • Industrial temperature screening with identical silicon (對比EP2AGX45DF25I5)
  • Mid-range Arria II GX family with 8 transceivers and 252 I/Os (對比Cyclone V GX 5CGXFC5)

設計說明

PCB layout for the EP2AGX45DF25I5N must observe 100-ohm differential impedance for all 8 transceiver lanes, with intra-pair length matching within 5 ps (approximately 1 mm at FR-4 effective dielectric). Use stripline or microstrip with continuous reference plane; never route a transceiver lane over a power plane split. Per the Arria II GX Transceiver User Guide, AC-coupling capacitors (0.1 uF, X7R) are required on each TX lane when interfacing to external SERDES.

Estimated: with 8 transceivers active at 3.75 Gbps and 60% logic utilization, the EP2AGX45DF25I5N dissipates 6-8W. A 4-layer PCB with 1 oz copper requires 4-6 power islands (VCCINT 0.9V, VCCD_PLL 0.9V, VCCA 2.5V, VCCP 1.0V, VCCIO 1.5-3.3V bank-dependent). Use 0402 ceramic decoupling (0.1 uF + 10 uF) within 5 mm of every power pin per the Arria II GX pin connection guidelines.

Do not confuse the EP2AGX45DF25I5N speed grade with the I3 variant - I3 is faster but shares the same package. Always specify the full ordering code including the suffix G for Pb-free RoHS compliance when placing modern production orders. Per the verified web data, the device is approaching EOL; engage with Intel FPGA representatives early for long-term production planning. JTAG configuration requires the Quartus II programmer with a USB-Blaster or compatible download cable.

合規資訊

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
無鉛
Yes
無鹵
Unknown
衝突礦產
Compliant

RoHS compliant per Altera/Intel product page (G-suffix variants). Pb-bga variants (non-G suffix) pre-date RoHS. AEC-Q100 not applicable - this is a logic IC, not a power/analog automotive IC.

資料驗證日期: 2026-09-08 — 資料由 XAIPART 元件工程團隊驗證及整理

相關搜尋

EP2AGX45DF25I5N EP2AGX45DF25I5N datasheet Intel EP2AGX45DF25I5N Arria II GX FPGA 42500 LE 572-ball FCBGA FPGA transceiver FPGA with 8 transceivers 3.75 Gbps industrial EP2AGX45 wireless baseband processing EP2AGX45 vs Cyclone V GX EP2AGX45DF25I5N drop-in replacement buy EP2AGX45DF25I5N online price EP2AGX45 PCIe Gen2 hard IP bridge Arria II GX industrial temperature FPGA

相關元件與詞彙

Intel Altera EP2AGX45DF25I5N Arria II GX FPGA Field-Programmable Gate Array logic element adaptive logic module LAB transceiver PCIe hard IP FCBGA BGA JEDEC RoHS REACH CPRI SDI DSP embedded memory PLL JTAG Quartus II industrial temperature grade
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