EP2AGZ300FF35C3N - 298K LE Arria II GZ FPGA 1152-BGA | Intel
MPN: EP2AGZ300FF35C3N ✗ Cuối đờiEP2AGZ300FF35C3N Tóm tắt
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect, allowing designers to implement custom digital circuits without the cost of ASIC tooling. FPGAs sit within the programmable logic device family, alongside CPLDs, and are distinguished from ASICs, ASSPs, and microcontrollers by hardware-reconfigurability, parallel processing fabric, and integrated high-speed transceivers. Arria II GZ devices occupy Intel's mid-range, transceiver-equipped tier between Cyclone (cost-optimized) and Stratix (high-end) families.
Key features of the EP2AGZ300FF35C3N include up to 16 transceivers supporting data rates up to 6.375 Gbps, embedded hard memory controllers (DDR3 with ECC), up to 8 PLLs, and 1,152 user I/O pins distributed across 24 I/O banks supporting LVDS, LVCMOS, HSTL, and SSTL standards. The device integrates 11,920 Logic Array Blocks (LABs) and 554 18x18 multipliers, enabling high-throughput signal processing tasks such as forward-error correction and video scaling.
Typical applications for the EP2AGZ300FF35C3N span 40G/100G telecom line cards, software-defined radio (SDR) baseband processing, video broadcast encoders/decoders, high-resolution medical imaging systems, and ASIC prototyping for high-speed serial protocols. The 6.375 Gbps transceiver capability combined with 18 Mbit embedded RAM makes this device especially well-suited for packet processing and SerDes aggregation in carrier-grade equipment.
When designing with the EP2AGZ300FF35C3N, ensure the PCB has at least 12 layers with controlled-impedance routing for the 6.375 Gbps serial links, and provision multiple decoupling capacitors (0.1 uF, 0.01 uF, and bulk) near every power pin. Thermal dissipation is significant: estimated at 15-25 W typical, requiring forced airflow or a heatsink attachment to the top of the FCBGA package. Programming is via JTAG or Active Serial configuration scheme using an EPCS or EPCQ configuration device.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single source for sourcing the EP2AGZ300FF35C3N.
Bộ thay thế dễ dàng lắp đặt cho EP2AGZ300FF35C3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2AGZ300FF35C3N (cùng hình factor và footprint) — khác nhau ở Transceivers, Package, Logic Elements, Speed Grade, Logic Elements (LE).
EP2AGZ300FF35C3G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2AGZ225FF35C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2AGZ225FF35C3G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2AGZ300FF35C3N Tỷ lệ tối đa & tính chất điện
| Family | Arria II GZ |
| Logic Elements (LE) | 298,000 |
| Logic Array Blocks (LABs) | 11,920 |
| Embedded Memory (Bits) | 18,854,912 |
| User I/Os | 554 |
| Maximum User I/O Pins (Package) | 1,152 |
| 18x18 Multipliers | 554 |
| Transceivers | Up to 16 channels |
| Max Transceiver Data Rate | 6.375 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| PLLs | 8 |
| Hộp | 1152-ball FCBGA (FF35) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial |
Hướng dẫn cấu hình chân EP2AGZ300FF35C3N 1152-ball fcbga (ff35)
Cấu hình chân cho EP2AGZ300FF35C3N (1152-ball fcbga (ff35) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2AGZ300FF35C3N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2AGZ300FF35C3N phù hợp cho 6 Áp dụngs: Telecom Line Card Aggregation, Broadcast Video Processing, Software-Defined Radio Baseband, ASIC Prototyping Platform, High-Speed Medical Imaging, Test and Measurement Instrumentation.
Telecom Line Card Aggregation
The EP2AGZ300FF35C3N's 16 transceivers at 6.375 Gbps are an exact match for telecom backplane aggregation where multiple 6G CPRI or gigabit Ethernet links must be merged before uplink. With 298K logic elements and 18.85 Mbit embedded RAM the device can host packet classification, QoS queuing, and forward-error correction in a single fabric, eliminating an external TCAM in mid-density line cards. Designers can place the FPGA between PHY devices and a network processor, achieving wire-speed line-rate forwarding while leaving headroom for OAM counters and MACSec encryption. Compared with a Stratix V it is more power-efficient at this transceiver count, making it the cost-optimized sweet spot for 40G-class line cards. Source: Altera Arria II GZ Device Handbook.
Được đề xuất
Broadcast Video Processing
Broadcast video encoders and frame-rate converters benefit from the EP2AGZ300FF35C3N's 554 18x18 multipliers and large embedded RAM, which enable real-time 3D motion estimation, scaling, and color-space transforms for SD/HD/3G-SDI pipelines. The 1,152-ball FCBGA exposes enough LVDS pairs to drive multi-channel SDI I/O and HDMI bridges simultaneously, while the 8 PLLs allow independent video-clock generation for transmit and receive paths. At typical broadcast chassis temperatures the commercial-grade EP2AGZ300FF35C3N sustains operation without throttling, but designers should plan heatsink attachment for closed-cabinet chassis. Source: Arria II GZ video reference designs.
Được đề xuất
Software-Defined Radio Baseband
Software-defined radio (SDR) baseband processing leverages the EP2AGZ300FF35C3N's combination of 6.375 Gbps transceivers (for ADC/DAC JESD204B link aggregation), 554 DSP multipliers, and 18.85 Mbit of fast embedded RAM to implement multi-channel digital down-conversion, FFT, and channelization in real time. The 0.9 V core combined with 40 nm process keeps dynamic power manageable in deployed radio units, while the 1,152-ball FCBGA gives 554 user I/Os for control-plane peripherals. Estimated: typical baseband design consumes 12-18 W at full DSP utilization. Source: Arria II GZ DSP design examples.
Được đề xuất
ASIC Prototyping Platform
ASIC prototyping requires FPGAs with high logic density, abundant transceivers, and large embedded memory - all delivered by the EP2AGZ300FF35C3N. The 298K LE fabric is large enough to map mid-complexity ASICs (1-3M gates) through multi-FPGA partitioning, while the 16 transceivers at 6.375 Gbps model high-speed serial ASIC IO accurately. Compared with ASIC emulation platforms built from multiple Stratix V devices, an Arria II GZ-based prototyping rig offers a better $/LUT ratio for designs up to 5M gates. Source: Altera ASIC Pro design methodology guide.
Được đề xuất
High-Speed Medical Imaging
Medical imaging systems such as ultrasound beamformers and CT reconstruction pipelines benefit from the EP2AGZ300FF35C3N's 554 DSP multipliers and high-bandwidth transceivers. The 18.85 Mbit embedded RAM holds channel-data buffers for beamforming, while 6.375 Gbps transceivers aggregate ADC data from multiple front-end boards. With 554 user I/Os the FPGA can fan out to display controllers, image storage, and host interfaces. For FDA/IEC 60601 compliance, pair the FPGA with isolated power and signal conditioning - the FPGA itself is commercial-grade, so system-level safety isolation is required. Source: Altera medical imaging reference designs.
Được đề xuất
Test and Measurement Instrumentation
Test and measurement instruments - protocol analyzers, BERT testers, arbitrary waveform generators - require precise timing, abundant DSP, and high-speed serial IO, all of which the EP2AGZ300FF35C3N delivers. The 8 PLLs provide independent clock domains for multiple instrument channels, while 298K logic elements host pattern-generation state machines and protocol decoders. The 16 transceivers enable multi-lane protocol analysis (PCIe, USB 3.0, SATA) in a single FPGA. Commercial operating temperature is adequate for lab environments, but industrial-grade -I variants should be chosen for field-deployed testers.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2AGZ300FF35C3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2AGZ300FF35C3G | EP2AGZ225FF35C3N | EP2AGZ225FF35C3G |
|---|---|---|---|---|
| Package | 1152-ball FCBGA (FF35) | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same | 1152-ball FCBGA (FF35) - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 298,000 | 298,000 | 225,000 (-24%) | 225,000 (-24%) |
| Max Transceiver Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process | 40 nm | 40 nm | 40 nm | 40 nm |
| RoHS / Lead-Free | Standard lead finish (N) | Pb-free / RoHS (G) | Standard lead finish (N) | Pb-free / RoHS (G) |
Bảo phân biệt quan trọng
- Highest-density Arria II GZ in the FF35 1152-ball FCBGA package (vsEP2AGZ225FF35C3N)
- Pb-free / RoHS-compliant lead finish option (same die) (vsEP2AGZ300FF35C3G)
- 16 transceivers at 6.375 Gbps in a mid-density fabric (vsEP2AGX260FF35C6G)
Ghi chú thiết kế
The 1152-ball FCBGA FF35 package requires at least a 12-layer PCB with stacked microvia construction (any-layer or staggered via). Use a 1.0 mm ball pitch escape pattern and route all transceiver differential pairs as 100 ohm differential controlled-impedance (90 ohm for some protocols). Provide at least 4 GND via stitching vias around every signal via to maintain signal-integrity return-path continuity at 6.375 Gbps. Keep all high-speed serial traces within 3 inches of the BGA and avoid routing over power-plane splits. Source: Altera Arria II GZ PCB design guidelines.
Estimated: the EP2AGZ300FF35C3N at typical 298K LE utilization with 16 active transceivers consumes approximately 15-25 W. Decoupling must follow the Altera reference: place 0.1 uF X7R capacitors within 50 mils of every VCC pin, add 0.01 uF X7R for high-frequency transients, and provision bulk 22 uF/47 uF polymer capacitors near each voltage-rail input. Use a multi-rail PMIC with separate VCC, VCCD_PLL, and VCCT_GXB rails, sequencing them per the datasheet to avoid latch-up during power-up.
The FCBGA package exposes a thermal pad on the top side for heatsink attachment. Without a heatsink at typical 15-25 W dissipation, junction temperature will exceed 100 C in still air. Recommended: attach a 30x30x10 mm aluminum heatsink with thermal interface material (3 W/mK minimum) and provide 100 LFM forced airflow in chassis. For closed enclosures without airflow, derate transceiver count or migrate to the lower-density EP2AGZ225 variants which dissipate 4-6 W less. Estimated: junction temperature rise without heatsink is approximately 65-75 C above ambient at 20 W dissipation.
Do not confuse commercial-grade (C3) with industrial-grade (I3) temperature grades; the part number suffix encodes the operating temperature range. Verify configuration mode (AS, PS, JTAG) before PCB layout, as MODE pins are sampled at power-up and cannot be changed without re-routing dedicated MODE pull-up/pull-down resistors. A common mistake is omitting the EPCS configuration flash or using the wrong density - the EP2AGZ300 requires at least a 64 Mbit EPCS device. Finally, do not assume NRnd parts have equivalent lifecycle to active parts; plan migration to Cyclone 10 GX or Arria 10 for new designs.
Thông tin tuân thủ
EP2AGZ300FF35C3N is the standard lead-finish (non-Pb-free) variant; the EP2AGZ300FF35C3G variant is Pb-free / RoHS-compliant with the same silicon. FPGA lifecycle status is NRnd (Not Recommended for New Designs) as of 2026-09-08.
