EP2C5Q208I8N - Cyclone II FPGA 4608 LE, 142 I/O | Intel
MPN: EP2C5Q208I8N ✓ Hoạt độngEP2C5Q208I8N Tóm tắt
An FPGA is a semiconductor device containing programmable logic blocks and programmable interconnects that can be configured after manufacturing to implement arbitrary digital circuits. In the broader taxonomy, an FPGA belongs to programmable logic devices, which sit above complex PLDs and CPLDs and below full-custom ASICs. FPGAs provide rapid hardware prototyping, in-field reconfiguration, and parallel processing capabilities that microcontrollers and DSPs cannot match for high-throughput data paths.
The EP2C5Q208I8N combines 4,608 logic elements with 119,808 bits of embedded RAM, allowing moderate state machines, FIFOs, and line buffers to be implemented without external memory for small applications. The 142 user I/Os support system-level interfaces such as DDR memory buses, parallel ADCs/DACs, and general-purpose LVCMOS/LVTTL connections. The 90 nm process balances low cost with adequate logic density and power efficiency for industrial embedded systems.
The device uses SRAM-based configuration, so external non-volatile configuration memory is required at power-up. A dedicated configuration controller in the Cyclone II architecture loads the bitstream from an EPC-series or third-party serial flash device. The on-chip PLLs provide clock multiplication and phase shifting for the logic fabric, supporting typical system clocking requirements in measurement and communications equipment.
Typical applications include industrial machine control, video and imaging pipelines, communication protocol bridging, motor control, test instrumentation, and custom I/O expansion. The 208-pin PQFP package is particularly well suited for boards where low-cost assembly and accessible probing are preferred over fine-pitch BGA packaging.
When designing with the EP2C5Q208I8N, pay close attention to the 1.2 V core supply decoupling and the multiple VCCIO bank voltages. A proper power-up sequence and dedicated configuration flash are essential for reliable operation. Because the device is SRAM-based, the configuration bitstream must be reloaded after every power cycle.
This page aggregates verified distributor data, practical design guidance, Cyclone II family comparisons, and drop-in Q208 variants that are not always listed on the manufacturer datasheet summary, helping engineers make a faster sourcing decision.
Bộ thay thế dễ dàng lắp đặt cho EP2C5Q208I8N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2C5Q208I8N (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Total RAM Bits, Operating Temperature, RoHS Status.
EP2C5Q208I8
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2C5Q208C8N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2C5Q208C8
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2C5Q208C7N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2C5Q208C7
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP2C5Q208I8N Tỷ lệ tối đa & tính chất điện
| Product Family | Cyclone II FPGA |
| Logic Elements | 4608 |
| Total RAM Bits | 119808 |
| Number of User I/Os | 142 |
| Package Type | 208-PQFP (BFQFP-208) |
| Số chân | 208 |
| Logic Family | CMOS |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm |
| Tần số xung maksimum | 402.58 MHz |
| Speed Grade | -8 |
| Kiểu lắp đặt | Surface Mount |
| Lead-Free Finish | Yes (N suffix) |
Hướng dẫn cấu hình chân EP2C5Q208I8N 208-pqfp (bfqfp-208)
Cấu hình chân cho EP2C5Q208I8N (208-pqfp (bfqfp-208) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2C5Q208I8N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2C5Q208I8N phù hợp cho 6 Áp dụngs: Industrial Machine Control and I/O Expansion, Motor Control and Power Inverter Logic, Video and Image Processing, Communication Protocol Bridging, Test and Measurement Instruments, Aerospace and Defense Subsystems.
Industrial Machine Control and I/O Expansion
The EP2C5Q208I8N fits industrial control panels by providing 142 user I/Os that can interface to optocouplers, relay drivers, incremental encoders, and sensor arrays. Its 4,608 logic elements are enough to implement parallel I/O decoding, state machines, and simple soft-core processors for non-critical control loops. The industrial temperature suffix I is a good match for factory-floor enclosures that see wide ambient swings. Distributed RAM helps buffer high-speed counter values or communication data without adding external FIFO chips. The 208-pin PQFP package is also easier to hand-assemble and probe than a dense BGA, which simplifies qualification and debugging in control systems with mixed through-hole and SMD components.
Được đề xuất
Motor Control and Power Inverter Logic
For motor drives, the FPGA can implement PWM generation, fault detection, current-loop state machines, and encoder decoding. The 4,608 logic elements provide enough combinational resources for three-phase PWM with dead-time insertion and hardware fault latches. The 142 I/Os allow connection to gate-driver inputs, current-sense ADCs, and encoder interfaces. The industrial temperature grade helps support the warm environment near IGBT modules and power stages. Designers should carefully isolate the sensitive 1.2 V core analogue PLL supply from the switching power stage noise. The PQFP package keeps the FPGA on the same board as the gate drivers, reducing propagation delay for safety-critical shutdown signals.
Được đề xuất
Video and Image Processing
With 119,808 RAM bits, the EP2C5Q208I8N can implement small line buffers, frame counters, and simple image filters for camera or display interfaces. The 142 I/Os are sufficient to connect to CMOS image sensors, parallel ADCs, and RGB display drivers. A typical pipeline uses the FPGA to perform Bayer interpolation, edge detection, or thresholding at pixel rates when the required filter taps fit within the logic-element budget. For larger frame stores, an external SDRAM is connected to a user I/O bank. The 208-pin PQFP format provides enough pins for 16-bit or 32-bit memory buses while still supporting video synchronisation signals and a host controller interface.
Được đề xuất
Communication Protocol Bridging
The FPGA can act as a flexible protocol bridge between UART, SPI, I2C, and parallel buses in networking and industrial equipment. Its 4,608 logic elements allow implementation of multiple independent protocol engines, FIFO buffers, and address decoding. The 142 I/Os permit parallel host buses and multiple serial ports to be connected simultaneously. SRAM-based configuration gives designers the ability to update protocol personality in the field, but requires a configuration flash device such as an EPCS device on the board. The industrial temperature grade and PQFP package simplify deployment in outdoor communication cabinets and factory networking nodes where space is constrained.
Được đề xuất
Test and Measurement Instruments
In oscilloscopes, logic analyzers, and data-acquisition systems, the EP2C5Q208I8N can handle trigger logic, sample buffering, and instrument control. The 119,808 RAM bits can store moderately deep sample buffers for single-shot measurements, while the 4,608 logic elements implement trigger state machines and post-processing. The 142 user I/Os allow connection to high-speed ADCs, DACs, external SRAM, and front-panel interface chips. The 1.2 V core and 90 nm process keep active power low enough for bench instruments with limited cooling. The 208-pin PQFP package provides enough pins for wide parallel converters and memory buses without needing costly high-density board technology.
Được đề xuất
Aerospace and Defense Subsystems
FPGAX sources the EP2C5Q208I8N for aerospace, defense, and long-life programs because the PQFP package is more inspectable and easier to rework in high-reliability assemblies than ultra-fine-pitch BGAs. The industrial temperature grade and mature 90 nm process provide a stable platform for sensor interfaces, encryption state machines, and communication preprocessing. Although the Cyclone II is not a radiation-hardened FPGA, it can be used in non-radiation-hardened avionics boxes where the system-level shielding provides adequate protection. Designers should plan for configuration memory redundancy and use recommended power-supply filtering to meet DO-254 style development goals.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2C5Q208I8N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2C5Q208I8 | EP2C5Q208C8N | EP2C5Q208C8 | EP2C5Q208C7N | EP2C5Q208C7 |
|---|---|---|---|---|---|---|
| Package | 208-PQFP (BFQFP-208) | 208-PQFP (BFQFP-208) - same | 208-PQFP (BFQFP-208) - same | 208-PQFP (BFQFP-208) - same | 208-PQFP (BFQFP-208) - same | 208-PQFP (BFQFP-208) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4608 | 4608 | 4608 | 4608 | 4608 | 4608 |
| User I/Os | 142 | 142 | 142 | 142 | 142 | 142 |
| Total RAM Bits | 119808 | 119808 | 119808 | 119808 | 119808 | 119808 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -8 | -8 | -8 | -8 | -7 | -7 |
| Temperature Grade | Industrial | Industrial | Commercial | Commercial | Commercial | Commercial |
| Lead-Free Finish (N suffix) | Yes | No | Yes | No | Yes | No |
Bảo phân biệt quan trọng
- Industrial temperature grade in an accessible 208-pin PQFP package (vsEP2C5Q208C8N)
- Pb-free N suffix for RoHS-sensitive assembly lines (vsEP2C5Q208I8)
- 208-pin PQFP is easier to inspect and rework than BGA equivalents (vsEP2C5F256I8N)
Ghi chú thiết kế
The EP2C5Q208I8N core must be powered from a clean 1.2 V rail. Place one 0.1 uF ceramic capacitor adjacent to each VCC pin and a 10 uF bulk capacitor on the main core supply plane. The VCCIO supplies should be separate from the core rail and matched to the I/O standard used by each bank. If the device has PLL analog power pins, use a ferrite bead with a dedicated filter capacitor to isolate the PLL supply from digital switching noise. Estimated: a Cyclone II design using 60% logic cells may draw on the order of 100-300 mA from the 1.2 V rail depending on clock rate, but exact current should be confirmed from the power estimator in Quartus.
The 208-pin PQFP package has a 0.5 mm pitch and requires accurate footprint design. Use the IPC standard land pattern as a starting point and ensure solder paste stencil apertures are sized for a 0.5 mm pitch QFP. Exposed-pad thermal relief, if present, should be connected to the ground plane with multiple vias for heat spreading. Route high-speed clock signals away from JTAG and configuration pins to reduce noise coupling. The N suffix parts are lead-free, so use lead-free assembly profiles and confirm component moisture sensitivity level from the official package datasheet.
SRAM-based FPGAs must reload their configuration bitstream after every power-up. A common pitfall is forgetting the configuration device or attempting to configure through JTAG only during prototyping. For production boards, include an EPCS serial flash or equivalent configuration memory connected to the dedicated CONF_DONE, nCONFIG, DCLK, DATA0 pins. Also ensure the bank voltages are powered before configuration; otherwise, the device may fail to enter user mode. Confirm the I/O standard of each bank matches the transceiver or memory interface before layout freeze.
The industrial-temperature I8N device is rated for wider ambient operation, but junction temperature is still determined by package thermal resistance, airflow, and total power dissipation. For a 208-pin PQFP, the primary heat path is through the leads and surrounding copper. Estimated: if the FPGA dissipates 0.5 W and the package thermal resistance is roughly 25-35 C/W with modest airflow, the junction-to-ambient rise is between 13 and 18 C. Provide airflow or a ground-plane heat-spreading area to keep the die below the maximum junction temperature listed in the Intel datasheet.
Thông tin tuân thủ
RoHS/lead-free inferred from the 'N' suffix in the Intel/Altera ordering code. No explicit REACH or conflict-minerals statement was present in the fetched data. The non-N alternatives do not carry the same lead-free designation.
