EP2SGX60DF780C4 - 60K LEs Stratix II GX FPGA 780-FBGA | Intel
MPN: EP2SGX60DF780C4 ✗ Cuối đờiEP2SGX60DF780C4 Tóm tắt
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing by the user via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are used to implement arbitrary combinational and sequential logic, soft processors, DSP pipelines, and high-speed serial interfaces. The Stratix II GX family in particular targets high-throughput serial I/O, embedding multi-gigabit transceivers alongside the programmable fabric.
Key features of the EP2SGX60DF780C4 include 60,440 logic elements, 2,544,192 bits of embedded memory, up to 717 MHz fabric performance, dedicated DSP blocks, and high-speed serial transceiver channels supporting multi-gigabit-per-second rates. The 780-FBGA package with 1 mm ball pitch and exposed-die construction enables dense board placement while providing adequate thermal performance. The 'C4' speed grade balances timing margin against dynamic power for cost-sensitive designs.
From an architectural standpoint, the Stratix II GX uses an ALM-based fabric (Adaptive Logic Modules) with each ALM capable of implementing up to 8 inputs of combinational logic, providing higher effective density than the previous 4-input LUT architecture. The 90 nm process supports embedded memory blocks of M512, M4K, and M-RAM types, and the transceiver blocks support standard serial protocols including PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI.
Typical applications include telecom line cards, high-speed serial interface bridging (PCIe, SRIO, XAUI), DSP co-processing for wireless baseband, test and measurement equipment, and broadcast video processing. The integration of transceivers with the programmable fabric eliminates the need for external PHY ICs, reducing BOM cost and board area.
When designing with this part, engineers must allocate sufficient decoupling and follow Altera/Intel PCB layout guidelines for the FBGA package, including via-in-pad or microvia stack-ups to escape the 1 mm pitch ball grid, and provide thermal relief through the exposed die pad and adequate copper area on inner/outer PCB layers.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not consolidated on any single distributor product page.
Bộ thay thế dễ dàng lắp đặt cho EP2SGX60DF780C4 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2SGX60DF780C4 (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, RoHS Status, Package Type, Operating Temperature.
EP2SGX60DF780C3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2SGX60DF780C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2SGX60DF780C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2SGX90F780C4
✅ Drop-In📋 Tham chiếu thay thế (không có trong danh mục)
EP2SGX60CF780C4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2SGX60CF780C5
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2SGX60DF780C4 Tỷ lệ tối đa & tính chất điện
| Device Family | Stratix II GX |
| Logic Elements | 60,440 |
| Embedded Memory Bits | 2,544,192 |
| User I/O Count | 364 |
| Maximum Internal Frequency | 717 MHz |
| Number of CLBs | 60,440 |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Package Type | 780-ball FC-FBGA |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 4 (C4) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant |
Hướng dẫn cấu hình chân EP2SGX60DF780C4 29 x 29 mm
Cấu hình chân cho EP2SGX60DF780C4 (29 x 29 mm gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2SGX60DF780C4.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2SGX60DF780C4 phù hợp cho 6 Áp dụngs: Telecom Line Card Interface Bridging, PCI Express Endpoint / Bridge, Wireless Baseband DSP Co-Processor, Test & Measurement Instrumentation, Broadcast Video Processing, Industrial High-Speed Serial Aggregation.
Telecom Line Card Interface Bridging
The EP2SGX60DF780C4 is well-suited for telecom line card interface bridging because its integrated multi-gigabit transceivers support protocols like SPI-4.2, SGMII, and XAUI used between line cards and framer/switch ASICs. The 60,440 logic elements accommodate packet-processing state machines and statistics counters, while 2,544,192 bits of embedded memory buffer descriptors and small lookup tables. With 717 MHz fabric and a 780-FBGA package providing 364 user I/Os, the device handles multiple parallel data paths plus serial backplane links without external PHY chips, reducing BOM and board complexity in dense line card layouts.
Được đề xuất
PCI Express Endpoint / Bridge
The EP2SGX60DF780C4 implements PCIe Gen1 endpoints and PIPE-logic bridges using its hard PCIe-compatible transceiver blocks and protocol IP. With 60,440 LEs the device can host a soft processor, scatter-gather DMA engines, and application-specific register interfaces on a single die. The 780-FBGA package exposes enough user I/Os for parallel local bus, DDR-style memory interfaces, and the PCIe x4 lane signals. Designers typically instantiate the Altera/Intel PCIe hard IP core and configure the device via the standard EPCS or JTAG chain, achieving a compact PCIe add-in card or embedded module.
Được đề xuất
Wireless Baseband DSP Co-Processor
In wireless baseband designs, the EP2SGX60DF780C4 acts as a co-processor offloading PHY-layer DSP such as FFT/iFFT, channel estimation, and FEC decoding from the host DSP or baseband ASIC. The dedicated DSP blocks plus 60,440 LEs deliver high multiply-accumulate throughput needed for 3G/4G signal chains, while the 2.5 Mbit embedded memory serves as coefficient and sample storage close to the processing elements. The 780-FBGA's 364 user I/Os and integrated transceivers simplify antenna-interface digital front-end and timing distribution in the radio card, accelerating prototype-to-deployment for custom baseband.
Được đề xuất
Test & Measurement Instrumentation
Test and measurement platforms benefit from the EP2SGX60DF780C4's combination of high logic density and high-speed serial I/O. Logic analyzer, protocol analyzer, and arbitrary waveform generator instruments use the 60K LEs for capture state machines, trigger sequencing, and DSP post-processing, while transceivers handle multi-gigabit serial data acquisition or stimulus generation up to 3.125 Gbps and beyond. The 780-FBGA's generous user I/O count accommodates parallel probe pods and front-panel display drivers. The commercial temperature grade (C) suits laboratory environments, and Altera's Quartus II toolchain supports RTL design and simulation.
Được đề xuất
Broadcast Video Processing
The EP2SGX60DF780C4 is commonly deployed in broadcast video routers, format converters, and SDI-based processing gear where it can simultaneously ingest multiple SDI streams via transceivers and perform real-time scaling, deinterlacing, and color-space conversion in fabric. The 60,440 LEs plus embedded memory handle multi-stream 3G-SDI pipelines at line-locked rates, while the 780-FBGA package provides the I/O count required for parallel video buses and host control interfaces. Designers use Altera/Intel SDI IP cores for SMPTE-compliant serial digital interfaces and free DSP Builder blocks for filter design.
Được đề xuất
Industrial High-Speed Serial Aggregation
In industrial automation, the EP2SGX60DF780C4 aggregates multiple high-speed sensor and machine-vision links (typically Camera Link, CoaXPress, or GigE Vision) into a unified backplane. Its transceivers deliver the multi-gigabit rates needed for machine vision, while the 60K LEs implement real-time image preprocessing such as Bayer decoding, region-of-interest extraction, and timestamp insertion. The 780-FBGA's I/O count and embedded memory buffer line-scan camera streams before handing processed data to the host controller, making the device a strong choice for vision-based quality inspection cells.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2SGX60DF780C4 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2SGX60DF780C3 | EP2SGX60DF780C3N | EP2SGX60DF780C5 | EP2SGX90F780C4 | EP2SGX60CF780C4 | EP2SGX60CF780C5 |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (DF780, 29x29 mm, 1 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 92,160 (+52%) | 60,440 | 60,440 |
| Speed Grade | C4 | C3 (faster) | C3 (faster) | C5 (slower) | C4 | C4 | C5 |
| Transceivers | Yes (GX series) | Yes (GX) | Yes (GX) | Yes (GX) | Yes (GX) | No (CF series) | No (CF series) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Bảo phân biệt quan trọng
- Higher logic density at same package footprint (vsEP2SGX30DF780C4)
- Faster speed grade than C5 at same density (vsEP2SGX60DF780C5)
- Transceiver integration vs CF non-GX variant (vsEP2SGX60CF780C4)
Ghi chú thiết kế
The 780-FBGA with 1 mm ball pitch requires microvia or via-in-pad PCB technology for reliable breakout. Use at minimum a 4-6 layer stack-up with dedicated ground and power planes adjacent to the top signal layer to control impedance and provide return paths. Per Altera/Intel Stratix II GX layout guidelines, all power pins must be decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 100 mils of the respective balls; bulk decoupling on each supply rail is also recommended.
Estimated: at typical Stratix II GX utilization of 60K LEs toggling at 50% at 300 MHz internal frequency, junction power is roughly 5-8 W. The FC-FBGA package relies on the PCB for primary heat dissipation; provide a continuous copper thermal pad array beneath the BGA and stitch vias to inner ground planes. At higher utilization or transceiver-heavy designs, attach a heatsink via thermal interface material (TIM) and ensure at least 200 LFM of forced-air cooling.
Common Stratix II GX design pitfalls include (1) confusing the C (commercial temperature) and I (industrial) suffixes - verify the actual operating environment matches the ordering code suffix, (2) using EPCS configuration devices without enabling the appropriate decompression and security features which can lock out field updates, and (3) failing to instantiate the reset and clock network correctly causing high jitter on transceiver reference clocks. Always simulate transceiver links with the Altera/Intel models and verify signal integrity with the IBIS-AMI models.
Thông tin tuân thủ
RoHS compliance indicated by 'N' suffix variants (e.g., EP2SGX60DF780C4N). Lead-free packaging per Altera/Intel product specifications. AEC-Q100 not applicable - this is a commercial-grade FPGA.