EP2SGX60DF780C4 - 60K LEs Stratix II GX FPGA 780-FBGA | Intel
부품 번호: EP2SGX60DF780C4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1350 | $1,350,000.00 |
EP2SGX60DF780C4 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing by the user via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are used to implement arbitrary combinational and sequential logic, soft processors, DSP pipelines, and high-speed serial interfaces. The Stratix II GX family in particular targets high-throughput serial I/O, embedding multi-gigabit transceivers alongside the programmable fabric.
Key features of the EP2SGX60DF780C4 include 60,440 logic elements, 2,544,192 bits of embedded memory, up to 717 MHz fabric performance, dedicated DSP blocks, and high-speed serial transceiver channels supporting multi-gigabit-per-second rates. The 780-FBGA package with 1 mm ball pitch and exposed-die construction enables dense board placement while providing adequate thermal performance. The 'C4' speed grade balances timing margin against dynamic power for cost-sensitive designs.
From an architectural standpoint, the Stratix II GX uses an ALM-based fabric (Adaptive Logic Modules) with each ALM capable of implementing up to 8 inputs of combinational logic, providing higher effective density than the previous 4-input LUT architecture. The 90 nm process supports embedded memory blocks of M512, M4K, and M-RAM types, and the transceiver blocks support standard serial protocols including PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI.
Typical applications include telecom line cards, high-speed serial interface bridging (PCIe, SRIO, XAUI), DSP co-processing for wireless baseband, test and measurement equipment, and broadcast video processing. The integration of transceivers with the programmable fabric eliminates the need for external PHY ICs, reducing BOM cost and board area.
When designing with this part, engineers must allocate sufficient decoupling and follow Altera/Intel PCB layout guidelines for the FBGA package, including via-in-pad or microvia stack-ups to escape the 1 mm pitch ball grid, and provide thermal relief through the exposed die pad and adequate copper area on inner/outer PCB layers.
This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not consolidated on any single distributor product page.
드롭인 대체품: EP2SGX60DF780C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX60DF780C4 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, RoHS Status, Package Type, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX60DF780C3
✅ 드롭인✓ 재고 있음
$218 / 개
데이터시트 보기 →EP2SGX60DF780C3N
✅ 드롭인✓ 재고 있음
$188 / 개
데이터시트 보기 →EP2SGX60DF780C5
✅ 드롭인✓ 재고 있음
$860.69 / 개
데이터시트 보기 →EP2SGX90F780C4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP2SGX60CF780C4
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP2SGX60CF780C5
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EP2SGX60DF780C4 최대 정격 & 전기적 특성
| Device Family | Stratix II GX |
| Logic Elements | 60,440 |
| Embedded Memory Bits | 2,544,192 |
| User I/O Count | 364 |
| Maximum Internal Frequency | 717 MHz |
| Number of CLBs | 60,440 |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Package Type | 780-ball FC-FBGA |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 4 (C4) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EP2SGX60DF780C4 29 x 29 mm 핀 구성 가이드
EP2SGX60DF780C4(29 x 29 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX60DF780C4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX60DF780C4 적합 용도: 6 애플리케이션s: Telecom Line Card Interface Bridging, PCI Express Endpoint / Bridge, Wireless Baseband DSP Co-Processor, Test & Measurement Instrumentation, Broadcast Video Processing, Industrial High-Speed Serial Aggregation.
Telecom Line Card Interface Bridging
The EP2SGX60DF780C4 is well-suited for telecom line card interface bridging because its integrated multi-gigabit transceivers support protocols like SPI-4.2, SGMII, and XAUI used between line cards and framer/switch ASICs. The 60,440 logic elements accommodate packet-processing state machines and statistics counters, while 2,544,192 bits of embedded memory buffer descriptors and small lookup tables. With 717 MHz fabric and a 780-FBGA package providing 364 user I/Os, the device handles multiple parallel data paths plus serial backplane links without external PHY chips, reducing BOM and board complexity in dense line card layouts.
추천
PCI Express Endpoint / Bridge
The EP2SGX60DF780C4 implements PCIe Gen1 endpoints and PIPE-logic bridges using its hard PCIe-compatible transceiver blocks and protocol IP. With 60,440 LEs the device can host a soft processor, scatter-gather DMA engines, and application-specific register interfaces on a single die. The 780-FBGA package exposes enough user I/Os for parallel local bus, DDR-style memory interfaces, and the PCIe x4 lane signals. Designers typically instantiate the Altera/Intel PCIe hard IP core and configure the device via the standard EPCS or JTAG chain, achieving a compact PCIe add-in card or embedded module.
추천
Wireless Baseband DSP Co-Processor
In wireless baseband designs, the EP2SGX60DF780C4 acts as a co-processor offloading PHY-layer DSP such as FFT/iFFT, channel estimation, and FEC decoding from the host DSP or baseband ASIC. The dedicated DSP blocks plus 60,440 LEs deliver high multiply-accumulate throughput needed for 3G/4G signal chains, while the 2.5 Mbit embedded memory serves as coefficient and sample storage close to the processing elements. The 780-FBGA's 364 user I/Os and integrated transceivers simplify antenna-interface digital front-end and timing distribution in the radio card, accelerating prototype-to-deployment for custom baseband.
추천
Test & Measurement Instrumentation
Test and measurement platforms benefit from the EP2SGX60DF780C4's combination of high logic density and high-speed serial I/O. Logic analyzer, protocol analyzer, and arbitrary waveform generator instruments use the 60K LEs for capture state machines, trigger sequencing, and DSP post-processing, while transceivers handle multi-gigabit serial data acquisition or stimulus generation up to 3.125 Gbps and beyond. The 780-FBGA's generous user I/O count accommodates parallel probe pods and front-panel display drivers. The commercial temperature grade (C) suits laboratory environments, and Altera's Quartus II toolchain supports RTL design and simulation.
추천
Broadcast Video Processing
The EP2SGX60DF780C4 is commonly deployed in broadcast video routers, format converters, and SDI-based processing gear where it can simultaneously ingest multiple SDI streams via transceivers and perform real-time scaling, deinterlacing, and color-space conversion in fabric. The 60,440 LEs plus embedded memory handle multi-stream 3G-SDI pipelines at line-locked rates, while the 780-FBGA package provides the I/O count required for parallel video buses and host control interfaces. Designers use Altera/Intel SDI IP cores for SMPTE-compliant serial digital interfaces and free DSP Builder blocks for filter design.
추천
Industrial High-Speed Serial Aggregation
In industrial automation, the EP2SGX60DF780C4 aggregates multiple high-speed sensor and machine-vision links (typically Camera Link, CoaXPress, or GigE Vision) into a unified backplane. Its transceivers deliver the multi-gigabit rates needed for machine vision, while the 60K LEs implement real-time image preprocessing such as Bayer decoding, region-of-interest extraction, and timestamp insertion. The 780-FBGA's I/O count and embedded memory buffer line-scan camera streams before handing processed data to the host controller, making the device a strong choice for vision-based quality inspection cells.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX60DF780C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX60DF780C3 | EP2SGX60DF780C3N | EP2SGX60DF780C5 | EP2SGX90F780C4 | EP2SGX60CF780C4 | EP2SGX60CF780C5 |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (DF780, 29x29 mm, 1 mm pitch) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 92,160 (+52%) | 60,440 | 60,440 |
| Speed Grade | C4 | C3 (faster) | C3 (faster) | C5 (slower) | C4 | C4 | C5 |
| Transceivers | Yes (GX series) | Yes (GX) | Yes (GX) | Yes (GX) | Yes (GX) | No (CF series) | No (CF series) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Higher logic density at same package footprint (vs EP2SGX30DF780C4)
- Faster speed grade than C5 at same density (vs EP2SGX60DF780C5)
- Transceiver integration vs CF non-GX variant (vs EP2SGX60CF780C4)
설계 노트
The 780-FBGA with 1 mm ball pitch requires microvia or via-in-pad PCB technology for reliable breakout. Use at minimum a 4-6 layer stack-up with dedicated ground and power planes adjacent to the top signal layer to control impedance and provide return paths. Per Altera/Intel Stratix II GX layout guidelines, all power pins must be decoupled with 0.1 uF and 10 uF ceramic capacitors placed within 100 mils of the respective balls; bulk decoupling on each supply rail is also recommended.
Estimated: at typical Stratix II GX utilization of 60K LEs toggling at 50% at 300 MHz internal frequency, junction power is roughly 5-8 W. The FC-FBGA package relies on the PCB for primary heat dissipation; provide a continuous copper thermal pad array beneath the BGA and stitch vias to inner ground planes. At higher utilization or transceiver-heavy designs, attach a heatsink via thermal interface material (TIM) and ensure at least 200 LFM of forced-air cooling.
Common Stratix II GX design pitfalls include (1) confusing the C (commercial temperature) and I (industrial) suffixes - verify the actual operating environment matches the ordering code suffix, (2) using EPCS configuration devices without enabling the appropriate decompression and security features which can lock out field updates, and (3) failing to instantiate the reset and clock network correctly causing high jitter on transceiver reference clocks. Always simulate transceiver links with the Altera/Intel models and verify signal integrity with the IBIS-AMI models.
규정 준수 정보
RoHS compliance indicated by 'N' suffix variants (e.g., EP2SGX60DF780C4N). Lead-free packaging per Altera/Intel product specifications. AEC-Q100 not applicable - this is a commercial-grade FPGA.