EP2SGX60DF780I3N - 60K LE Stratix II GX FPGA, 780-FBGA | Intel / Altera
MPN: EP2SGX60DF780I3N ✗ Cuối đờiEP2SGX60DF780I3N Tóm tắt
What is a Stratix II GX FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. Stratix II GX is a transceiver-equipped variant in the broader Stratix II family, engineered for high-speed serial I/O applications such as serial RapidIO, PCI Express, XAUI, and custom protocols. Within the FPGA taxonomy (FPGA → programmable logic → logic IC → integrated circuit), Stratix II GX sits at the high-performance, transceiver-rich tier.
Key differentiating features of the EP2SGX60DF780I3N include 60,440 logic elements, embedded multiplier blocks for DSP, dedicated high-speed serial transceivers supporting multi-gigabit data rates, and a rich on-chip memory hierarchy with TriMatrix memory blocks. The FC-FBGA-780 package supports industrial-grade thermal operation from -40 °C to +85 °C and is optimized for high signal-integrity designs with controlled-impedance escape routing.
Architecturally, Stratix II GX uses Altera's adaptive logic module (ALM) instead of the legacy 4-input LUT, delivering finer-grain logic packing and improved performance per logic element. The built-in transceivers operate at line rates suitable for 1 Gbps to 3.125 Gbps serial protocols and can be aggregated into 4- or 8-channel groups for parallel high-speed links. Dedicated hard IP blocks for PHY functions reduce soft-logic resource consumption and lower latency for memory and connectivity interfaces.
Typical applications include telecommunications line cards, baseband processing for wireless infrastructure, high-speed serial protocol bridging (PCIe, XAUI, Serial RapidIO), military and aerospace signal processing, broadcast video transport, and high-performance ASIC prototyping. The -I3 industrial speed grade and 1.2 V core operation make it suitable for thermally constrained embedded systems where reliability over the industrial temperature range is mandatory.
When designing with this FPGA, pay close attention to transceiver reference clock jitter, PCB stack-up for high-speed serial channels, and decoupling strategy near each transceiver quad. The 1.00 mm ball pitch requires microvia or fine-line PCB fabrication; through-hole vias on BGA pads are not recommended. Quartus II software (version supporting Stratix II GX) is required for design entry, synthesis, place-and-route, and programming file generation.
This page consolidates distributor stock and pricing (as of 2026-09-09), curated same-package drop-in alternatives, and design notes not aggregated on any single manufacturer or distributor page.
Bộ thay thế dễ dàng lắp đặt cho EP2SGX60DF780I3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2SGX60DF780I3N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, RoHS Status, Core Supply Voltage, DSP Blocks.
EP2SGX60DF780C7
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Xem tài liệu →EP2SGX60DF780I3N Tỷ lệ tối đa & tính chất điện
| Family | Stratix II GX |
| Series | EP2SGX60 |
| Logic Elements | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 |
| Tần số xung maksimum | 622.08 MHz |
| Process Technology | 90 nm CMOS |
| Nominal Core Supply Voltage | 1.2 V |
| Hộp | 780-ball FC-FBGA (S-PBGA-B780) |
| Terminal Pitch | 1.00 mm |
| Kiểu lắp đặt | Surface Mount |
| Khoảng nhiệt độ hoạt động | -40 °C to +85 °C (Industrial) |
| Speed Grade | I3 |
| High-Speed Serial Transceivers | Multi-gigabit embedded transceivers (per Stratix II GX family) |
| On-chip Memory | TriMatrix embedded memory blocks (per Stratix II GX family) |
| Logic Element Architecture | Adaptive Logic Module (ALM) |
| DSP Blocks | Embedded multiplier/DSP blocks (per Stratix II GX family) |
| Design Tool | Quartus II (Stratix II GX support) |
Hướng dẫn cấu hình chân EP2SGX60DF780I3N 780-ball fc-fbga (s-pbga-b780)
Cấu hình chân cho EP2SGX60DF780I3N (780-ball fc-fbga (s-pbga-b780) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2SGX60DF780I3N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2SGX60DF780I3N phù hợp cho 6 Áp dụngs: Telecommunications Line Cards, Wireless Baseband Processing, PCI Express Endpoint / Root Complex, High-Speed Serial Protocol Bridging, High-Performance ASIC Prototyping, Broadcast Video Transport.
Telecommunications Line Cards
The EP2SGX60DF780I3N's 60,440 logic elements and embedded multi-gigabit transceivers make it a strong fit for telecom line cards handling serial protocols such as SPI-4.2, XAUI, and Serial RapidIO. Its 622 MHz internal clock supports packet-header processing and traffic-manager logic, while the 780-ball FC-FBGA exposes enough transceiver quads to feed multiple SFP+ cages. Industrial temperature rating allows deployment in thermally exposed outdoor cabinets, though designers must validate junction temperature because transceiver activity drives significant on-die power.
Được đề xuất
Wireless Baseband Processing
Stratix II GX embedded DSP blocks and TriMatrix memory suit baseband processing for wireless infrastructure such as LTE eNodeB and WiMAX base stations. With 60,440 logic elements and dedicated 18x18 multipliers, the EP2SGX60DF780I3N can handle multiple antenna streams for MIMO processing while sustaining the multi-gigabit backhaul links through its transceivers. Industrial -40 to +85 °C operation enables outdoor remote-radio-head deployments with appropriate thermal design and conformal coating.
Được đề xuất
PCI Express Endpoint / Root Complex
The EP2SGX60DF780I3N's embedded transceivers implement PCI Express Gen1 hard IP, supporting endpoint or root-complex designs in test equipment, RAID controllers, and industrial compute modules. Its 60,440 logic elements accommodate protocol-stack plus DMA engines and user logic, while the 780-ball FC-FBGA escape routing cleanly supports one x8 PCIe link plus sideband signals. Quartus II includes the PCIe Compiler wizard that generates the PHY, data link, and transaction layers, dramatically shortening time-to-prototype.
Được đề xuất
High-Speed Serial Protocol Bridging
For protocol-bridging applications such as Serial RapidIO to Ethernet or XAUI to SPI bridging, the EP2SGX60DF780I3N provides multiple transceiver channels that can each run at independent line rates. The 60,440 logic elements support bridge FIFOs, packet parsing, and traffic shaping in a single device, removing the need for an external companion ASIC. Industrial temperature rating permits deployment in factory-floor protocol converters and railway signaling aggregators.
Được đề xuất
High-Performance ASIC Prototyping
The EP2SGX60DF780I3N's 60,440 logic elements and abundant user I/O make it a workhorse FPGA for ASIC prototyping where mid-complexity ASIC RTL is mapped onto FPGA fabric for verification. Designers can chain multiple boards via the multi-gigabit transceivers to emulate multi-million-gate ASICs at near-ASIC clock rates. Quartus II supports incremental compilation and partition-based design flows that match ASIC block-level verification methodologies, making this device a strong fit for IP-validation labs.
Được đề xuất
Broadcast Video Transport
Broadcast video routers, contribution encoders, and studio-to-transmitter links rely on multi-gigabit serial interfaces such as SDI, HD-SDI, and 3G-SDI, all of which the EP2SGX60DF780I3N's transceivers can carry alongside embedded audio and ancillary data. The 60,440 logic elements host video format conversion, frame synchronization, and multiplexing logic in a single chip. Industrial temperature rating supports installation in temperature-uncontrolled broadcast facilities and mobile production trucks.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2SGX60DF780I3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2SGX60DF780C7 | EP2SGX60CF780I5N | EP2SGX60CF780I4N | EP2SGX60DF780C5N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FC-FBGA (1.00 mm pitch) | 780-ball FC-FBGA (1.00 mm pitch) - same | 780-ball FC-FBGA (1.00 mm pitch) - same | 780-ball FC-FBGA (1.00 mm pitch) - same | 780-ball FC-FBGA (1.00 mm pitch) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Process / Core Voltage | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Speed Grade | I3 | C7 (slower than I3) | I5 (faster than I3) | I4 (faster than I3) | C5 (slower than I3) |
| Embedded Transceivers | Multi-gigabit (per family) | Multi-gigabit (per family) - same | Multi-gigabit (per family) - same | Multi-gigabit (per family) - same | Multi-gigabit (per family) - same |
| Design Tool | Quartus II (Stratix II) | Quartus II (Stratix II) - same | Quartus II (Stratix II) - same | Quartus II (Stratix II) - same | Quartus II (Stratix II) - same |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Bảo phân biệt quan trọng
- Same-die speed grade variety on identical 780-FBGA footprint (vsEP2SGX60DF780C7)
- Faster silicon option on identical footprint (vsEP2SGX60CF780I4N)
- 60K LE density tier within Stratix II GX family (vsEP2SGX30DF780I4N)
Ghi chú thiết kế
The 780-ball FC-FBGA package uses a 1.00 mm ball pitch, which mandates microvia (laser-drilled or plasma-etched) PCB fabrication rather than conventional through-hole vias on the BGA pads. Stack-up should target 8-12 layers with dedicated ground planes under the FPGA body and short, matched-length escape traces for transceiver channels. BGA under-fill is recommended for high-vibration environments (railway, aerospace) but adds rework complexity - factor this into your manufacturing test plan.
Stratix II GX devices at full transceiver utilization can dissipate 10-15 W, so a heatsink with thermal interface material is typically required even in the industrial temperature range. Compute junction temperature rise using Theta_JA from the device handbook multiplied by estimated dynamic power in Quartus II PowerPlay analysis. Design the enclosure airflow to keep the case temperature below 70 C when ambient is at the 85 C upper limit, otherwise timing closure at -40 C cold-start and 85 C hot-swap must both be re-verified.
Do not assume all 'EP2SGX60' suffixes are interchangeable. Speed grade (I3 vs C7 vs I5), temperature grade (industrial vs commercial), and ball-map variant (DF780 vs FF780) all differ. Cross-check the '780-FBGA' indicator in the package field plus the speed/temperature letter pair before substituting on the production line. Quartus II must be re-run on the substituted part because the fitter database differs across speed grades even when logic resources are identical.
Multi-gigabit transceiver channels require controlled-impedance differential routing (typically 100 ohm differential) with continuous reference planes and minimal discontinuities. Use the Altera Stratix II GX High-Speed Board Design Guidelines for via geometry, AC-coupling capacitor placement, and transmitter pre-emphasis / receiver equalization settings. Pre-layout simulation with the IBIS-AMI models supplied by Altera is highly recommended for line rates above 3 Gbps.
Thông tin tuân thủ
Detailed per-lot RoHS / REACH / lead-free status was not present in the verified web data and is marked [DATA_NEEDED] in the specs. AEC-Q100 is not applicable because this is a high-density industrial FPGA, not an automotive-grade IC; designers targeting AEC-Q100 should evaluate Stratix IV/V automotive variants.
