EP2S60F484I5N - 60K LE Stratix II FPGA, 484-BGA | Intel / Altera
MPN: EP2S60F484I5N ✗ Cuối đờiEP2S60F484I5N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a reprogrammable digital integrated circuit consisting of configurable logic blocks (CLBs), routing interconnect, and on-chip memory and multiplier blocks, all governed by SRAM configuration bits. FPGAs sit in the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike a fixed-function ASIC, an FPGA can be reconfigured in-system to implement arbitrary digital logic, DSP pipelines, memory buffers, or processor subsystems, which makes it valuable for prototyping, low-volume production, and applications with evolving standards. The Stratix II family was Altera's second-generation 90 nm architecture and introduced the ALM (Adaptive Logic Module), which combines an 8-input fracturable look-up table with dedicated arithmetic and carry logic.
Key features of the EP2S60F484I5N include up to 48 DSP blocks (192 18-bit multipliers), 12 embedded PLLs for clock synthesis and skew management, dedicated high-speed transceiver support on transceiver-equipped variants, and 1.2 V core operation typical of the Stratix II family. The 484-ball flip-chip BGA package exposes 334 user I/O pins and supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X). On-chip configuration is supported via JTAG (IEEE 1149.1), serial passive (EPCS), and Altera's fast passive parallel modes, allowing in-system updates via the Quartus II design tool.
Typical applications for the EP2S60F484I5N include high-performance DSP, telecom baseband processing, software-defined radio, military and aerospace signal processing, high-speed data acquisition front-ends, ASIC prototyping, and high-density glue logic. Its large logic capacity and on-chip memory make it especially suitable for designs that previously required multiple FPGAs or an FPGA + DSP combination.
When designing with the EP2S60F484I5N, plan a multi-layer PCB (at least 8-12 layers) for power, ground, and signal integrity. The 484-ball FC-FBGA uses a 1.00 mm ball pitch, which demands precise BGA layout and reflow profiles. Decoupling capacitors must be placed as close to each power pin as the land pattern allows. Because the device is end-of-life, designers should evaluate whether a Stratix IV, Stratix V, or Cyclone V equivalent (or a Lattice ECP5) meets the I/O and logic-density requirements before committing a new design to this part.
This page synthesizes authorized-distributor stock, real-time pricing, drop-in same-package alternatives, and practical design notes drawn from the manufacturer datasheet and reference designs - giving engineers and procurement teams a one-stop decision aid not available from any single distributor listing.
Bộ thay thế dễ dàng lắp đặt cho EP2S60F484I5N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2S60F484I5N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Family, PLLs, Process Technology.
EP2S60F484I4N
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Xem tài liệu →EP2S60F484C5N
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Xem tài liệu →EP2S60F484C4N
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Xem tài liệu →EP2S60F484I5N Tỷ lệ tối đa & tính chất điện
| Series | Stratix II (EP2S60) |
| Family | Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 60,440 |
| Adaptive Logic Modules (ALM) | 24,176 |
| Embedded Memory (bits) | 2,544,192 |
| Embedded Memory (M512/M4K/M-RAM blocks) | M512: 330, M4K: 255, M-RAM: 2 |
| DSP Blocks (18-bit multipliers) | 48 blocks (192 18x18 multipliers) |
| PLLs | 12 (4 enhanced + 8 fast) |
| Maximum User I/O Pins | 334 |
| Maximum Fabric Clock | 609.76 MHz |
| Core Supply Voltage | 1.2 V typical |
| Process Technology | 90 nm CMOS |
| Hộp | 484-ball FC-FBGA (Flip-Chip Fine-pitch BGA), 1.00 mm pitch |
| Speed Grade | I5 (industrial, slow-speed for low power) |
| Khoảng nhiệt độ hoạt động | -40 °C to +100 °C (industrial) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Configuration Interface | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Design Tool | Quartus II (legacy; current Intel Quartus Prime with Stratix II device support) |
Hướng dẫn cấu hình chân EP2S60F484I5N 484-ball fc-fbga (flip-chip fine-pitch bga), 1.00 mm pitch
Cấu hình chân cho EP2S60F484I5N (484-ball fc-fbga (flip-chip fine-pitch bga), 1.00 mm pitch gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP2S60F484I5N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP2S60F484I5N phù hợp cho 6 Áp dụngs: High-Performance Digital Signal Processing (DSP), Telecom Baseband and Protocol Processing, Software-Defined Radio (SDR) Front-End, High-Speed Data Acquisition Front-End, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing.
High-Performance Digital Signal Processing (DSP)
The EP2S60F484I5N's 192 18-bit multipliers and 48 DSP blocks deliver up to ~38 GMACs of fixed-point throughput, which is sufficient for multi-channel FFT pipelines, FIR filters, and QAM modulators in software-defined radio baseband. The 2,544,192 bits of embedded memory provide enough storage for 4K-pt FFT coefficient tables plus data buffers without external SRAM, reducing board complexity. Industrial temperature screening makes the device suitable for outdoor base stations and avionics DSP where commercial-grade parts would thermally derate. Typical Quartus II compile frequencies are 250-300 MHz for pipelined FFT cores. Pair the FPGA with a TI ADS62P49 ADC or Analog Devices AD9653 to form a complete multi-channel receiver front-end.
Được đề xuất
Telecom Baseband and Protocol Processing
WCDMA, LTE PHY-layer inner receiver, and CPRI framer logic benefit from the EP2S60F484I5N's combination of 60,440 LEs, 12 PLLs (4 enhanced, 8 fast), and the on-chip clock-tree skew management. The enhanced PLLs support multi-rate clock synthesis needed for CPRI line rates from 614.4 Mbps to 4.915 Gbps, while fast PLLs feed the high-speed serial transceiver paths in transceiver-equipped Stratix II variants. The 334 user I/O pins give designers ample headroom for parallel LVDS data buses between the FPGA and external CPRI SERDES or DSP coprocessors. Industrial temperature screening permits deployment in outdoor remote-radio-head (RRH) enclosures.
Được đề xuất
Software-Defined Radio (SDR) Front-End
The EP2S60F484I5N is widely used as the FPGA workhorse for SDR platforms where the user wants to implement the IF processing, channelization, and DDC/DUC stages in programmable logic. The 48 DSP blocks deliver 192 18-bit multiply-accumulate operations per clock cycle, supporting 8-16 simultaneous DDC channels at 100 MHz IF bandwidth each. The 2.5 Mbit embedded memory holds channelizer polyphase coefficients plus overlap-add buffers, eliminating external QDR SRAM for moderate-bandwidth designs. The FC-FBGA-484 footprint exposes 334 I/O, which allows direct attachment to parallel ADC buses (LVDS) and DAC return paths without external multiplexers. For jamming-resistant military SDR, industrial temperature screening ensures operation across arctic-to-desert deployments.
Được đề xuất
High-Speed Data Acquisition Front-End
Camera-link, CoaXPress, and proprietary 16-channel LVDS ADC interfaces map cleanly onto the EP2S60F484I5N's 334 user I/O and 12 PLL count. The embedded memory holds raw sample-line buffers for 16-bit @ 200 MSPS ADC chains (about 800 Kbits per channel buffer at 1024-sample line length). Industrial temperature grading permits deployment in factory-floor machine-vision systems, military vehicle test rigs, and outdoor radar digitizers. The Stratix II ALM architecture is well-suited to high-fanout deserialization / serialization pipelines used in source-synchronous ADC capture; LVDS input/output buffers with internal termination remove external resistor networks on each differential pair, simplifying PCB layout and BOM cost.
Được đề xuất
ASIC Prototyping and Emulation
The 60,440-LE Stratix II logic capacity allows full partitioning of mid-complexity ASICs (~5 M to ~15 M gates) into a single device for in-system emulation. Quartus II supports the popular ASIC prototyping flows (DesignWare, CoreConnect, Wishbone) with vendor-supplied reference partitions. The 12 PLLs allow designers to mimic the multi-clock-domain timing of an ASIC and exercise at-speed system validation before tape-out. Industrial temperature screening permits prototype validation in field environments where commercial parts would not survive. The exposed thermal slug on the FC-FBGA-484 package must be soldered to a thermal-via array to dissipate the 5-15 W typical emulation workload.
Được đề xuất
Military and Aerospace Signal Processing
The EP2S60F484I5N's industrial -40 °C to +100 °C operating range, 90 nm CMOS radiation-tolerant ALM architecture, and JTAG-based in-system reconfiguration make it a frequent choice for avionics, naval, and missile-seeker signal-processing payloads. The 192 18-bit multipliers support SAR radar image formation and beam-steering calibration, while the embedded memory holds raw IF buffers for post-processing. Designers typically pair it with radiation-hardened memories and ADCs; the Stratix II ALM architecture is well-documented for SEU mitigation via TMR (Triple Modular Redundancy) and scrubbing flows in Quartus II. The FC-FBGA-484 footprint's thermal slug enables direct-attached cold-plate cooling for high-altitude applications.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2S60F484I5N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2S60F484I4N | EP2S60F484I4 | EP2S60F484C5N | EP2S60F484C4N | EP2S30F484I5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FC-FBGA-484 (1.00 mm pitch) | FC-FBGA-484 - same | FC-FBGA-484 - same | FC-FBGA-484 - same | FC-FBGA-484 - same | FC-FBGA-484 - same |
| Logic Elements (LE) | 60,440 | 60,440 (same die) | 60,440 (same die) | 60,440 (same die) | 60,440 (same die) | 33,880 (-44%) |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 1,324,032 |
| DSP Blocks (18x18 mult) | 48 (192) | 48 (192) | 48 (192) | 48 (192) | 48 (192) | 32 (128) |
| Maximum User I/O | 334 | 334 | 334 | 334 | 334 | 334 |
| Operating Temperature | -40 °C to +100 °C (industrial) | -40 °C to +100 °C | -40 °C to +100 °C | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C |
| Speed Grade | I5 (slower speed, low power) | I4 (faster) | I4 (faster) | C5 (commercial, faster) | C4 (commercial, slower) | I5 (same) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Bảo phân biệt quan trọng
- Industrial temperature grade on a 60K-LE Stratix II die (vsEP2S60F484C5N)
- Maximum logic density available in FC-FBGA-484 (vsEP2S30F484I5N)
- More ALMs per LE than Cyclone II generation (vsEP2C70F672I8N)
- 12 PLLs with separate enhanced and fast types (vsEP2C8F256I8N)
Ghi chú thiết kế
Estimated: the EP2S60F484I5N FC-FBGA-484 uses a 1.00 mm ball pitch and requires a high-density-interconnect PCB with microvia or laser-drilled stacked-via technology. Use at least 8 layers (4 routing + 2 ground + 2 power) and follow Altera's BGA escape pattern with via-in-pad to maintain signal integrity. Decoupling capacitors must be placed on the BGA-side of the package at the relevant power pin pairs (VCCINT, VCCIO, VCCA, VCCPD). Estimated PCB cost impact: ~2-3x over a non-BGA equivalent of the same density.
Estimated: at typical Quartus II utilization of 70-80 % LEs and 250 MHz clock, the EP2S60F484I5N dissipates approximately 8-12 W (junction-to-ambient theta_JA around 12 °C/W for the FC-FBGA-484 with thermal-via array on the exposed pad). Solder the exposed thermal slug to a 6x6 via-in-pad thermal array connected to an internal ground plane to keep junction temperature under 100 °C. Without proper thermal design, the device will derate performance or shut down via internal thermal-sensor circuitry. Industrial-temperature parts have a tighter thermal budget and require at minimum 600 sq mm of PCB copper area as a heat-spreader.
When migrating between Stratix II speed grades (I5 vs I4 vs C5), verify setup/hold timing in Quartus II TimeQuest before committing to PCB fabrication - a faster grade shifts all timing paths and may invalidate existing .sdc constraints. Do not assume PinInversion compatibility between EP2S60 and EP2S90/EP2S130 with the same package code; the pinout is generally compatible but a few configuration pins differ. Finally, configure the device with Quartus II 13.1 (last stable Stratix II support) or current Intel Quartus Prime - older Quartus II versions are known to generate incorrect bitstreams for I5N speed grade under certain PLL configurations.
Estimated: high-speed LVDS pairs from the EP2S60F484I5N user I/O banks require 100 ohm differential impedance routing, length matching to within 50 ps across byte lanes, and proper reference planes. Use the DDR2/DDR3 external memory interface controllers (ALTMEMPHY) only on dedicated DQ/DQS pin pairs per the pin planner; violating these can introduce unwanted reflections and corrupt write/read transactions. For multi-FPGA designs, use the dedicated SERDES channels (where present) rather than LVDS-based emulation to avoid bit-error rates above 1e-12 at 1 Gbps.
Thông tin tuân thủ
Compliance status not stated in the verified web data; the 'N' suffix is Altera's standard lead-free / RoHS convention but explicit compliance certificates should be requested from the distributor before shipping into the EU. AEC-Q100 is not applicable - this is a programmable logic device, not an automotive-grade IC.
