EP3C55F484C7 - Cyclone III FPGA, 55K LE, 484-FBGA | Intel
MPN: EP3C55F484C7 ⚠ Lần mua cuốiEP3C55F484C7 Tóm tắt
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program after manufacture to implement custom digital logic, signal processing pipelines, or interface bridges. FPGAs sit between general-purpose microcontrollers (fixed instruction set, software-defined behaviour) and ASICs (custom silicon, fixed hardware) - offering hardware-timed parallelism with no NRE mask cost and rapid design iteration. The Cyclone III family specifically targets low-static-power applications and is a subclass of SRAM-based FPGAs, where configuration is loaded from an external flash at every power-up.
Key features of the EP3C55F484C7 include support for up to 4 PLLs, embedded multiplier blocks for DSP operations, dedicated DDR/DDR2 SDRAM memory interfaces with dedicated DQS pins, and configurable I/O standards including LVDS, SSTL, and HSTL. The device is configured via serial or parallel flash using industry-standard JTAG or Active Serial (AS) modes. Its 484-ball FineLine BGA package provides ample I/O headroom and excellent signal-integrity performance for parallel buses and high-speed memory interfaces.
Typical applications include industrial motor control, video surveillance IP cameras, automotive infotainment subsystems, programmable logic controllers (PLCs), embedded vision and machine-vision pipelines, and low-power software-defined radio front-end pre-processing. The large logic capacity also makes it suitable for telecom protocol bridging and ASIC prototyping in mid-volume production.
When designing with this part, ensure the PCB has a clean multi-layer stack-up with continuous ground planes under the BGA to maintain signal integrity for DDR2 interfaces. Use the Altera/Intel Quartus II design suite (or the maintained Quartus Prime 13.0sp1 legacy branch) for synthesis, place-and-route, and timing closure.
Bộ thay thế dễ dàng lắp đặt cho EP3C55F484C7 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3C55F484C7 (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.
EP3C55F484C7N
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Xem tài liệu →EP3C55F484C6N
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Xem tài liệu →EP3C55F484C6
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3C55F484C8N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C55F484C8
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3C55F484I7N
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Xem tài liệu →EP3C55F484C7 Tỷ lệ tối đa & tính chất điện
| Device Family | Cyclone III |
| Logic Elements (LE) | 55,856 |
| Logic Array Blocks (LABs) | 3,495 |
| Embedded Memory Bits | 2,396,160 bits |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each |
| Embedded 18x18 Multipliers | 156 |
| Maximum User I/Os | 327 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Internal Operating Frequency (max) | 472 MHz |
| Process Technology | 65 nm TSMC low-k CMOS |
| Core Voltage | 1.2 V |
| Hộp | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Trạng thái RoHS | Compliant (lead-free FBGA) |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG |
| Configuration Memory Type | SRAM (volatile, requires external flash) |
Hướng dẫn cấu hình chân EP3C55F484C7 fbga-484 (fineline bga, 23 × 23 mm, 1.0 mm pitch)
Cấu hình chân cho EP3C55F484C7 (fbga-484 (fineline bga, 23 × 23 mm, 1.0 mm pitch) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3C55F484C7.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3C55F484C7 phù hợp cho 6 Áp dụngs: Industrial Motor Control and PLCs, Video Surveillance and Machine Vision, Automotive Infotainment Subsystems, Telecom Protocol Bridging and TDM Switching, ASIC Prototyping and Emulation, Software-Defined Radio Front-End Pre-Processing.
Industrial Motor Control and PLCs
The EP3C55F484C7 fits industrial motor control and PLC applications because its 55,856 logic elements and 156 embedded 18 × 18 multipliers provide ample parallel DSP throughput for field-oriented control (FOC) algorithms and encoder interpolation. The 327 user I/Os accommodate multiple incremental/absolute encoder interfaces, gate-driver PWM outputs, and industrial communication buses. Industrial-grade variants (I-temp) are available in the same FBGA-484 footprint, supporting -40 °C to +100 °C operation. Quartus II reference designs include Qsys-based PLC cores. Designers should ensure differential pairs for high-speed encoder feedback are length-matched within ±50 mils to maintain jitter margin.
Được đề xuất
Video Surveillance and Machine Vision
The EP3C55F484C7 is well-suited for IP camera and machine-vision pre-processing pipelines because its 2,396,160 embedded memory bits provide frame-buffer capacity for image statistics, and the 156 hardware multipliers accelerate Sobel, Laplacian, and convolution kernels used in edge detection. The 472 MHz internal Fmax enables real-time processing of 720p30 video streams with headroom. DDR2 external memory interfaces (up to 200 MHz / 400 Mbps) connect to commodity SDRAM for line buffers and frame storage. The 484-ball FBGA provides ample LVDS pairs for camera sensor interfaces; high-speed MIPI CSI-2 requires an external bridge device.
Được đề xuất
Automotive Infotainment Subsystems
The EP3C55F484C7 can be used in automotive infotainment subsystems (non-safety-critical) because its 55,856 LEs and 327 user I/Os support multi-display LVDS output, CAN/LIN bus bridging, and audio DSP mixing. The 484-ball FBGA package provides high pin density for automotive PCBs while supporting I/O voltages from 1.5 V to 3.3 V for legacy automotive peripherals. Industrial temperature variants (I7 speed grade) extend operating range to -40 °C to +100 °C, meeting cabin and head-unit requirements. Designers should follow IPC-7351 BGA land-pattern guidelines and use ENIG surface finish for automotive vibration tolerance.
Được đề xuất
Telecom Protocol Bridging and TDM Switching
The EP3C55F484C7 is a strong fit for telecom protocol bridges (T1/E1 to Ethernet, HDLC to UART) because its high global-clock count (20) and 4 PLLs support multiple independent timing domains needed for TDM-to-packet conversion. The 2,396,160 embedded memory bits serve as elastic buffers for clock-rate adaptation, and the 327 user I/Os handle multiple serial links. Industrial temp variants enable outside-plant deployment. Quartus II provides ALT2GXB reference designs for legacy telecom SERDES bridging when paired with external transceiver PHYs.
Được đề xuất
ASIC Prototyping and Emulation
The EP3C55F484C7 supports ASIC prototyping and pre-silicon emulation because its 55,856 LEs, 260 M9K memory blocks, and 156 multipliers map cleanly to mid-size ASIC RTL blocks running at moderate clock rates. The FBGA-484 footprint exposes enough I/Os to probe internal ASIC nodes for bring-up debugging. Designers should partition target ASIC logic across multiple FPGAs for larger designs and use Quartus II's LogicLock feature to constrain place-and-route regions to match ASIC timing paths.
Được đề xuất
Software-Defined Radio Front-End Pre-Processing
The EP3C55F484C7 fits SDR front-end pre-processing (decimation, channelization, digital down-conversion) because its 156 hardware 18 × 18 multipliers enable high-throughput FIR filter and CORDIC mixer stages, and its 260 M9K blocks provide coefficient and sample-storage memory. The 472 MHz internal clock lets designers implement multi-stage polyphase filter banks. LVDS I/O pairs handle high-speed ADC data capture. Designers targeting this application should plan for external ADCs like AD9238 or AD9644 and verify AC timing budgets against the C7 speed grade in the datasheet.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3C55F484C7 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3C55F484C7N | EP3C55F484C6N | EP3C55F484C6 | EP3C55F484C8N | EP3C55F484I7N |
|---|---|---|---|---|---|---|
| Package | FBGA-484 (23 × 23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| Embedded 18x18 Multipliers | 156 | 156 | 156 | 156 | 156 | 156 |
| Maximum User I/Os | 327 | 327 | 327 | 327 | 327 | 327 |
| Speed Grade | C7 (Fmax ≈ 472 MHz) | C7 | C6 (slower) | C6 (slower) | C8 (slowest) | I7 (industrial temp, C7 speed) |
| Operating Temperature | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C (Industrial) |
| RoHS / Lead-Free | Lead-free FBGA | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free FBGA | Lead-free (N suffix) | Lead-free (N suffix) |
Bảo phân biệt quan trọng
- Highest speed grade available in Cyclone III family (vsEP3C55F484C8N)
- Same 484-ball FBGA footprint across all alternatives (vsEP3C55F484I7N)
- Lead-free RoHS option without electrical change (vsEP3C55F484C7N)
Ghi chú thiết kế
Estimated: at 50% toggle rate on a typical design, the EP3C55F484C7 core draws approximately 0.5-0.8 A from the 1.2 V VCCINT rail. Use a 4-layer PCB with a dedicated VCCINT plane, and place 100 µF bulk + 0.1 µF + 1 µF ceramic decoupling clusters within 5 mm of the BGA balls. The VCCA_PLL rail requires additional filtering: a ferrite bead in series with a 10 µF + 0.1 µF decoupling pair to minimize PLL jitter. Total worst-case supply current is approximately 1.5 A on VCCINT plus per-bank VCCIO current proportional to I/O toggle rate.
The FBGA-484 has 1.0 mm ball pitch - design the PCB with 0.5 mm via-in-pad and ENIG surface finish for manufacturability. According to Intel's Cyclone III pin connection guidelines, leave unused I/O pins configured as input with weak pull-up enabled to minimize power. Differential pairs (LVDS) must be length-matched within ±100 mils to maintain DDR interfaces at 200 MHz. Provide at least four GND vias per BGA quadrant stitched to a continuous ground plane for thermal and signal-integrity performance.
Do not assume newer Quartus Prime releases support Cyclone III - they do not. Use Quartus II 13.0sp1 (legacy free download) for compile and programming file generation. When using a C7-to-C6 speed-grade downgrade as a cost-saving measure, always re-run static timing analysis; a design with zero slack margin on C7 will fail on C6. The configuration flash (EPCS4/EPCS16) must match the .pof file's compression mode or the FPGA will not configure. Reserve at least 1 second between power-up and JTAG programming attempts to avoid inrush reset glitches.
Thông tin tuân thủ
Lead-free FBGA per Cyclone III device datasheet. RoHS and REACH compliance per Intel product environmental certification page. AEC-Q100 not applicable for FPGA product family; I7 industrial temperature variants available separately.
