EP3SE260F1517I3 - 255K LE Stratix III FPGA, 976 I/O | Intel
MPN: EP3SE260F1517I3 ✓ Hoạt độngEP3SE260F1517I3 Tóm tắt
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows engineers to implement arbitrary digital logic functions through a matrix of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs occupy the middle ground between ASICs (Application-Specific Integrated Circuits) and general-purpose processors: unlike ASICs they are reconfigurable after manufacture, but unlike microcontrollers they execute logic in dedicated parallel hardware rather than via sequential software. Stratix III E devices specifically target high-performance digital signal processing, high-speed serial connectivity, and embedded memory applications in communications infrastructure, broadcast video, and military systems.
Key differentiating features of the EP3SE260F1517I3 include 255,000 logic elements (the largest Stratix III E density), 16.67 Mbits of embedded RAM (M9K + MLAB blocks), up to 717 MHz core fabric performance, and a 1.0 V core supply with multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. The industrial temperature grade (-40C to +100C ambient, with 125C junction capability) makes the part suitable for thermally demanding applications.
The device is implemented on TSMC's 65 nm process node with a 12-layer metal stack optimized for signal integrity and power. Internal voltage scaling, programmable power technology, and fine-grained clock gating reduce dynamic power by up to 50% compared to Stratix II at equivalent performance, while the dedicated MLAB (memory logic array block) architecture allows each LAB to be configured either as logic or as distributed memory.
Typical applications for the EP3SE260F1517I3 include high-end telecommunications base stations, ASIC prototyping and emulation, high-definition video broadcast encoders, medical imaging accelerators, military signal intelligence platforms, and high-performance computing nodes. The 976 user I/Os in a 1517-ball FCBGA make it well suited to designs that need to break out many parallel interfaces or multiple high-speed serial links.
Design consideration: this 1517-ball FCBGA requires a high-density PCB with microvia stack-up, controlled-impedance routing for transceivers, and a substantial thermal solution (heatsink or forced airflow) for sustained workloads. Quartus II software version 9.0 or later is required for design entry, synthesis, place-and-route, and timing closure on this family.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix III E family, and practical design notes not found in the manufacturer datasheet alone.
Bộ thay thế dễ dàng lắp đặt cho EP3SE260F1517I3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SE260F1517I3 (cùng hình factor và footprint) — khác nhau ở Speed Grade, Package, Family, Operating Temperature, Process Node.
EP3SE260F1517C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517C4LN
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517C4L
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517C4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517C3
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517C2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517C2G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE260F1517I3 Tỷ lệ tối đa & tính chất điện
| Family | Stratix III E |
| Logic Elements | 255,000 |
| Embedded Memory (bits) | 16,672,768 |
| Logic Array Blocks (LABs) | 10,200 |
| Maximum User I/Os | 976 |
| Hộp | 1517-BBGA, FCBGA |
| Kiểu lắp đặt | Surface Mount |
| Operating Temperature Grade | Industrial |
| Junction Temperature Range | -40C to +125C |
| Core Voltage | 1.0 V typical |
| Process Technology | 65 nm CMOS |
| Maximum Core Frequency | 717 MHz |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL |
| Trạng thái RoHS | Compliant |
| Configuration | SRAM-based, volatile (requires external configuration device) |
Hướng dẫn cấu hình chân EP3SE260F1517I3 1517-bbga, fcbga
Cấu hình chân cho EP3SE260F1517I3 (1517-bbga, fcbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SE260F1517I3.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SE260F1517I3 phù hợp cho 7 Áp dụngs: Telecommunications Base Station Processing, High-Definition Video Broadcast Encoding, ASIC Prototyping and Emulation, Medical Imaging Acceleration, Military Signal Intelligence Platforms, High-Performance Computing Acceleration Nodes, Test and Measurement Instrumentation.
Telecommunications Base Station Processing
The EP3SE260F1517I3's 255,000 logic elements and 16.67 Mbit embedded memory make it well suited for baseband processing in 4G/LTE and early-5G base stations. Its 976 user I/Os break out multiple CPRI/OBSAI links, antenna carrier interfaces, and backhaul connections, while the industrial temperature grade handles outdoor cabinet thermal stress. The dedicated DSP blocks accelerate FFT/iFFT and channel coding operations, while MLAB distributed memory handles small packet queues efficiently. Designers typically place this FPGA between RF front-end ADCs/DACs and a host CPU, with transceivers connected through Stratix III E LVDS pairs when full Stratix III GX transceivers are not required.
Được đề xuất
High-Definition Video Broadcast Encoding
The EP3SE260F1517I3's 16.67 Mbit embedded memory is well matched to multi-stream H.264 or MPEG-2 broadcast encoders that buffer multiple HD frames in real time. Its high LAB count and DSP block density allow parallel processing of 8 to 16 video streams at 1080p/60, while the 976 I/Os break out SDI, HDMI receive, and parallel pixel buses simultaneously. The industrial temperature grade enables integration into studio equipment racks and outside-broadcast vehicles. The 65 nm process node keeps dynamic power low enough for sustained real-time encoding, although a thermal solution (heatsink or forced airflow) is required for the 1517-ball FCBGA package.
Được đề xuất
ASIC Prototyping and Emulation
ASIC prototyping platforms leverage the EP3SE260F1517I3's 255K logic elements to map large ASIC RTL blocks with timing accuracy close to silicon. Designers partition ASICs across multiple FPGAs and use the 976 I/Os to interconnect daughter FPGAs on the prototyping board. The 16.67 Mbit embedded memory provides realistic on-chip memory modeling, while the 717 MHz core frequency supports at-speed operation of many ASIC blocks. Quartus II incremental compile flows shorten iteration cycles. Multiple EP3SE260F1517I3 devices on one board typically require careful signal-integrity design on the high-speed interconnect traces due to the 1517-ball FCBGA pin pitch.
Được đề xuất
Medical Imaging Acceleration
The EP3SE260F1517I3's 255K LE and abundant embedded memory are well suited to CT, MRI, and ultrasound image reconstruction accelerators run as coprocessors to a host CPU. The industrial temperature grade supports integration into the controlled-environment medical imaging bays. The DSP blocks execute filtering, back-projection, and beamforming kernels at deterministic real-time latency. The 976 user I/Os break out high-speed data lanes from multiple analog front-end ADCs. Medical OEMs typically pair the EP3SE260F1517I3 with DDR2/DDR3 memory controllers instantiated in the FPGA fabric to manage image frame buffers.
Được đề xuất
Military Signal Intelligence Platforms
Military SIGINT and electronic warfare systems use the EP3SE260F1517I3 for wideband digital receiver processing, channelization, and beamforming in radar and EW front-ends. Its 255K LE and 16.67 Mbit embedded memory implement thousands of parallel FFT channels and matched-filter banks in real time, while the 976 I/Os accept data from multiple high-speed ADC front-ends. The industrial temperature grade meets MIL-STD-810 environmental requirements when properly integrated. Designs typically require ruggedized enclosures, conformal coating, and custom thermal management for the 1517-ball FCBGA package in deployed military hardware.
Được đề xuất
High-Performance Computing Acceleration Nodes
High-performance computing clusters use the EP3SE260F1517I3 as an FPGA-based compute accelerator alongside x86 host processors, accelerating workloads in genomics, financial Monte Carlo simulation, and search algorithms. The 255K LE fabric hosts custom datapaths, while the 16.67 Mbit embedded memory reduces external memory pressure on the most data-reused kernels. Designers connect the FPGA via PCIe Gen2 to the host CPU using soft IP cores. The industrial temperature grade suits densely packed 1U server chassis, and the 976 I/Os break out multiple DDR2/DDR3 memory channels and high-speed host links simultaneously.
Được đề xuất
Test and Measurement Instrumentation
Automated test equipment and high-speed oscilloscopes leverage the EP3SE260F1517I3's 255K LE and 16.67 Mbit memory to implement real-time signal processing, triggering, and protocol decoding. Its 976 I/Os handle parallel acquisition paths from multiple ADCs, while the 717 MHz core fabric supports multi-gigasample processing. The industrial temperature grade handles instrumentation chassis where internal ambient can reach +85C. Designers typically use the FPGA alongside dedicated DAC/ADC front-ends and DDR2/DDR3 memory for deep acquisition buffers, with the exposed 1517-ball FCBGA thermal pad bonded to an internal heatsink.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SE260F1517I3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SE260F1517C4N | EP3SE260F1517C4LN | EP3SE260F1517C4L | EP3SE260F1517C4 | EP3SE260F1517C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same | 1517-BBGA, FCBGA - same |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits | 16,672,768 bits |
| Maximum User I/Os | 976 | 976 | 976 | 976 | 976 | 976 |
| Temperature Grade | Industrial (-40C to +125C junction) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I3 (industrial fast) | C4 (commercial medium) | C4 (commercial medium) | C4 (commercial medium) | C4 (commercial medium) | C3 (commercial slow) |
| Lead-Free / Halogen-Free | Lead-free (standard) | Lead-free (N suffix) | Lead-free (N suffix) | Lead-free | Not specified | Lead-free (N suffix) |
Bảo phân biệt quan trọng
- Highest-density Stratix III E with industrial operating temperature (vsEP3SE110F780I4N)
- Largest I/O count in the Stratix III E family (vsEP3SE260F1152I3N)
- Industrial temp grade in the highest-density Stratix III E (vsEP3SE260F1517C4N)
Ghi chú thiết kế
Estimated: the EP3SE260F1517I3 in a 1517-ball FCBGA package dissipates 10-25W depending on toggle rate and logic utilization. With proper thermal management (thermal pad soldered to inner PCB copper plane plus optional heatsink), junction-to-ambient thermal resistance (theta_JA) is typically 8-12 C/W. For sustained industrial operation at +100C ambient, allocate at least 4 square inches of unbroken inner copper directly under the package thermal pad to keep junction rise below 30C.
The 1517-ball FCBGA requires a high-density PCB stack-up with laser-drilled microvias and 0.4 mm or smaller pitch escape routing. Plan at least a 12-layer PCB with 4 routing layers dedicated to signal break-out from the BGA, 4 dedicated power planes (1.0V core, 2.5V PLL, 3.3V I/O, GND), and 4 ground/shield layers. Use Buried Vias to escape inner rows and back-drilled through-vias on high-speed SERDES traces. Maintain 50 ohm controlled impedance on all I/O pairs and 85/100 ohm differential impedance on LVDS pairs.
Place decoupling capacitors as close as possible to every VCC/GND pair on the package, using a mix of 0402 100nF, 220nF, and 10uF bulk capacitors per Intel's Stratix III board design guidelines. The 1.0V core supply should have bulk decoupling distributed every 2-3 power balls to suppress switching transients. Avoid routing high-speed signals over plane splits; the FPGA package returns current through the nearest GND ball, so maintaining a continuous ground plane under the BGA is essential for signal integrity.
Stratix III FPGAs are SRAM-based and lose their configuration on power-down; an external configuration device (EPCS or standard flash) is mandatory. Plan JTAG access via the 10-pin header for in-system programming and debugging. Do not confuse Stratix III E (logic/memory) with Stratix III GX (logic/memory plus integrated transceivers); pinouts differ significantly. Use Quartus II version 9.0 or later (Quartus Prime 13.0+ supports legacy compilation).
Estimated: based on the Stratix III E family, the EP3SE260F1517I3 typically draws 3-5A on the 1.0V core rail at high toggle rates, plus 1-3A on the 3.3V I/O rail depending on I/O utilization. Use a 4-phase PWM controller with power stages rated for 30A continuous each. Enable Stratix III programmable power technology in Quartus to reduce dynamic power up to 50% versus default settings. Power sequencing must follow Intel's Power-On Reset (POR) timing: ramp 3.3V first, then 2.5V, then 1.0V with monotonic edges.
Thông tin tuân thủ
RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified - FPGAs in this class are not automotive-qualified (use automotive-grade FPGA families such as Cyclone IV GX or later for AEC-Q100). Conflict minerals compliant.
