EP3SE50F484I3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
MPN: EP3SE50F484I3N ✗ Cuối đờiEP3SE50F484I3N Tóm tắt
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LBs), programmable routing, dedicated DSP blocks, and on-chip memory into a single IC that can be reconfigured by the end user. Within the broader semiconductor taxonomy, an FPGA sits below application-specific standard products (ASSPs) and above simple CPLDs in complexity, and belongs to the programmable logic family that complements fixed-function ASICs when time-to-market or post-deployment reconfigurability matter.
Key features of the EP3SE50F484I3N include 1,900 LABs (logic array blocks) arranged across the fabric, integrated transceivers supporting high-speed serial I/O, embedded multipliers for DSP, and the Stratix III E partial-reconfiguration flow. The -I3 speed grade denotes an industrial operating temperature with a specific timing closure bin, and the N suffix indicates lead-free / RoHS-compliant packaging. The 484-BGA package supports high pin density for signal integrity and is paired with a flip-chip substrate that improves thermal dissipation relative to wire-bonded BGA predecessors.
Architecturally, Stratix III E devices use a logic-element based fabric with dedicated carry chains, MLAB memory blocks, M9K/M144K block RAM, and DSP blocks optimized for high-performance signal processing. The Altera Quartus II design suite is the primary toolchain; designers target the device through VHDL, Verilog, or SystemVerilog and validate timing with TimeQuest. Partial reconfiguration is supported for applications that need to swap logic regions while the rest of the device continues operating.
Typical applications include high-performance digital signal processing in wireless baseband cards, ASIC prototyping, wireline telecom line cards, military and aerospace signal conditioning, medical imaging front-ends, and industrial high-speed control. The industrial temperature grade also opens use cases such as factory-floor test instrumentation and outdoor telecom equipment.
When designing with this part, note that Stratix III is a legacy node and is no longer recommended for new designs; users should validate lifecycle status against current Intel FPGA product roadmaps and consider Cyclone V, Arria V, or newer families for new projects.
This page synthesizes distributor pricing, same-family pin-compatible drop-in alternatives, lifecycle context, and Quartus II design considerations not found in any single distributor listing.
Bộ thay thế dễ dàng lắp đặt cho EP3SE50F484I3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SE50F484I3N (cùng hình factor và footprint) — khác nhau ở Package, Embedded Memory, Speed Grade, Family, Mounting Type.
EP3SE50F484I4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE50F484I4N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SE50F484C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE50F484C4LN
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP3SL50F484C2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE50F484I3G
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SE50F484I3N Tỷ lệ tối đa & tính chất điện
| Family | Stratix III E |
| Logic Elements | 47,500 |
| Number of LABs | 1,900 |
| Total Memory Bits | 5,760,000 |
| Maximum User I/O | 296 |
| Core Voltage VCC | 0.9 V |
| Auxiliary Voltage VCCAUX | 1.1 V |
| Process Technology | 65 nm |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | I3 (industrial, bin 3) |
| Nhiệt độ hoạt động | -40C to +100C (industrial) |
| Hộp | 484-pin FC-FBGA (flip-chip BGA) |
| Kiểu lắp đặt | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Method | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
Hướng dẫn cấu hình chân EP3SE50F484I3N 484-pin fc-fbga (flip-chip bga)
Cấu hình chân cho EP3SE50F484I3N (484-pin fc-fbga (flip-chip bga) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SE50F484I3N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SE50F484I3N phù hợp cho 6 Áp dụngs: Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, Wireline Telecom Line Cards, Military and Aerospace Signal Conditioning, Medical Imaging Front-End Processing, Industrial High-Speed Test Instrumentation.
Wireless Baseband Signal Processing
The EP3SE50F484I3N fits mid-density baseband DSP for wireless base stations because of its 47,500 logic elements, embedded 18x18 multipliers, and dedicated DSP blocks, which together implement FIR filters, channelizers, FFTs and crest-factor-reduction (CFR) chains. Operating at up to 500 MHz internal fabric, the device can sustain sample rates required by LTE and 5G NR sub-6 GHz numerologies when paired with external RF front-ends and high-speed serial transceivers. The industrial temperature grade (-40C to +100C) also enables outdoor macro-cell and small-cell deployments that must survive uncontrolled thermal environments.
Được đề xuất
ASIC Prototyping and Emulation
With 47.5K logic elements, 1,900 LABs, and 5.76 Mbit of embedded memory, the EP3SE50F484I3N is widely used to partition and prototype mid-complexity ASIC designs before tape-out, especially for SoC integration and pre-silicon firmware bring-up. Designers map RTL across multiple EP3SE50 devices using Quartus II logic-lock regions, while the 484-pin FC-FBGA package preserves signal integrity at high debug-clock rates. The N suffix confirms lead-free packaging compatible with lead-free reflow profiles used in modern prototype assembly houses.
Được đề xuất
Wireline Telecom Line Cards
The EP3SE50F484I3N supports packet classification, queuing, and traffic shaping on OTN/SONET/SDH and Ethernet line cards, where its 296 user I/Os accept multiple SFP+/QSFP interfaces through SerDes bridging. The 0.9 V core and 1.1 V auxiliary supplies keep the part within NEBS thermal envelopes, while embedded M9K/M144K block RAM holds lookup tables and packet descriptors in-line. Industrial temperature operation matches central-office and outside-plant cabinet requirements.
Được đề xuất
Military and Aerospace Signal Conditioning
Industrial-grade Stratum III E parts like the EP3SE50F484I3N are commonly designed into defense signal-conditioning subsystems that perform digital beamforming, SAR preprocessing, and electronic-countermeasures (ECM) processing at the chassis level. The 500 MHz fabric and embedded multipliers execute parallel DSP pipelines, while the FC-FBGA-484 footprint tolerates thermal cycling and vibration profiles typical of airborne and shipboard deployments. NRND status must be paired with a long-term supply agreement before mission-critical deployment.
Được đề xuất
Medical Imaging Front-End Processing
In ultrasound beamformers, CT, and MRI front-ends, the EP3SE50F484I3N performs channelization, beam steering, and image reconstruction in real time by exploiting its 5.76 Mbit embedded memory for sample buffering and its DSP blocks for low-latency convolution. The 296 user I/Os aggregate ADC channels, while 0.9 V core voltage simplifies thermal management in tightly packaged medical cart and bedside enclosures. Industrial temperature support extends the device to imaging carts deployed in field hospitals.
Được đề xuất
Industrial High-Speed Test Instrumentation
Factory-floor automated test equipment (ATE) and protocol analyzers use the EP3SE50F484I3N to implement parallel stimulus generation, DUT response capture, and protocol decoding at hundreds of MHz. The device's 1,900 LABs and dedicated carry chains accelerate counters and timing-margin measurements, while its 5.76 Mbit of block RAM holds deep capture buffers. Industrial -40C to +100C operation enables test fixtures used in environmental-chamber characterization.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SE50F484I3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SE50F484I4 | EP3SE50F484I4N | EP3SE50F484C4N | EP3SE50F484C4LN | EP3SL50F484C2N | EP3SE50F484I3G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin FC-FBGA | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| LABs | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | I3 | I4 (faster) | I4 (faster) | C4 (commercial, faster) | C4 (commercial, faster) | C2 (commercial, slower) | I3 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Bảo phân biệt quan trọng
- Industrial temperature grade at faster I3 speed bin (vsEP3SE50F484C4N)
- Enhanced-memory E fabric vs low-power L fabric (vsEP3SL50F484C2N)
- Lead-free RoHS-compliant packaging (vsEP3SE50F484I3 (without N suffix))
Ghi chú thiết kế
Stratix III E devices require both 0.9 V VCC and 1.1 V VCCAUX supplies; the VCCPD for I/O banks must match the I/O standard voltage (typically 2.5 V or 3.3 V) and must power up before or simultaneously with VCC to avoid I/O latch-up. Designers should use the Altera PowerPlay Early Power Estimator (EPE) inside Quartus II to size rails before committing to PCB layout, and decouple each supply pin with 0.1 uF + 10 uF capacitor pairs placed as close to the BGA balls as the breakout routing allows.
The 484-pin FC-FBGA uses a 1.0 mm ball pitch. Recommended PCB stack-up is an 8-layer or 10-layer board with microvia-in-pad construction for the BGA fan-out; without microvias, routing every signal out of the inner rows is impractical. Match the BGA pad diameter to the manufacturer's land pattern (typically non-solder-mask-defined pads with ENIG or OSP finish) and follow JEDEC JESD-B1A for reflow profile.
Estimated: at full fabric utilization (90% LE, 80% DSP, 80% BRAM, 500 MHz toggling) and a 1.0 m/s airflow, the EP3SE50 dissipates roughly 4-6 W. With the FC-FBGA484 theta_JA around 14 C/W (4-layer JEDEC test board, no airflow), junction temperature rise above ambient would be approximately 56-84 C - well within the 100 C industrial junction limit when ambient is at most 25 C, but designers in enclosed chassis should add thermal vias under the die and a heatsink to maintain margin.
Do not confuse the EP3SE50F484I3N (Stratix III E) with the EP3SL50F484C2N (Stratix III L, low-power); both share the 484-pin FC-FBGA footprint but have different DSP block counts and transceiver availability, and dropping the L variant into an E design can leave DSP paths unbound. Also note that Stratix III E support in Quartus II was deprecated after version 13.0sp1 - new code should target Cyclone V or newer families to receive ongoing toolchain updates.
Thông tin tuân thủ
Lead-free / RoHS compliant per N suffix in MPN. Not AEC-Q100 qualified (FPGA, not automotive-grade part). Conflict-mineral compliance per Intel's supplier declaration program.
