EP3SE50F484I3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
부품 번호: EP3SE50F484I3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1275.25 | $1,275.25 |
| 10 | $1147.72 | $11,477.20 |
| 100 | $1020.2 | $102,020.00 |
| 500 | $918.18 | $459,090.00 |
| 1,000 | $841.66 | $841,660.00 |
EP3SE50F484I3N 개요
A field-programmable gate array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LBs), programmable routing, dedicated DSP blocks, and on-chip memory into a single IC that can be reconfigured by the end user. Within the broader semiconductor taxonomy, an FPGA sits below application-specific standard products (ASSPs) and above simple CPLDs in complexity, and belongs to the programmable logic family that complements fixed-function ASICs when time-to-market or post-deployment reconfigurability matter.
Key features of the EP3SE50F484I3N include 1,900 LABs (logic array blocks) arranged across the fabric, integrated transceivers supporting high-speed serial I/O, embedded multipliers for DSP, and the Stratix III E partial-reconfiguration flow. The -I3 speed grade denotes an industrial operating temperature with a specific timing closure bin, and the N suffix indicates lead-free / RoHS-compliant packaging. The 484-BGA package supports high pin density for signal integrity and is paired with a flip-chip substrate that improves thermal dissipation relative to wire-bonded BGA predecessors.
Architecturally, Stratix III E devices use a logic-element based fabric with dedicated carry chains, MLAB memory blocks, M9K/M144K block RAM, and DSP blocks optimized for high-performance signal processing. The Altera Quartus II design suite is the primary toolchain; designers target the device through VHDL, Verilog, or SystemVerilog and validate timing with TimeQuest. Partial reconfiguration is supported for applications that need to swap logic regions while the rest of the device continues operating.
Typical applications include high-performance digital signal processing in wireless baseband cards, ASIC prototyping, wireline telecom line cards, military and aerospace signal conditioning, medical imaging front-ends, and industrial high-speed control. The industrial temperature grade also opens use cases such as factory-floor test instrumentation and outdoor telecom equipment.
When designing with this part, note that Stratix III is a legacy node and is no longer recommended for new designs; users should validate lifecycle status against current Intel FPGA product roadmaps and consider Cyclone V, Arria V, or newer families for new projects.
This page synthesizes distributor pricing, same-family pin-compatible drop-in alternatives, lifecycle context, and Quartus II design considerations not found in any single distributor listing.
드롭인 대체품: EP3SE50F484I3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SE50F484I3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Embedded Memory, Speed Grade, Family, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SE50F484I4
✅ 드롭인✓ 재고 있음
$730 / 개
데이터시트 보기 →EP3SE50F484I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$998 / 개
데이터시트 보기 →EP3SE50F484C4N
✅ 드롭인✓ 재고 있음
$468.11 / 개
데이터시트 보기 →EP3SE50F484C4LN
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$772.12 / 개
데이터시트 보기 →EP3SL50F484C2N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP3SE50F484I3G
✅ 드롭인✓ 재고 있음
$1180 / 개
데이터시트 보기 →EP3SE50F484I3N 최대 정격 & 전기적 특성
| Family | Stratix III E |
| Logic Elements | 47,500 |
| Number of LABs | 1,900 |
| Total Memory Bits | 5,760,000 |
| Maximum User I/O | 296 |
| Core Voltage VCC | 0.9 V |
| Auxiliary Voltage VCCAUX | 1.1 V |
| Process Technology | 65 nm |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | I3 (industrial, bin 3) |
| 동작 온도 | -40C to +100C (industrial) |
| 패키지 | 484-pin FC-FBGA (flip-chip BGA) |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (N suffix) |
| Configuration Method | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
EP3SE50F484I3N 484-pin fc-fbga (flip-chip bga) 핀 구성 가이드
EP3SE50F484I3N(484-pin fc-fbga (flip-chip bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SE50F484I3N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SE50F484I3N 적합 용도: 6 애플리케이션s: Wireless Baseband Signal Processing, ASIC Prototyping and Emulation, Wireline Telecom Line Cards, Military and Aerospace Signal Conditioning, Medical Imaging Front-End Processing, Industrial High-Speed Test Instrumentation.
Wireless Baseband Signal Processing
The EP3SE50F484I3N fits mid-density baseband DSP for wireless base stations because of its 47,500 logic elements, embedded 18x18 multipliers, and dedicated DSP blocks, which together implement FIR filters, channelizers, FFTs and crest-factor-reduction (CFR) chains. Operating at up to 500 MHz internal fabric, the device can sustain sample rates required by LTE and 5G NR sub-6 GHz numerologies when paired with external RF front-ends and high-speed serial transceivers. The industrial temperature grade (-40C to +100C) also enables outdoor macro-cell and small-cell deployments that must survive uncontrolled thermal environments.
추천
ASIC Prototyping and Emulation
With 47.5K logic elements, 1,900 LABs, and 5.76 Mbit of embedded memory, the EP3SE50F484I3N is widely used to partition and prototype mid-complexity ASIC designs before tape-out, especially for SoC integration and pre-silicon firmware bring-up. Designers map RTL across multiple EP3SE50 devices using Quartus II logic-lock regions, while the 484-pin FC-FBGA package preserves signal integrity at high debug-clock rates. The N suffix confirms lead-free packaging compatible with lead-free reflow profiles used in modern prototype assembly houses.
추천
Wireline Telecom Line Cards
The EP3SE50F484I3N supports packet classification, queuing, and traffic shaping on OTN/SONET/SDH and Ethernet line cards, where its 296 user I/Os accept multiple SFP+/QSFP interfaces through SerDes bridging. The 0.9 V core and 1.1 V auxiliary supplies keep the part within NEBS thermal envelopes, while embedded M9K/M144K block RAM holds lookup tables and packet descriptors in-line. Industrial temperature operation matches central-office and outside-plant cabinet requirements.
추천
Military and Aerospace Signal Conditioning
Industrial-grade Stratum III E parts like the EP3SE50F484I3N are commonly designed into defense signal-conditioning subsystems that perform digital beamforming, SAR preprocessing, and electronic-countermeasures (ECM) processing at the chassis level. The 500 MHz fabric and embedded multipliers execute parallel DSP pipelines, while the FC-FBGA-484 footprint tolerates thermal cycling and vibration profiles typical of airborne and shipboard deployments. NRND status must be paired with a long-term supply agreement before mission-critical deployment.
추천
Medical Imaging Front-End Processing
In ultrasound beamformers, CT, and MRI front-ends, the EP3SE50F484I3N performs channelization, beam steering, and image reconstruction in real time by exploiting its 5.76 Mbit embedded memory for sample buffering and its DSP blocks for low-latency convolution. The 296 user I/Os aggregate ADC channels, while 0.9 V core voltage simplifies thermal management in tightly packaged medical cart and bedside enclosures. Industrial temperature support extends the device to imaging carts deployed in field hospitals.
추천
Industrial High-Speed Test Instrumentation
Factory-floor automated test equipment (ATE) and protocol analyzers use the EP3SE50F484I3N to implement parallel stimulus generation, DUT response capture, and protocol decoding at hundreds of MHz. The device's 1,900 LABs and dedicated carry chains accelerate counters and timing-margin measurements, while its 5.76 Mbit of block RAM holds deep capture buffers. Industrial -40C to +100C operation enables test fixtures used in environmental-chamber characterization.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SE50F484I3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SE50F484I4 | EP3SE50F484I4N | EP3SE50F484C4N | EP3SE50F484C4LN | EP3SL50F484C2N | EP3SE50F484I3G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin FC-FBGA | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same | 484-pin FC-FBGA - same |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| LABs | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 | 1,900 |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | I3 | I4 (faster) | I4 (faster) | C4 (commercial, faster) | C4 (commercial, faster) | C2 (commercial, slower) | I3 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Industrial temperature grade at faster I3 speed bin (vs EP3SE50F484C4N)
- Enhanced-memory E fabric vs low-power L fabric (vs EP3SL50F484C2N)
- Lead-free RoHS-compliant packaging (vs EP3SE50F484I3 (without N suffix))
설계 노트
Stratix III E devices require both 0.9 V VCC and 1.1 V VCCAUX supplies; the VCCPD for I/O banks must match the I/O standard voltage (typically 2.5 V or 3.3 V) and must power up before or simultaneously with VCC to avoid I/O latch-up. Designers should use the Altera PowerPlay Early Power Estimator (EPE) inside Quartus II to size rails before committing to PCB layout, and decouple each supply pin with 0.1 uF + 10 uF capacitor pairs placed as close to the BGA balls as the breakout routing allows.
The 484-pin FC-FBGA uses a 1.0 mm ball pitch. Recommended PCB stack-up is an 8-layer or 10-layer board with microvia-in-pad construction for the BGA fan-out; without microvias, routing every signal out of the inner rows is impractical. Match the BGA pad diameter to the manufacturer's land pattern (typically non-solder-mask-defined pads with ENIG or OSP finish) and follow JEDEC JESD-B1A for reflow profile.
Estimated: at full fabric utilization (90% LE, 80% DSP, 80% BRAM, 500 MHz toggling) and a 1.0 m/s airflow, the EP3SE50 dissipates roughly 4-6 W. With the FC-FBGA484 theta_JA around 14 C/W (4-layer JEDEC test board, no airflow), junction temperature rise above ambient would be approximately 56-84 C - well within the 100 C industrial junction limit when ambient is at most 25 C, but designers in enclosed chassis should add thermal vias under the die and a heatsink to maintain margin.
Do not confuse the EP3SE50F484I3N (Stratix III E) with the EP3SL50F484C2N (Stratix III L, low-power); both share the 484-pin FC-FBGA footprint but have different DSP block counts and transceiver availability, and dropping the L variant into an E design can leave DSP paths unbound. Also note that Stratix III E support in Quartus II was deprecated after version 13.0sp1 - new code should target Cyclone V or newer families to receive ongoing toolchain updates.
규정 준수 정보
Lead-free / RoHS compliant per N suffix in MPN. Not AEC-Q100 qualified (FPGA, not automotive-grade part). Conflict-mineral compliance per Intel's supplier declaration program.
