Altera

EP3SL340F1760I4LN - 337500-Cell Stratix III L FPGA, FCBGA-1760

MPN: EP3SL340F1760I4LN ✓ Hoạt động

0.9 V Vdss 1760-BBGA, FCBGA Package 375 MHz Speed 18,822,144 Memory

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MOQ: 1 |

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EP3SL340F1760I4LN Tóm tắt

The Intel (Altera) EP3SL340F1760I4LN is a high-density, low-power Stratix III L Field-Programmable Gate Array (FPGA) delivering 337,500 logic elements in a 1760-ball Flip-Chip BGA package. It operates at a core voltage of 0.9 V on a 65 nm CMOS process, with a maximum operating frequency of 375 MHz and I/O count of 1120 user pins. The device is qualified to the industrial temperature range and ships in a 1760-BBGA FC-FBGA package with lead-free finish.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, memory, and hardened IP blocks that can be re-programmed to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy below application-specific standard products (ASSPs) and above discrete logic ICs, and they are widely used for high-throughput parallel processing, hardware acceleration, and rapid prototyping. The Stratix III family specifically targets high-performance DSP, memory-rich, and transceiver-based designs.

Key features include 337,500 logic elements, 13,500 Logic Array Blocks (LABs), 18,822,144 bits of embedded memory, 1120 user I/O pins, and an integrated Adaptive Logic Module (ALM) architecture. The "L" designation indicates the lower-power variant of Stratix III with reduced static power versus the base EP3S family. The package exposes a flip-chip BGA land pattern with 1760 balls across the substrate, requiring careful PCB design with controlled-impedance routing and BGA breakout fan-out.

Architecturally, the EP3SL340F1760I4LN combines 9-input fracturable ALMs with M9K/M144K memory blocks, variable-precision DSP blocks (up to 18x18 multipliers), and PLL-based clock management. The high logic and memory ratio makes it particularly suited to memory-mapped processing pipelines and large buffer-based DSP functions, where on-chip storage reduces external memory bandwidth bottlenecks.

Typical applications include high-end telecommunications line cards, software-defined radio (SDR) baseband processing, video broadcast infrastructure, ASIC prototyping, and high-throughput image processing. The combination of 18 Mbits of embedded memory and 1120 I/O pins allows direct interfacing with DDR2/DDR3 SDRAM, QDRII SRAM, and parallel ADC/DAC devices commonly used in these designs.

When designing with this part, ensure the PCB uses microvia stack-ups compatible with 1.0 mm pitch BGA escape routing, and provide sufficient decoupling per Altera's Stratix III pin connection guidelines. The I4LN suffix indicates the industrial temperature grade (-40C to +100C), 1760-ball FCBGA package, and lead-free / Pb-free finish compliant with modern environmental directives.

This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalogue, and practical design notes not found in the manufacturer datasheet alone.

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Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SL340F1760I4LN (cùng hình factor và footprint) — khác nhau ở Speed Grade, Embedded Memory Bits, Process Technology, RoHS Status, Package.

EP3SL340F1760C4LN

Intel

Speed Grade: C4

Embedded Memory Bits: 18,821,144 bit

Process Technology: 65 nm