EP3SL70F780C3N - Stratix III L FPGA, 67.5K LE, 780-FBGA | Intel
MPN: EP3SL70F780C3N ✓ Hoạt độngEP3SL70F780C3N Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable semiconductor that falls within the broader category of programmable logic devices (PLDs), which are themselves a subset of digital integrated circuits. Modern FPGAs integrate configurable logic blocks, programmable interconnect, embedded memory, dedicated DSP blocks, and increasingly high-speed transceivers into a single silicon die. Stratix III L devices extend the Stratix III family with lower static power while preserving the high-performance fabric, making them well-suited to ASIC prototyping, wire-speed packet processing, and high-throughput digital signal processing.
Key features of the EP3SL70F780C3N include 67,500 logic elements implemented as adaptive logic modules, 2.699 Mbits of embedded SRAM organized in TriMatrix blocks, 488 18x18 hardware multipliers for DSP, programmable I/O supporting multiple single-ended and differential standards, and up to 12 integrated transceiver channels depending on configuration. The 780-FBGA package exposes eight I/O banks with high pin density, enabling large parallel interfaces and high-speed memory connectivity without external bridges.
The 65 nm Stratix III architecture uses programmable power technology that lets unused blocks enter low-power states, dramatically reducing static consumption versus Stratix II. The EP3SL70F780C3N targets applications where total power budget and performance density must coexist, such as 40G/100G telecom line cards, broadcast video processing, and ASIC emulation. It is supported by the Quartus II design software and verified through Altera's reference design flow.
Typical applications for this device include high-end ASIC prototyping, telecom line-card processing, high-performance DSP pipelines, broadcast video infrastructure, and military/aerospace signal processing. Its combination of logic density, embedded multipliers, and TriMatrix memory makes it ideal for any design requiring parallel arithmetic alongside flexible I/O.
When designing with the EP3SL70F780C3N, ensure that the PCB has matched-length impedance-controlled routing for high-speed I/O and a multi-layer power plane stack for the 0.9 V core and 1.1 V auxiliary supplies. Thermal management should include copper pours under the 780-ball array, and JTAG/AS configuration must be planned early since re-spinning the board for configuration mode is costly.
This page synthesizes distributor pricing, drop-in alternative MPNs from the same Stratix III family, and practical design notes not found on the manufacturer product page, giving procurement and engineering teams a single reference for sourcing the EP3SL70F780C3N.
Bộ thay thế dễ dàng lắp đặt cho EP3SL70F780C3N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SL70F780C3N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Process Technology, Operating Temperature, Package Type.
EP3SL70F780C2N
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Xem tài liệu →EP3SL70F780C3G
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Xem tài liệu →EP3SL70F780C4N
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Xem tài liệu →EP3SL70F780C3
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Xem tài liệu →EP3SL50F780C3N
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Xem tài liệu →EP3SE80F780C3N
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Xem tài liệu →EP3SL70F780C3N Tỷ lệ tối đa & tính chất điện
| Series | Stratix III L |
| Logic Elements | 67,500 |
| Adaptive Logic Modules (ALMs) | 33,750 |
| Embedded Memory Bits | 2,699,264 bits (2.699 Mbit) |
| Embedded Multipliers (18x18) | 488 |
| Maximum Operating Frequency | 717 MHz |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Number of I/O Banks | 8 |
| Số lượng chân | 780 |
| Package Type | 780-ball FC-FBGA (29x29 mm) |
| Khoảng nhiệt độ hoạt động | Commercial (0C to +85C) |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Compliant (lead-free FBGA) |
| Cấp MSL | 3 (per JEDEC J-STD-020) |
Hướng dẫn cấu hình chân EP3SL70F780C3N 780-ball fc-fbga (29x29 mm)
Cấu hình chân cho EP3SL70F780C3N (780-ball fc-fbga (29x29 mm) gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SL70F780C3N.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SL70F780C3N phù hợp cho 6 Áp dụngs: ASIC Prototyping and Emulation, Telecom Line-Card Processing, High-Performance DSP Pipelines, Broadcast Video Infrastructure, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
ASIC Prototyping and Emulation
The EP3SL70F780C3N is well-suited to ASIC prototyping and emulation because its 67,500 logic elements, 2.699 Mbits of TriMatrix embedded memory, and 488 18x18 multipliers allow large SoC designs to be partitioned into a single FPGA with abundant headroom. The 780-FBGA package exposes eight I/O banks, which makes it easy to map wide ASIC buses and external memory interfaces directly without external bridges. Engineers targeting ASIC emulation typically use the Stratix III L variant (the L stands for low static power) so that multi-FPGA partitions stay within thermal envelope during long regression runs. Quartus II provides design-partitioning flows optimized for this density class. Practical note: confirm the 1.1 V core and 0.9 V auxiliary supplies have clean planes, since emulation jobs run continuously and any rail noise shows up as intermittent mismatches.
Được đề xuất
Telecom Line-Card Processing
The EP3SL70F780C3N fits telecom line-card processing where 40G/100G packet pipelines require parallel arithmetic and large on-chip buffering. Its 488 hardware 18x18 multipliers support wide FFT, FEC, and traffic-shaping DSP blocks at wire speed, while the 2.699 Mbits of TriMatrix memory serve as packet queues and lookup tables without forcing external SRAM access. The 780-FBGA package provides high I/O count for SFI/Interlaken-style interfaces and backplane connections, with eight banks supporting multiple voltage-referenced I/O standards. The Stratix III L family's lower static power helps line cards meet NEBS thermal budgets. Engineers should use Quartus II's TimeQuest timing analyzer to close multi-cycle paths and ensure proper clock domain crossing between packet and fabric clocks.
Được đề xuất
High-Performance DSP Pipelines
The EP3SL70F780C3N enables high-performance DSP pipelines that combine FIR filters, FFTs, and matrix arithmetic in a single chip. The 488 dedicated 18x18 multipliers accelerate MAC operations at up to 717 MHz, allowing radar, beamforming, and digital predistortion designs to scale without external DSP clusters. The 2.699 Mbits of embedded memory provide coefficient storage and intermediate buffering, which removes external memory round-trips from critical loops. With the 780-FBGA package and eight I/O banks, designers can interface directly to high-speed ADC/DAC devices via LVDS. The L variant's lower static power makes it suitable for fan-cooled chassis where heat density would otherwise throttle a higher-power Stratix III E part.
Được đề xuất
Broadcast Video Infrastructure
The EP3SL70F780C3N serves broadcast video infrastructure where multi-channel SD/HD/3G-SDI processing, color-space conversion, and frame buffering must coexist on one device. The 780-FBGA package exposes enough LVDS pairs to handle multiple parallel SDI streams, while the 2.699 Mbits of embedded memory act as line and frame buffers without external DDR. The 488 hardware multipliers accelerate scaling, deinterlacing, and chroma keying math. The Stratix III L low-power advantage reduces cooling cost in dense video router chassis. Reference designs from Intel/Altera for SDI and DisplayPort provide tested IP cores that shorten development cycles.
Được đề xuất
Military and Aerospace Signal Processing
The EP3SL70F780C3N supports military and aerospace signal processing applications including electronic warfare, software-defined radio, and sensor fusion, provided the part is qualified per program-specific requirements. Its 67,500 logic elements and 488 multipliers handle wideband digital down-conversion, polyphase filtering, and beamforming at sample rates well above 200 MSPS. The 780-FBGA package's eight I/O banks accept LVDS and LVTTL from high-speed ADCs and DACs directly. The Stratix III L lower static power simplifies thermal design in sealed, conduction-cooled chassis. Note: for true military temperature grade (-55C to +125C), consider the EP3SL70F484I3N industrial variant or screen per program needs.
Được đề xuất
Test and Measurement Instrumentation
The EP3SL70F780C3N fits high-end test and measurement instruments where real-time signal analysis, deep memory capture, and fast pattern generation run concurrently. The 2.699 Mbits of embedded memory store captured waveforms and reference patterns at the FPGA's clock rate, while the 488 18x18 multipliers accelerate FFT and correlation kernels. The 780-FBGA package supports high-speed parallel ADC and DAC interfaces through its eight I/O banks. The Stratix III L family's lower static power keeps chassis temperatures manageable in compact bench-top instruments. Engineers can leverage Altera's reference DSP Builder flow to convert MATLAB models into hardware blocks directly.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SL70F780C3N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SL70F780C2N | EP3SL70F780C4N | EP3SL50F780C3N | EP3SE80F780C3N |
|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA (F780, 29x29 mm) | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same | 780-ball FC-FBGA (F780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III L (low power) | Stratix III L | Stratix III L | Stratix III L | Stratix III E (enhanced) |
| Logic Elements | 67,500 | 67,500 | 67,500 | 50,000 | 80,000 |
| Embedded Memory | 2.699 Mbit | 2.699 Mbit | 2.699 Mbit | 2.057 Mbit | 3.026 Mbit |
| 18x18 Multipliers | 488 | 488 | 488 | 384 | 616 |
| Speed Grade | C3 (commercial) | C2 (slower) | C4 (faster) | C3 (same) | C3 (same) |
| Process | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
Bảo phân biệt quan trọng
- Stratix III L (low static power) variant of the 780-FBGA family (vsEP3SE80F780C3N)
- Higher logic density than the EP3SL50F780C3N (vsEP3SL50F780C3N)
- Same footprint across C2, C3, and C4 speed grades (vsEP3SL70F780C2N)
Ghi chú thiết kế
The 780-ball FC-FBGA package requires via-in-pad (VIP) PCB fabrication with 0.4 mm pitch escape and at least 4-6 routing layers. Use a 1-2-1 or 1-2-1-2-1 stackup with continuous reference planes under the BGA; signal layers must reference the correct VCCIO or GND plane for the assigned I/O bank. Failure to maintain plane reference results in severe signal-integrity loss on LVDS and DDR interfaces.
Plan a multi-rail power distribution network delivering 1.1 V (VCC), 0.9 V (VCCP), 1.8 V/2.5 V/3.0 V (VCCIO per bank), and 1.0 V (VCCPGM). Use a sequencing controller such as the LTC2923 or EP53A8 to enforce the Intel-specified power-up order. Estimated total current at 717 MHz with 50% toggle rate is around 2.5 A on VCC plus bank-dependent VCCIO current; verify with the Stratix III PowerPlay early estimator in Quartus II before final PCB design.
Estimated: at full 717 MHz utilization with VCC = 1.1 V drawing 2.5 A, the 780-FBGA package dissipates roughly 2.75 W static plus dynamic power, often exceeding 5 W total. The package thermal resistance is around 11 C/W with a 4-layer JEDEC JESD51 test board, so attach a heatsink or thermal interface material for high-utilization designs. Do not rely on natural convection alone in sealed enclosures.
Do not confuse the EP3SL70F780C3N (Stratix III L, low power) with the EP3SE80F780C3N (Stratix III E, enhanced) - both share the same F780 footprint but differ in logic density and static power. Quartus II projects targeting one variant will not bitstream the other. Also verify configuration mode (AS, PS, JTAG, FPP) is selected early, since this drives the board-level passive network around MSEL[3..0].
Assign I/O banks deliberately to avoid mixing incompatible voltage-referenced standards on a single bank. Match lengths within +/- 50 mil for DDR/源-synchronous interfaces and use Intel's differential I/O kit (LVDS, LVPECL, mini-LVDS) with 100 ohm differential routing. Decoupling: 0.1 uF X7R beneath the BGA plus 10 uF bulk per power rail at the PCB edge - follow Stratix III device family pin connection guidelines for exact ball assignments.
Thông tin tuân thủ
Stratix III L family is lead-free and RoHS-compliant per distributor product pages (DigiKey). AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC. Operating temperature range is commercial (0C to +85C) per verified datasheet snippet.
