EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel
MPN: EP3SL70F780I3 ⚠ Lần mua cuốiEP3SL70F780I3 Tóm tắt
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard-IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit in the wider taxonomy as programmable logic devices under the umbrella of digital logic ICs, between ASICs (fixed function, high NRE) and microcontrollers (software-defined, lower throughput). Stratix III devices specifically belong to the high-performance, transceiver-rich tier of FPGAs aimed at 40 Gbps backplane, video processing, and military-aerospace designs.
Key features of the EP3SL70F780I3 include 488 user I/O pins supporting multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI Express), dedicated on-chip memory blocks totaling approximately 2.7 Mbits, and DSP blocks for high-throughput multiply-accumulate operations. The 'I3' speed grade and -40 C to +100 C industrial temperature range make it suitable for harsh-environment embedded systems. It also supports configuration via JTAG (IEEE Std 1149.1) and passive/active serial modes.
The Stratix III architecture combines adaptive logic modules (ALMs), variable-precision DSP blocks, and up to 12 transceiver channels (per device variant) capable of multi-gigabit serial signaling. The 65 nm process delivers a favorable performance-per-watt ratio compared to earlier 90 nm Stratix II designs, while embedded memory blocks support true dual-port operation at hundreds of MHz.
Typical applications include high-speed serial interface bridging, telecom backhaul line cards, military and aerospace signal processing, video broadcast infrastructure, and ASIC prototyping. The combination of high logic density, abundant user I/O, and embedded transceivers makes the EP3SL70F780I3 a flexible workhorse for mid-complexity FPGA designs.
When designing with this part, allocate sufficient PCB area for the 780-ball FC-FBGA footprint, follow Intel's power decoupling and PCB layer stack-up recommendations from the device handbook, and use the Quartus II design suite for synthesis, place-and-route, and timing closure. Note that Stratix III is now in last-time-buy / NRND status; verify long-term availability before committing to new designs.
Bộ thay thế dễ dàng lắp đặt cho EP3SL70F780I3 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP3SL70F780I3 (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, RoHS Status, Process Technology, Operating Temperature.
EP3SL70F780I4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SL70F780I4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SL70F780C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SL70F780C4LN
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SL70F780C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SL70F780C2N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP3SL70F780I3 Tỷ lệ tối đa & tính chất điện
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Embedded Memory Bits | 2,699,264 bits |
| Maximum User I/O | 488 |
| Nhiệt độ hoạt động | -40 C to +100 C (Industrial) |
| Speed Grade | I3 (industrial) |
| Core Voltage | 1.1 V |
| Process Node | 65 nm |
| Hộp | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | BGA780,28X28,40 |
| Kiểu lắp đặt | Surface Mount |
| Configuration Mode | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | 780 |
| Supplier Device Package | 780-BBGA, FCBGA |
Hướng dẫn cấu hình chân EP3SL70F780I3 780-bbga, fcbga
Cấu hình chân cho EP3SL70F780I3 (780-bbga, fcbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP3SL70F780I3.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP3SL70F780I3 phù hợp cho 6 Áp dụngs: Telecom Backhaul Line Card, Military & Aerospace Signal Processing, Video Broadcast Infrastructure, ASIC Prototyping, Industrial Automation Controller, Test & Measurement Instrumentation.
Telecom Backhaul Line Card
The EP3SL70F780I3's 67,500 logic elements and 2.7 Mbits of embedded memory make it a strong fit for telecom backhaul line cards that need high-throughput packet processing, QoS scheduling, and SERDES bridging between framer ICs and network processors. Its 488 user I/O pins easily handle parallel data buses plus LVDS sidebands, while the industrial -40C to +100C range supports outdoor cabinet deployments. Compared to ASIC alternatives the FPGA offers reprogrammable logic for protocol updates such as OTN or CPRI without respin.
Được đề xuất
Military & Aerospace Signal Processing
The EP3SL70F780I3 in industrial temperature grade I3 is qualified for military and aerospace signal-processing applications such as radar front-end digitization, electronic warfare subsystems, and secure communications. Its 65 nm low-power process, embedded DSP blocks, and large I/O count support multi-channel ADC interfacing and real-time FFT pipelines. The 780-ball FC-FBGA package withstands shock and vibration when properly underfilled, and the Stratix III family has a long heritage in defense programs.
Được đề xuất
Video Broadcast Infrastructure
Broadcast video routers, multi-viewers, and SDI-to-IP gateways benefit from the EP3SL70F780I3's abundant logic and 488 user I/O for bridging HDMI/SDI/DisplayPort interfaces with on-board video processing. The 2.7 Mbits of embedded memory buffer line-rate video streams, while DSP blocks accelerate chroma upsampling and scaling operations. Industrial temperature rating allows chassis mounted in air-conditioned but warm equipment rooms, and Quartus II IP libraries provide ready-made SDI/HDMI reference designs.
Được đề xuất
ASIC Prototyping
Engineers prototyping ASIC designs of moderate complexity (roughly 60-100K ASIC gates) use the EP3SL70F780I3 to validate RTL, run real-world software stacks, and benchmark performance before taping out. The 67.5K logic elements and 2.7 Mbits of block RAM map comfortably to many mid-complexity SoCs, and Quartus II's TimeQuest timing analyzer provides ASIC-quality static timing reports. Industrial temperature and high I/O count also let prototypes run in target environments with real peripherals.
Được đề xuất
Industrial Automation Controller
Industrial automation controllers using the EP3SL70F780I3 benefit from 488 user I/O to interface with parallel sensor arrays, motor-control peripherals, and multi-axis servo loops simultaneously. The industrial -40C to +100C temperature range supports factory-floor cabinets and outdoor installations, while the 1.1 V core and 65 nm process keep power consumption manageable for fanless enclosures. Embedded DSP blocks accelerate PID and field-oriented control math for high-performance motion control.
Được đề xuất
Test & Measurement Instrumentation
The EP3SL70F780I3 doubles as a flexible processing engine inside high-end test and measurement equipment such as protocol analyzers, BERT testers, and oscilloscope acquisition back-ends. Its 488 user I/O accommodate parallel ADC/DAC interfaces and trigger fan-out, while 2.7 Mbits of block RAM capture deep snapshots at high sample rates. Quartus II IP for PCIe, JTAG, and memory controllers simplifies instrument host integration, and the industrial temperature range ensures stable performance in lab environments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP3SL70F780I3 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP3SL70F780I4N | EP3SL70F780C4N | EP3SL70F780I4 | EP3SL70F780C4LN | EP3SL70F780C3N | EP3SL70F780C2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) | Intel (same) |
| Package | 780-ball FineLine BGA (FC-FBGA), 28x28 mm | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 | 67,500 |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 | 2,699,264 |
| Max User I/O | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | I3 (industrial) | I4 (faster industrial) | C4 (commercial) | I4 (faster industrial) | C4 (commercial) | C3 (commercial) | C2 (commercial) |
| Operating Temperature | -40 C to +100 C (Industrial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Process Node | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
Bảo phân biệt quan trọng
- Mid-density Stratix III L with industrial temperature and I3 speed grade (vsEP3SL70F780C2N)
- Higher speed grade option for tighter timing margins (vsEP3SL70F780I3)
- Identical 67.5K LE architecture as other 780-FBGA Stratix III L parts (vsEP3SL50F780I3)
Ghi chú thiết kế
The 780-ball FC-FBGA package uses a 1.0 mm ball pitch on a 28x28 mm substrate, which demands a 4- to 8-layer PCB with microvia or via-in-pad construction for breakout. Follow Intel's Stratix III board design guidelines for power plane stitching, controlled-impedance routing for high-speed transceivers, and matched-length skew control on DDR2/DDR3 interfaces. A solid ground reference plane beneath the BGA is essential to suppress simultaneous switching noise (SSN) on the 488 I/O pins.
Estimated: at full utilization of 67,500 LEs switching at 100 MHz with the I3 speed grade, core power is typically 3-5 W, well within the FC-FBGA's thermal envelope when paired with moderate airflow. Compute thermal loading using the Quartus II PowerPlay early power estimator before PCB fabrication, and add a heatsink or thermal interface material if junction temperature approaches 100 C in your enclosure. Industrial-temperature designs must derate properly across the full -40 C to +100 C range.
Configuration mode selection is a frequent source of board bring-up issues: confirm the MSEL pins are tied to the correct mode for your configuration scheme (AS, PS, JTAG, or FPP). The JTAG chain must observe IEEE 1149.1 TCK/TMS/TDO/TDI pull-up and pull-down values per datasheet. Ensure the nCONFIG, nSTATUS, and CONF_DONE pins have the recommended pull-ups and decoupling. Finally, verify that your Quartus II version supports the EP3SL70F780 device ID before synthesis.
Thông tin tuân thủ
Stratix III devices are industrial-grade FPGAs not subject to AEC-Q100 automotive qualification. RoHS/REACH/lead-free status was not present in the verified web data and is marked unknown; confirm via the official Intel material declaration before PCB assembly.
