Intel

EP4SGX360KF43I4N - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel

MPN: EP4SGX360KF43I4N ✗ Cuối đời

0.9 V Vdss 1760-BBGA, FCBGA (KF43) Package 4 (fastest) Speed 23,105,536 Memory

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EP4SGX360KF43I4N Tóm tắt

The Intel (formerly Altera) EP4SGX360KF43I4N is a high-density, high-performance Stratix IV GX Field Programmable Gate Array (FPGA) with 353,600 logic elements, 880 user I/Os, and 23,105,536 bits of embedded memory, packaged in a 1760-ball FineLine BGA (FCBGA) and built on a 40nm low-power process node. The 'I4' speed/temperature grade indicates an industrial-grade -40C to +100C operating range with the fastest speed bin in the Stratix IV GX family. The device integrates up to 24 transceivers at data rates up to 8.5 Gbps, enabling high-bandwidth serial connectivity for protocols such as PCIe Gen2, XAUI, CEI-6G, Serial RapidIO, and CPRI. With 14,144 Logic Array Blocks (LABs) and dedicated DSP blocks, the EP4SGX360KF43I4N targets throughput-intensive digital signal processing, hardware-accelerated compute, and high-speed I/O bridging.

A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture is dominated by a regular array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, DSP slices, and PLLs. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose CPUs/GPUs (software-defined, sequential) and ASICs (fixed-function, lowest per-unit cost at volume). Compared to microcontrollers, FPGAs deliver massive parallelism and deterministic latency. Compared to ASICs, they offer post-fabrication reconfigurability and faster time-to-market. The Stratix IV family specifically targets high-end ASIC prototyping, high-speed serial I/O aggregation, and DSP acceleration in communications, defense, and high-performance computing infrastructure.

Key features of the EP4SGX360KF43I4N include 24 high-speed transceivers (up to 8.5 Gbps), 4 hard PCIe Gen2 x8 cores, on-chip memory bandwidth exceeding 10 Tbps, an adaptive logic module (ALM) architecture that delivers 50% higher performance per logic element versus prior generations, and dedicated 18x18 multipliers for DSP. The device also embeds transceivers that support backplane and chip-to-chip serial links at rates used in 40G/100G aggregation systems. Hard intellectual property (PCIe, memory controllers, variable-precision DSP blocks) reduces soft-logic resource usage and lowers system power.

Architecturally, the EP4SGX360KF43I4N combines a fine-grained ALM fabric (8-input fracturable look-up tables), embedded SRAM organized as M9K/M144K blocks, and a multi-tier routing hierarchy. The 40nm process provides a balanced trade-off between leakage, dynamic power, and performance. Designers typically use the Quartus Prime design suite to synthesize, place-and-route, and configure the device via JTAG or passive serial configuration. Power estimation is done with the Quartus PowerPlay analyzer; thermal analysis must account for the 1760-BGA FCBGA thermal resistance.

Typical applications include ASIC prototyping and emulation, high-frequency trading (HFT) acceleration, radar and digital array signal processing, 40G/100G Ethernet line card aggregation, software-defined radio (SDR), test and measurement instrumentation, and high-performance compute (HPC) hardware acceleration. Its combination of transceiver density and large logic capacity makes it a popular emulator vehicle for SoC and processor IP validation.

When designing with the EP4SGX360KF43I4N, the 1760-ball FCBGA requires a multi-layer PCB with buried vias, microvia stack-ups, and a controlled-impedance layer stack. Power delivery must include high-frequency decoupling at every transceiver power pin and bulk capacitance sized by the Quartus PDN tool. Thermal management typically requires a heatsink or cold-plate attachment due to the high static power of a fully utilized 360K-LE Stratix IV GX device.

This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix IV GX family, and practical PCB/thermal design notes not consolidated in the manufacturer datasheet.

Bộ thay thế dễ dàng lắp đặt cho EP4SGX360KF43I4N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.

Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP4SGX360KF43I4N (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Speed Grade, Embedded Memory, Operating Temperature.

EP4SGX360KF43C2

Intel

Package: 1760-BBGA, FCBGA (Fine-Pitch Chip-Scale BGA)