Intel

EP4SGX360KF43I4N - Stratix IV GX FPGA, 353K LE, 1760-BGA | Intel

부품 번호: EP4SGX360KF43I4N ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

0.9 V Vdss 1760-BBGA, FCBGA (KF43) Package 4 (fastest) Speed 23,105,536 Memory

시작가 $3215 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-10

볼륨 가격

수량	단가	합계
1	$4250	$4,250.00
5	$3995	$19,975.00
10	$3780	$37,800.00
25	$3525	$88,125.00
100	$3215	$321,500.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP4SGX360KF43I4N 개요

The Intel (formerly Altera) EP4SGX360KF43I4N is a high-density, high-performance Stratix IV GX Field Programmable Gate Array (FPGA) with 353,600 logic elements, 880 user I/Os, and 23,105,536 bits of embedded memory, packaged in a 1760-ball FineLine BGA (FCBGA) and built on a 40nm low-power process node. The 'I4' speed/temperature grade indicates an industrial-grade -40C to +100C operating range with the fastest speed bin in the Stratix IV GX family. The device integrates up to 24 transceivers at data rates up to 8.5 Gbps, enabling high-bandwidth serial connectivity for protocols such as PCIe Gen2, XAUI, CEI-6G, Serial RapidIO, and CPRI. With 14,144 Logic Array Blocks (LABs) and dedicated DSP blocks, the EP4SGX360KF43I4N targets throughput-intensive digital signal processing, hardware-accelerated compute, and high-speed I/O bridging.

A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture is dominated by a regular array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, DSP slices, and PLLs. FPGAs occupy a unique tier in the semiconductor hierarchy between general-purpose CPUs/GPUs (software-defined, sequential) and ASICs (fixed-function, lowest per-unit cost at volume). Compared to microcontrollers, FPGAs deliver massive parallelism and deterministic latency. Compared to ASICs, they offer post-fabrication reconfigurability and faster time-to-market. The Stratix IV family specifically targets high-end ASIC prototyping, high-speed serial I/O aggregation, and DSP acceleration in communications, defense, and high-performance computing infrastructure.

Key features of the EP4SGX360KF43I4N include 24 high-speed transceivers (up to 8.5 Gbps), 4 hard PCIe Gen2 x8 cores, on-chip memory bandwidth exceeding 10 Tbps, an adaptive logic module (ALM) architecture that delivers 50% higher performance per logic element versus prior generations, and dedicated 18x18 multipliers for DSP. The device also embeds transceivers that support backplane and chip-to-chip serial links at rates used in 40G/100G aggregation systems. Hard intellectual property (PCIe, memory controllers, variable-precision DSP blocks) reduces soft-logic resource usage and lowers system power.

Architecturally, the EP4SGX360KF43I4N combines a fine-grained ALM fabric (8-input fracturable look-up tables), embedded SRAM organized as M9K/M144K blocks, and a multi-tier routing hierarchy. The 40nm process provides a balanced trade-off between leakage, dynamic power, and performance. Designers typically use the Quartus Prime design suite to synthesize, place-and-route, and configure the device via JTAG or passive serial configuration. Power estimation is done with the Quartus PowerPlay analyzer; thermal analysis must account for the 1760-BGA FCBGA thermal resistance.

Typical applications include ASIC prototyping and emulation, high-frequency trading (HFT) acceleration, radar and digital array signal processing, 40G/100G Ethernet line card aggregation, software-defined radio (SDR), test and measurement instrumentation, and high-performance compute (HPC) hardware acceleration. Its combination of transceiver density and large logic capacity makes it a popular emulator vehicle for SoC and processor IP validation.

When designing with the EP4SGX360KF43I4N, the 1760-ball FCBGA requires a multi-layer PCB with buried vias, microvia stack-ups, and a controlled-impedance layer stack. Power delivery must include high-frequency decoupling at every transceiver power pin and bulk capacitance sized by the Quartus PDN tool. Thermal management typically requires a heatsink or cold-plate attachment due to the high static power of a fully utilized 360K-LE Stratix IV GX device.

This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix IV GX family, and practical PCB/thermal design notes not consolidated in the manufacturer datasheet.

드롭인 대체품: EP4SGX360KF43I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4SGX360KF43I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Embedded Memory, Operating Temperature.

EP4SGX360KF43C2

Intel

Package: 1760-BBGA, FCBGA (Fine-Pitch Chip-Scale BGA)

비교 대상: EP4SGX360KF43I4N →

EP4SGX360KF43C3N

Intel

Package: 1760-ball FCBGA/BGA

Process Technology: CMOS

Embedded Memory: 23105536 bits

비교 대상: EP4SGX360KF43I4N →

EP4SGX360KF43C4

Altera

Package: 1760-ball FC-BGA (FCFBGA)

Speed Grade: C4 (commercial, standard performance tier)

Operating Temperature: 0C to +85C (commercial)

비교 대상: EP4SGX360KF43I4N →

EP4SGX360KF43C4N

Intel

Package: 1760-ball FCBGA (KF43)

Embedded Memory: 23,105,536 bits (approximately 23.1 Mbit)

비교 대상: EP4SGX360KF43I4N →

EP4SGX360KF43I3

Altera

Package: 1760-BBGA, FCBGA (FC-FBGA)

비교 대상: EP4SGX360KF43I4N →

EP4SGX360KF43I3N

Intel

Package: 1760-ball FCBGA (FBGA-1760)

Speed Grade: 3

Embedded Memory: 22.55 Mbits

✅ 드롭인

Intel

📦 1760-BBGA, FCBGA (KF43)

Field Programmable Gate Array (FPGA) · Stratix IV GX · 353600 · 141440 CLBs · 880 I/O · 23105536 bits · 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit · 600 MHz

✓ 재고 있음

가격 문의

데이터시트 보기 →

EP4SGX360KF43I4N 최대 정격 & 전기적 특성

Family	Stratix IV GX
Series	EP4SGX360
Logic Elements (LE)	353,600
Logic Array Blocks (LABs)	14,144
User I/Os	880
Embedded Memory (bits)	23,105,536
Total Transceivers	24
Max Transceiver Data Rate	8.5 Gbps
Process Technology	40 nm
Core Voltage	0.9 V
패키지	1760-BBGA, FCBGA (KF43)
실장 유형	Surface Mount
동작 온도	-40C to +100C (Industrial, 'I' grade)
Speed Grade	4 (fastest)
RoHS 상태	Compliant

EP4SGX360KF43I4N 1760-bbga, fcbga (kf43) 핀 구성 가이드

EP4SGX360KF43I4N(1760-bbga, fcbga (kf43) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP4SGX360KF43I4N의 1760-bbga, fcbga (kf43) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP4SGX360KF43I4N.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP4SGX360KF43I4N 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, High-Speed Serial Aggregation (40G/100G Line Cards), Radar and Digital Array Signal Processing, Software-Defined Radio (SDR) Baseband, Test & Measurement Instrumentation, High-Performance Compute (HPC) Acceleration.

🖥️

ASIC Prototyping and Emulation

The EP4SGX360KF43I4N's 353,600 logic elements, 23.1 Mbit embedded memory, and 24 high-speed transceivers (up to 8.5 Gbps) make it a leading vehicle for ASIC and SoC prototyping in the Stratix IV family. With its industrial temperature grade and fastest speed bin, it supports timing closure for sub-100 MHz core clocks while partitioning a multi-million-gate ASIC across multiple FPGAs via the high-speed transceivers. Pair with Quartus II design suite for synthesis, place-and-route, and incremental compilation.

추천

🌐

High-Speed Serial Aggregation (40G/100G Line Cards)

The EP4SGX360KF43I4N integrates 24 transceivers at up to 8.5 Gbps, supporting CEI-6G, XAUI, PCIe Gen2 x8, Serial RapidIO, and CPRI aggregation. In a 40G or 100G line-card design, multiple Stratix IV GX devices can deserialize and re-multiplex 6.25 Gbps or 10.3125 Gbps optical lanes into the device's rich ALM fabric for protocol processing, MAC/PCS implementation, or traffic management. The KF43 package exposes enough transceiver pins to fan out a full duplex 100G path.

추천

EP4SGX360HF35I4N · Intel EP4SGX230KF40I3N · Intel EP4SGX180KF40I3N · Intel

✈️

Radar and Digital Array Signal Processing

Stratix IV GX devices are widely deployed in phased-array radar baseband processing because the 18x18 dedicated multipliers and rich ALM fabric deliver the GFLOPs needed for FFT, beamforming, and pulse compression. The EP4SGX360KF43I4N provides more than 1,000 DSP blocks (estimated from 360K-LE density) operating at up to 600 MHz, sufficient for real-time processing of multi-channel radar I/Q data. Industrial temperature grade ensures operation in outdoor or military enclosures.

추천

EP4SGX360FH29I4N · Intel EP4SGX360FF35I4N · Intel

📡

Software-Defined Radio (SDR) Baseband

The combination of high logic density and DSP blocks makes the EP4SGX360KF43I4N a frequent choice for SDR baseband processing in tactical radio, cellular base-station, and test-and-measurement systems. Its transceivers digitize IF signals at rates up to 8.5 Gbps while the ALM fabric runs polyphase channelizers, DDC/DUC chains, and protocol stacks. The Quartus II DSP Builder accelerates model-based development of complex DSP pipelines directly from MATLAB/Simulink.

추천

EP4SGX290NF45I4N · Intel EP4S40G2F40I2NAB · Intel

🔧

Test & Measurement Instrumentation

The EP4SGX360KF43I4N serves as the processing heart of high-end oscilloscopes, protocol analyzers, and bit-error-rate testers (BERT) because its 8.5 Gbps transceivers can capture and analyze multi-gigabit signals in real time. The 880 user I/Os support wide LVDS buses and high-speed parallel ADC/DAC interfaces, while the industrial temperature grade allows deployment in production-floor test equipment. Pattern generation, protocol decoding, and signal integrity algorithms map efficiently onto the ALM fabric.

추천

EP4CGX75DF27I8N · Intel EP4CGX150DF31I7N · Intel

🖥️

High-Performance Compute (HPC) Acceleration

Before the GPU compute era took over, Stratix IV GX devices were widely used as co-processors for low-latency trading, financial Monte Carlo simulation, genomics sequence alignment, and seismic processing. The EP4SGX360KF43I4N provides enough logic and DSP resources to accelerate custom algorithms at line-rate, and its 8.5 Gbps transceivers enable direct FPGA-to-FPGA links for multi-device HPC clusters. Industrial temperature grade supports deployment in data centers with elevated inlet temperatures.

추천

EP4SGX360HF35I4N · Intel EP4SE530H35C4N · Intel

추천 제품 요약

EP4SGX290NF45I4N Intel 사용처: ASIC Prototyping and Emulation, Software-Defined Radio (SDR) Baseband EP4SE820F43C3G Altera 사용처: ASIC Prototyping and Emulation EP4SGX230KF40I4N Intel 사용처: ASIC Prototyping and Emulation EP4SGX360HF35I4N Intel 사용처: High-Speed Serial Aggregation (40G/100G Line Cards), High-Performance Compute (HPC) Acceleration EP4SGX230KF40I3N Intel 사용처: High-Speed Serial Aggregation (40G/100G Line Cards) EP4SGX180KF40I3N Intel 사용처: High-Speed Serial Aggregation (40G/100G Line Cards) EP4SGX360FH29I4N Intel 사용처: Radar and Digital Array Signal Processing EP4SGX360FF35I4N Intel 사용처: Radar and Digital Array Signal Processing EP4S40G2F40I2NAB Intel 사용처: Software-Defined Radio (SDR) Baseband EP4CGX75DF27I8N Intel 사용처: Test & Measurement Instrumentation EP4CGX150DF31I7N Intel 사용처: Test & Measurement Instrumentation EP4SE530H35C4N Intel 사용처: High-Performance Compute (HPC) Acceleration

What is the EP4SGX360KF43I4N FPGA?

The EP4SGX360KF43I4N is an Intel Stratix IV GX FPGA with 353,600 logic elements, 880 user I/Os, 23,105,536 bits of embedded memory, and 24 high-speed transceivers up to 8.5 Gbps, packaged in a 1760-ball FCBGA. According to the Stratix IV device handbook, it is the highest-density member of the Stratix IV GX family, designed for ASIC prototyping, high-speed serial aggregation, and DSP acceleration.

What is the difference between EP4SGX360KF43I4N and EP4SGX360KF43I3N?

The two parts share the same KF43 1760-ball FCBGA package, the same 353,600 logic elements, and the same 24 transceiver count. The difference is the speed grade: the I4N is speed grade 4 (fastest), while the I3N is speed grade 3 (slower timing closure). Both share the industrial -40C to +100C temperature range. They are drop-in compatible on the same PCB footprint with up to 20% timing margin difference at -1 speed grade.

Where can I buy EP4SGX360KF43I4N online?

The EP4SGX360KF43I4N is available from authorized distributors including DigiKey, Mouser, and listed on Octopart (16-20 distributors per Octopart index, as of 2026-09-10). Because the part is in NRND (Not Recommended for New Designs) status, distributor stock is limited and lead times for bulk quantities may exceed 12 weeks. Quotation is recommended for production volumes.

What is the price of EP4SGX360KF43I4N?

As of 2026-09-10, the EP4SGX360KF43I4N lists at approximately $4,250 USD at qty-1 from major distributors; volume pricing breaks at $3,215 USD per unit at qty 100. Because the part is in NRND status and limited inventory remains, prices have trended upward 20-30% versus the 2024 baseline. Octopart lists the live part for cross-distributor comparison.

Is EP4SGX360KF43I4N in stock and what is the lead time?

Stock for EP4SGX360KF43I4N varies by distributor; small quantities (1-10) are commonly available but bulk volumes above 100 units typically require lead times of 12-24 weeks as the device is NRND. Authorized distributors may accept last-time-buy orders; consult your distributor for an accurate forecast on the production date.

How does EP4SGX360KF43I4N compare to EP4SGX290NF45I4N for ASIC prototyping?

Both belong to the Stratix IV family and share a similar ALM-based fabric, but the EP4SGX360KF43I4N offers 353,600 logic elements versus approximately 290,000 for the EP4SGX290NF45I4N (22% more LE). The KF43 1760-ball FCBGA package supports 24 transceivers; the NF45 package typically supports fewer. For very large ASIC emulation with multi-million-gate designs, the EP4SGX360 is the higher-capacity option.

When should I choose EP4SGX360KF43I4N over the Stratix V 5SGXEA7?

Choose the EP4SGX360KF43I4N when your design fits within 353,600 logic elements, you only need up to 8.5 Gbps transceivers, and you have existing Quartus II timing-closure collateral for Stratix IV. Choose the Stratix V 5SGXEA7 (28 nm) when you need up to 14.1 Gbps transceivers, higher logic density (~622K LE), better power efficiency, and longer lifecycle support. Migration requires re-synthesis against the Stratix V timing model and may change pin-out assignments.

What is the best drop-in replacement for EP4SGX360KF43I4N?

The best drop-in replacements within the Stratix IV GX family are EP4SGX360KF43I3N and EP4SGX360KF43I3 (same KF43 1760-ball FCBGA footprint, identical 353,600 logic elements, speed grade 3 instead of 4 - approximately 15-20% slower timing closure). For a higher-capacity upgrade on the same package family, the Stratix V 5SGXEA7HFI35C2G is recommended but requires PCB re-layout because the HFI35 package has a different ball pattern.

Where to download EP4SGX360KF43I4N datasheet PDF?

The official Stratix IV device handbook is available at intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/stratix-iv/stratix4_handbook.pdf. This 1100+ page handbook covers electrical characteristics, timing models, package drawings, and configuration for all Stratix IV GX members including the EP4SGX360KF43I4N. The pin-out file for the KF43 package is published as a separate CSV in the Quartus II pin-out archive.

Where to find EP4SGX360KF43I4N pinout?

The EP4SGX360KF43I4N pinout for the KF43 1760-ball FCBGA is published in the Quartus II pin-out file archive (altera.com, now intel.com) as a CSV mapping each ball coordinate to its bank and function. Per-bank VCCO, GND, and transceiver power pins are listed in the Stratix IV GX pin connection guidelines. The Intel FPGA technical support portal hosts the most current pinout revision.

Is EP4SGX360KF43I4N the same as EP4SGX360KF40I4N?

No - the EP4SGX360KF43I4N uses the KF43 1760-ball FCBGA package, while the EP4SGX360KF40I4N uses the KF40 1152-ball FCBGA. Both share 353,600 logic elements and 24 transceivers, but the KF43 offers more user I/Os (880 vs approximately 720) and more transceiver pins than the KF40. The two parts are NOT pin-compatible.

What are the key specifications of EP4SGX360KF43I4N that engineers should know?

The EP4SGX360KF43I4N features 353,600 logic elements, 14,144 LABs, 880 user I/Os, 23,105,536 bits of embedded memory, 24 transceivers at up to 8.5 Gbps, 4 hard PCIe Gen2 cores, 18x18 multipliers in DSP blocks, a 40nm process, 0.9 V core supply, and an industrial -40C to +100C temperature range with speed grade 4. These parameters define the design envelope for ASIC prototyping, high-speed serial aggregation, and DSP-acceleration workloads.

What is the best Intel/Altera equivalent for the Stratix IV GX EP4SGX360KF43I4N in production today?

For an in-production Intel FPGA equivalent of the EP4SGX360KF43I4N, the Stratix 10 SX 1SX280HN3F43E2VG or the Agilex 7 AGF027R25A3E2V are recommended modern replacements with significantly higher logic density and lower power. Both are 28 nm and 7 nm Intel process nodes respectively, support transceivers up to 28 Gbps and 116 Gbps, and are actively in production. Migration requires full re-synthesis and a new PCB because the package ball patterns differ.

What is the lifecycle status of EP4SGX360KF43I4N in 2026?

The EP4SGX360KF43I4N is in NRND (Not Recommended for New Designs) status as of 2026-09-10. NRND means the part is still in production and shippable, but Intel is steering new designs toward the Stratix 10 and Agilex families. Last-time-buy notices for Stratix IV devices have not yet been issued as of late 2026, but customers with long production programs should plan a migration or last-time-buy strategy.

엔지니어링 참조 데이터: EP4SGX360KF43I4N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP4SGX360KF43I4N when you need the highest-density Stratix IV GX FPGA (353,600 logic elements), the fastest timing closure (speed grade 4), and industrial -40C to +100C temperature operation. It is the preferred part for ASIC emulation, multi-channel radar, and high-frequency trading acceleration. If timing margin allows a 15-20% reduction, choose the EP4SGX360KF43I3N for better availability and lower cost. If commercial temperature range (0C to +85C) is acceptable, choose the EP4SGX360KF43C4N. For new designs in 2026, consider migrating to the Stratix 10 SX or Agilex 7 family instead of using this NRND part, unless existing Stratix IV design collateral is the priority.

대체품과의 비교

파라미터	이 제품	EP4SGX360KF43I4	EP4SGX360KF43I3N	EP4SGX360KF43I3	EP4SGX360KF43C4N	EP4SGX360KF43C4	EP4SGX360KF43C3N
Package	1760-BBGA, FCBGA (KF43)	1760-BBGA, FCBGA (KF43) - same	1760-BBGA, FCBGA (KF43) - same	1760-BBGA, FCBGA (KF43) - same	1760-BBGA, FCBGA (KF43) - same	1760-BBGA, FCBGA (KF43) - same	1760-BBGA, FCBGA (KF43) - same
Brand	Intel (formerly Altera)	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	353,600	353,600	353,600	353,600	353,600	353,600	353,600
Speed Grade	4 (fastest)	4	3 (slower)	3 (slower)	4	4	3 (slower)
Operating Temperature	-40C to +100C (Industrial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)	-40C to +100C (Industrial)	0C to +85C (Commercial)	0C to +85C (Commercial)	0C to +85C (Commercial)
User I/Os	880	880	880	880	880	880	880
Transceivers	24 up to 8.5 Gbps	24 up to 8.5 Gbps	24 up to 8.5 Gbps	24 up to 8.5 Gbps	24 up to 8.5 Gbps	24 up to 8.5 Gbps	24 up to 8.5 Gbps
Packaging (N suffix)	Tape and Reel (N suffix)	Tray (no N suffix)	Tape and Reel (N suffix)	Tray (no N suffix)	Tape and Reel (N suffix)	Tray (no N suffix)	Tape and Reel (N suffix)

주요 차별점

Fastest speed grade (4) within the Stratix IV GX family (vs EP4SGX360KF43I3N (speed grade 3))
Industrial temperature grade (-40C to +100C) (vs EP4SGX360KF43C4N (commercial 0C to +85C))
Highest user-I/O count in Stratix IV GX (880) (vs EP4SGX360HF35I4N (HF35 1152-ball BGA, fewer transceiver balls))

설계 노트

The 1760-ball FCBGA (KF43) has a 1.0 mm ball pitch, which requires a multi-layer PCB with microvia (laser-drilled) stack-ups on the top one or two layers and buried vias for inner-layer fan-out. Signal integrity for the 8.5 Gbps transceivers demands a controlled-impedance layer stack with 85 ohm differential for transceivers and 50 ohm single-ended for general-purpose I/O. Use the Stratix IV pin connection guidelines and Intel-provided IBIS models to verify signal integrity pre-layout.

Power delivery for the EP4SGX360KF43I4N requires separate rails for VCC (core, 0.9 V), VCCAUX (2.5 V), VCCIO (per bank, 1.2 V-3.3 V), VCCR/VCTT (transceiver analog supplies), and VCCPGM (configuration). Use the Quartus II PowerPlay early power estimator to size bulk capacitance, then refine with the PowerPlay Power Analyzer post place-and-route. High-frequency decoupling (0.1 uF + 1 uF + 10 uF ceramic per bank) must be placed within 100 mils of each power pin.

A fully utilized 360K-LE Stratix IV GX device can dissipate 15-25 W under worst-case workload, requiring careful thermal management of the KF43 1760-ball FCBGA package. Use the Stratix IV thermal resistance (theta_JC) value from the device handbook and size a heatsink or cold-plate accordingly. Estimated junction-to-ambient thermal resistance is 12-18 C/W depending on PCB copper area and airflow; a thermal interface material (TIM) with conductivity >3 W/m-K is recommended between the package lid and heatsink.

Transceiver channels on the EP4SGX360KF43I4N support rates up to 8.5 Gbps and require matched impedance, length-matched differential pairs (skew <5 mil for >6 Gbps), and AC-coupling capacitors (0.1 uF X7R) on each transmit pair. Reference clock jitter must be below 1 ps RMS for 8.5 Gbps operation. Use the Stratix IV transceiver user guide and the Altera/Intel Transceiver Toolkit for pre-compliance eye-diagram and jitter measurements.

Do not mix 2.5 V and 3.3 V LVCMOS signaling on adjacent I/O banks without careful VCCIO planning - banks share a VCCIO rail. Strapping pins (MSEL[3:0], nIO_PULLUP) must be set via external resistors per the Stratix IV configuration user guide, and the configuration mode (AS, PS, JTAG, FPPx8) must be selected correctly before power-up. Programming files generated for one speed grade (e.g. I3) cannot be used on a different speed grade (I4) without recompilation.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

RoHS compliant per Intel product page. The 'N' suffix indicates Pb-free tape-and-reel packaging. AEC-Q100 not applicable for FPGAs - the part is rated to industrial -40C to +100C but is not AEC-Q100 qualified.

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Distributor, Distributor, Distributor, Octopart, Manufacturer Datasheet